APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT
1 Assignment
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Accused Products
Abstract
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
15 Citations
53 Claims
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1-33. -33. (canceled)
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34. A process for removing solder from a surface of at least one printed wire board (PWB) and/or at least one casing, said method comprising:
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inserting the PWB(s) and/or casing(s) into a drum; contacting the surface of the PWB(s) and/or casing(s) with a first composition to effect chemical removal of solder from the PWB(s) and/or casing(s); rinsing the PWB(s) and/or casing(s) in a rinsing module; and drying the PWB(s) and/or casing(s) in a drying module. - View Dependent Claims (35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 52)
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51. The process of 49, wherein the heating module comprises means for moving the PWB(s) through a heating mechanism and agitation means for removing the casing(s) and/or at least one component from the PWB(s) once the solder is softened.
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53. An apparatus for removing solder from a surface of at least one printed wire board (PWB) and/or at least one casing, said apparatus comprising:
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a chemical solder remover comprising a drum; a rinsing module; and a drying module.
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Specification