INFRARED IMAGING DEVICE HAVING A SHUTTER

• US 20150319378A1
• Filed: 06/23/2015
• Published: 11/05/2015
• Est. Priority Date: 06/10/2011
• Status: Active Grant

• Current Assignee: Teledyne FLIR LLC (Teledyne Technologies Incorporated)
• Original Assignee: FLIR Systems, Inc. (Teledyne Technologies Incorporated)
• Inventors: Hoelter, Theodore R., Kostrzewa, Joseph, Boulanger, Pierre, Sharp, Barbara, Kurth, Eric A., Hgasten, Nicholas, Strandemar, Katrin
• Granted Patent: US 10,389,953 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H04N 17/002 for television cameras
• CPC Class Codes: H04N 2101/00 Still video cameras
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 25/531 by controlling rolling shutters in CMOS SSIS
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

A shutter assembly may be provided for an infrared imaging module to selectively block external infrared radiation from reaching infrared sensors of the infrared imaging module. For example, the shutter assembly may comprise a paddle situated external to an optical element (e.g., lens) and adapted to be selectively moved by an actuator to substantially block external infrared radiation from entering the optical element. The shutter assembly may be stacked relative to a housing of the infrared imaging module without excessively increasing the overall profile of the infrared imaging module. A substantially reflective low emissivity interior surface may be provided on the paddle to reflect infrared radiation originating from an infrared sensor assembly of the infrared imaging module back to the infrared sensor assembly.

Claims

1. A system comprising:

an infrared imaging module comprising;

an infrared sensor assembly having infrared sensors and adapted to capture image frames; and

a shutter assembly comprising;

a paddle adapted to selectively block external infrared radiation from reaching the infrared sensors, and

an actuator adapted to selectively move the paddle in response to a control signal to block external infrared radiation from reaching the infrared sensors.

2. The system of claim 1, wherein:

the infrared imaging module further comprises an optical element adapted to pass infrared radiation through to the infrared sensors;

the paddle is disposed external to the optical element and adapted to selectively block external infrared radiation from reaching the optical element; and

the paddle comprises a substantially reflective surface adapted to reflect infrared radiation originating from the infrared sensor assembly back to the infrared sensor assembly while the paddle is in a closed position to calibrate the infrared sensors.

3. The system of claim 1, wherein the infrared imaging module further comprises a temperature sensor adapted to detect a temperature associated with the paddle.

4. The system of claim 3, wherein the temperature sensor is provided in or on the paddle.

5. The system of claim 4, wherein the shutter assembly comprises an electrical wire disposed on the paddle and electrically connected to the temperature sensor.

6. The system of claim 4, wherein the paddle is a molded interconnect device (MID) and comprises a conductive trace formed on a surface of the paddle and electrically connected to the temperature sensor.

7. The system of claim 4, wherein:

the paddle is made from a silicon substrate and comprises;

at least one surface that is doped to decrease transmissivity of infrared radiation therethrough, and

an electrical wire fabricated using a semiconductor fabrication process and electrically connected to the temperature sensor; and

the temperature sensor is a semiconductor device fabricated on the paddle.

8. The system of claim 1, wherein:

the infrared imaging module further comprises a housing at least substantially enclosing the infrared sensor assembly; and

the shutter assembly comprises a body carrying the paddle.

9. The system of claim 8, wherein:

the housing is a molded interconnect device (MID) having a conductive trace on an interior and/or exterior surface of the housing; and

the conductive trace is adapted to transmit the control signal to the actuator.

10. The system of claim 9, wherein the shutter assembly body comprises an electrical pad adapted to interface with the conductive trace on the housing.

11. The system of claim 8, wherein the infrared imaging module further comprises:

a temperature sensor disposed on an interior surface of the housing;

a thermal conductor adapted to thermally couple at least a portion of the shutter assembly body and at least a portion of the housing so as to communicate thermal energy between the shutter assembly body and the temperature sensor; and

a processor configured to generate a combined image comprising;

a radiometric component of at least one of the infrared image frames encoded into a chrominance component of the combined image, and

luminance and/or chrominance component of at least one non-thermal image encoded into a luminance component of the combined image.

