APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT
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Accused Products
Abstract
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
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Citations
53 Claims
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1-33. -33. (canceled)
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34. An apparatus for removing solder from a surface of a printed wire board (PWB) having at least one casing and/or component affixed thereto by solder or epoxy, the apparatus comprising:
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a heating module; and chemical solder removal means. - View Dependent Claims (35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53)
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Specification