UNITIZED CONFINEMENT RING ARRANGEMENTS AND METHODS THEREOF

• US 20150325414A1
• Filed: 07/17/2015
• Published: 11/12/2015
• Est. Priority Date: 09/28/2009
• Status: Abandoned Application

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Dhindsa, Rajinder, Kalyanaraman, Rajaramanan, Mani, Sathyanarayanan, Bhattacharyya, Gautam
• Application Number:
  US14/802,972
• Publication Number:
  US 20150325414A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01J 2237/334 Etching
• CPC Class Codes: H01J 37/32091 the radio frequency energy being capacitively coupled to the plasma
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow
• CPC Class Codes: H01J 37/32477 characterised by the means for protecting vessels or internal parts, e.g. coatings
• CPC Class Codes: H01J 37/32495 Means for protecting the vessel against plasma
• CPC Class Codes: H01J 37/32532 Electrodes
• CPC Class Codes: H01J 37/32623 Mechanical discharge control means
• CPC Class Codes: H01J 37/32642 Focus rings
• CPC Class Codes: H01J 37/32816 Pressure
• CPC Class Codes: H01J 37/32834 Exhausting

Abstract

An arrangement for performing pressure control in a plasma processing chamber comprising an upper electrode, a lower electrode, a unitized confinement ring arrangement wherein the upper electrode, the lower electrode and the unitized confinement ring arrangement are configured at least for surrounding a confined chamber region to facilitate plasma generation and confinement therein. The arrangement further includes at least one plunger configured for moving the unitized confinement ring arrangement in a vertical direction to adjust at least one of a first gas conductance path and a second gas conductance path to perform the pressure control, wherein the first gas conductance path is formed between the upper electrode and the unitized confinement ring arrangement and the second gas conductance path is formed between the lower electrode and the single unitized ring arrangement.

Claims

1. An arrangement for performing pressure control in a processing chamber of a plasma processing system during processing of a substrate, said arrangement comprising:

an upper electrode;

a lower electrode;

a unitized confinement ring arrangement comprised of a single ring including slots; and

at least one plunger configured for moving the unitized confinement ring arrangement in a vertical direction to adjust at least one of a first gas conductance path and a second gas conductance path to perform the pressure control,

wherein said upper electrode, said lower electrode and said unitized confinement ring arrangement are configured at least for surrounding a confined chamber region, wherein said confined chamber region is capable of supporting a plasma for etching said substrate during substrate processing and said unitized confinement ring arrangement is configured for confining said plasma within said confined chamber region,

wherein said first gas conductance path is formed between a first protrusion of said upper electrode and a second protrusion of said unitized confinement ring arrangement, at least a portion of said second protrusion overlaps said first protrusion, said pressure control within said confined chamber region is provided by moving said at least one plunger vertically to adjust the length of said first gas conductance path, said second gas conductance path is formed between a bottom surface of said unitized confinement ring arrangement and a top surface of said lower electrode, at least a portion of the width of said bottom surface of said unitized confinement ring arrangement overlaps said top surface of said lower electrode, and said pressure control within said confined chamber region is provided by moving said at least one plunger vertically to adjust the width of said second gas conductance path.

2. The arrangement of claim 1 wherein said unitized confinement ring arrangement is made from a dielectric material.

3. The arrangement of claim 1 wherein said unitized confinement ring arrangement is made from a conductive material.

4. The arrangement of claim 1 wherein said plasma processing system is a capactively-coupled plasma processing system.

5. The arrangement of claim 1 further including an automatic feedback arrangement configured at least for monitoring and stabilizing the pressure within said confined chamber region.

6. The arrangement of claim 5 wherein said automatic feedback arrangement includes a set of sensors configured for collecting processing data about pressure volume within said confined chamber region.

7. The arrangement of claim 6 wherein said automatic feedback arrangement includes a precision vertical movement arrangement configured at least for

receiving said processing data from said set of sensors,

analyzing said processing data, and

determining a new position for said unitized confinement ring arrangement.

8. The arrangement of claim 1 wherein said slots are a set of slots, wherein each slot of said set of slots is configured for providing an additional path for exhausting gas from said confined chamber region, wherein the availability of said each slot is adjusted by moving said at least one plunger vertically.

9. An arrangement for performing pressure control in a processing chamber of a plasma processing system during processing of a substrate, said arrangement comprising:

an upper electrode;

a lower electrode;

a unitized confinement ring arrangement comprised of a single ring including slots, wherein said upper electrode, said lower electrode and said unitized confinement ring arrangement are configured at least for surrounding a confined chamber region, wherein said confined chamber region is capable of supporting a plasma for etching said substrate during substrate processing and said unitized confinement ring arrangement is configured for confining said plasma within said confined chamber region;

a valve configured at least for controlling pressure within said confined chamber region; and

at least one plunger configured for moving the unitized confinement ring arrangement in a vertical direction to adjust at least one of a first gas conductance path and a second gas conductance path to perform the pressure control,

wherein said first gas conductance path is formed between a first protrusion of said upper electrode and a second protrusion of said unitized confinement ring arrangement, at least a portion of said second protrusion overlaps said first protrusion, said pressure control within said confined chamber region is provided by moving said at least one plunger vertically to adjust the length of said first gas conductance path, said second gas conductance path is formed between said lower electrode and said unitized confinement ring arrangement, and said pressure control within said confined chamber region is provided by moving said at least one plunger vertically to adjust the width of said second gas conductance path.

10. The arrangement of claim 9 wherein said first gas conductance path provides a first route for exhausting gas from said confined chamber region.

11. The arrangement of claim 10 wherein said second gas conductance path provides a second route for exhausting said gas from said confined chamber region.

12. The arrangement of claim 9 further including an automatic feedback arrangement configured at least for monitoring and stabilizing the pressure within said confined chamber region.

13. The arrangement of claim 9 wherein said unitized confinement ring arrangement is made from at least one of a dielectric material and a conductive m 1.