MODIFIED PHENOLIC RESINS AND METHODS OF MAKING AND USING THE SAME AS REINFORCING RESINS

• US 20150322193A1
• Filed: 05/12/2015
• Published: 11/12/2015
• Est. Priority Date: 05/12/2014
• Status: Active Grant

• Current Assignee: SI Group Incorporated
• Original Assignee: SI Group Incorporated
• Inventors: Banach, Timothy Edward, Whitney, John Morgan, Lamb, James J.
• Granted Patent: US 9,765,174 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C08G 8/28 Chemically modified polycondensates
• CPC Class Codes: C08L 15/00 Compositions of rubber derivatives C08L11/00, C08L13/00 take precedence

Abstract

This invention relates to processes for preparing novolak resins and using the same as reinforcing resins. One process comprises reacting one or more alkylphenols with an aldehyde in the presence of a base to form a resole resin, wherein for each mole of alkylphenol at least 1.5 moles of aldehyde are reacted; and reacting the resole resin with one or more phenolic compounds in the presence of an acidic catalyst to form a novolac resin, wherein for each mole of alkylphenol at least 1.5 moles of the phenolic compounds are reacted. Another process comprises reacting one or more alkylphenols with an aldehyde in the presence of a base to form a resole resin, and reacting the resole resin with one or more phenolic compounds under an elevated temperature to form a novolac resin.

Claims

1. A process for preparing a novolac resin, comprising:

reacting one or more alkylphenols with an aldehyde in the presence of a base to form a resole resin, wherein for each mole of alkylphenol at least 1.5 moles of aldehyde are reacted, and

reacting the resole resin with one or more phenolic compounds in the presence of an acidic catalyst to form a novolac resin, wherein for each mole of alkylphenol at least 1.5 moles of the phenolic compounds are reacted.

2. The process of claim 1, wherein at least one alkyl group in the alkylphenols is not C₈.

3. The process of claim 2, wherein one or more alkyl groups in the alkylphenols is C₄-C₂₈ alkyl.

4. The process of claim 3, wherein one or more alkyl groups in the alkylphenols is C₇ or C₁₂ alkyl.

5. The process of claim 3, wherein one or more alkyl groups in the alkylphenols is C₂₄-C₂₈ alkyl.

6. The process of claim 1, wherein the phenolic compound is phenol.

7. The process of claim 6, wherein the phenolic compound further comprises resorcinol.

8. The process of claim 7, wherein the phenolic compound contains about 50-80 wt % phenol and about 20-50 wt % resorcinol.

9. The process of claim 1, further comprising, after the step of reacting the resole resin with one or more phenolic compounds, adding additional aldehyde.

10. The process of claim 1, wherein the aldehyde is formaldehyde.

11. The process of claim 1, wherein the step of reacting one or more alkylphenols with an aldehyde is conducted at a temperature ranging from 50 to 90°

C.

12. The process of claim 1, wherein the step of reacting the resole resin with one or more phenolic compounds is conducted at a temperature ranging from room temperature to 130°

C.

24. A novolac resin prepared by the process of claim 1.

25. The novolac resin of claim 24, wherein the novolac resin has a residual alkylphenol of less than 1%, and a residual phenol of less than 1%.

13. A process for preparing a novolac resin, comprising:

reacting one or more alkylphenols with an aldehyde in the presence of a base to form a resole resin, wherein for each mole of alkylphenol at least 1.5 moles of aldehyde are reacted, and

reacting the resole resin with one or more phenolic compounds under an elevated temperature to form a novolac resin, wherein for each mole of alkylphenol at least 1.5 moles of the phenolic compounds are reacted.

14. The process of claim 13, wherein one or more alkyl groups in the alkylphenols is C₄-C₂₈ alkyl.

15. The process of claim 14, wherein one or more alkyl groups in the alkylphenols is C₇, C₈ or C₁₂ alkyl.

16. The process of claim 14, wherein one or more alkyl groups in the alkylphenols is C₂₄-C₂₈ alkyl.

17. The process of claim 13, wherein the phenolic compound is phenol.

18. The process of claim 17, wherein the phenolic compound further comprises resorcinol.

19. The process of claim 18, wherein the phenolic compound contains about 50-80 wt % phenol and about 20-50 wt % resorcinol.

20. The process of claim 13, further comprising, after the step of reacting the resole resin with one or more phenolic compounds:

neutralizing the resole resin with an acid, and

adding additional aldehyde.

21. The process of claim 13, wherein the aldehyde is formaldehyde.

22. The process of claim 13, wherein the step of reacting one or more alkylphenols with an aldehyde is conducted at a temperature ranging from 50 to 90°

C.

23. The process of claim 13, wherein the step of reacting the resole resin with one or more phenolic compounds is conducted at a temperature ranging from 100°

C. to 200°

C.

26. A novolac resin prepared by the process of claim 13.

27. The novolac resin of claim 26, wherein the novolac resin has a residual alkylphenol of less than 1%, and a residual phenol of less than 1%.

28-32. -32. (canceled)