12. The system of claim 8, wherein the infrared imaging module further comprises a temperature sensor disposed in or on the shutter assembly body and adapted to detect a temperature associated with the paddle.

13. The system of claim 8, wherein:

the infrared imaging device further comprises a lens barrel coupled to and at least partially within the housing;

the lens barrel substantially encloses an optical element adapted to pass infrared radiation through to the infrared sensors;

the shutter assembly body comprises a recess shaped to receive at least a portion of the lens barrel and/or the housing; and

the shutter assembly body is stacked relative to the housing by receiving at least a portion of the housing and/or the lens barrel in the recess.

14. A method comprising:

selectively moving a paddle to block external infrared radiation from reaching infrared sensors of an infrared sensor assembly;

capturing, using the infrared sensor assembly, image frames of infrared radiation;

wherein the paddle is selectively moved by an actuator in response to a control signal;

wherein the paddle and the actuator are part of a shutter assembly; and

wherein the shutter assembly and the infrared sensor assembly are part of an infrared imaging module.

15. The method of claim 14, further comprising:

prior to the capturing, reflecting infrared radiation originating from the infrared sensor assembly back to the infrared sensor assembly by a substantially reflective surface of the paddle while the paddle is in a closed position, wherein the captured infrared radiation is the reflected infrared radiation; and

calibrating the infrared sensors using the captured infrared radiation.

16. The method of claim 14, further comprising detecting a temperature associated with the paddle using a temperature sensor of the infrared imaging module.

17. The method of claim 16, wherein the temperature sensor is provided in or on the paddle to detect the temperature.

18. The method of claim 17, wherein the detecting the temperature comprises transmitting an electrical signal indicative of the temperature via an electrical wire disposed on the paddle and electrically connected to the temperature sensor.

19. The method of claim 17, wherein:

the paddle is a molded interconnect device (MID); and

the detecting the temperature comprises transmitting an electrical signal indicative of the temperature via a conductive trace formed on a surface of the paddle and electrically connected to the temperature sensor.

20. The method of claim 17, wherein:

the paddle is made from a silicon substrate and comprises at least one surface that is doped to decrease transmissivity of infrared radiation therethrough;

the temperature sensor is a semiconductor device fabricated on the paddle; and

the detecting the temperature comprises transmitting an electrical signal indicative of the temperature via an electrical wire fabricated on the paddle using a semiconductor fabrication process and electrically connected to the temperature sensor.

21. The method of claim 14, wherein:

the infrared sensor assembly is substantially enclosed within a housing of the infrared imaging module;

the housing is a molded interconnect device (MID) having a conductive trace on an interior and/or exterior surface of the housing; and

the method further comprises transmitting the control signal to the actuator via the conductive trace.

22. The method of claim 21, wherein:

the shutter assembly comprises;

a body carrying the actuator, and

an electrical pad disposed on the body and electrically connected to the conductive trace; and

the transmitting the control signal comprises transmitting the control signal via the electrical pad.

23. The method of claim 14, wherein:

the infrared sensor assembly is substantially enclosed within a housing of the infrared imaging module;

the shutter assembly comprises a body carrying the paddle; and

the method further comprises;

transferring, via a thermal conductor thermally coupling at least a portion of the shutter assembly body and at least a portion of the housing, thermal energy between the shutter assembly body and the housing,

detecting a temperature associated with the paddle using a temperature sensor disposed on an interior surface of the housing, and

generating a combined image comprising;

a radiometric component of at least one of the infrared image frames encoded into a chrominance component of the combined image, and

a luminance and/or chrominance component of at least one non-thermal image encoded into a luminance component of the combined image.

24. The method of claim 14, wherein the shutter assembly comprises a body carrying the paddle, the method further comprising detecting a temperature associated with the paddle using a temperature sensor disposed in or on the shutter assembly body.