APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT
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Abstract
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
80 Citations
52 Claims
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1-33. -33. (canceled)
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34. A process for recovering a precious metal from a printed wire board (PWB) and/or PWB component, the process comprising,
contacting the PWB and/or PWB component with a leaching composition in a leaching module to extract at least a portion of the precious metal from the PWB and/or PWB component into the leaching composition; -
isolating the leaching composition from the PWB and/or PWB component; rinsing the PWB and/or PWB component in a rinsing module; and drying the PWB and/or PWB component in a drying module. - View Dependent Claims (35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52)
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Specification