POWER SEMICONDUCTOR MODULE WITH SWITCHING DEVICE AND ASSEMBLY
First Claim
1. A power semiconductor module comprising:
- a housing;
a switching device;
a substrate connected to said housing, said substrate having a first central passage opening and a plurality of conductor tracks which are electrically insulated from one another;
a power semiconductor component arranged on, and cohesively connected to, one of said plurality of conductor tracks of said substrate;
a connecting device having first and second main surfaces and an electrically conductive film between said first and second main surfaces, said connecting device connecting said switching device in an internally circuit-conforming manner;
a plurality of load connection devices;
a pressure device which is movable relative to said housing in a first direction generally normal to said substrate, and having a pressure body with a second passage opening, said second passage opening being in alignment with said first passage opening, said pressure device further having a first recess;
a pressure element arranged in said recess, such that it projects out of said recess, said pressure element pressing onto a section of said second main surface of said connecting device, said section being arranged within the surface of said power semiconductor component and projecting therefrom in a second direction generally normal to said substrate; and
a fastener disposed at least partially within said first and second passage openings for fastening said power semiconductor module on a cooling device in a force-fitting manner.
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Accused Products
Abstract
A power semiconductor module and an arrangement including it. The module includes a housing, a switching device having a substrate connected to the housing, a connecting device, load connection devices and a pressure device movable relative to the housing. The substrate has a first central passage and conductor tracks which are electrically insulated from one another. A power semiconductor component sits on a conductor track. The connecting device has two main surfaces and an electrically conductive film. The pressure device has a pressure body with a second passage, in alignment with the first passage and a first recess. A pressure element projects out of the recess, and presses onto a section of the second main surface. This section is within the surface of the component projects normal to the substrate. The first and second passages receive a fastener which force-fittingly fastens the module to the cooling device.
51 Citations
21 Claims
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1. A power semiconductor module comprising:
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a housing; a switching device; a substrate connected to said housing, said substrate having a first central passage opening and a plurality of conductor tracks which are electrically insulated from one another; a power semiconductor component arranged on, and cohesively connected to, one of said plurality of conductor tracks of said substrate; a connecting device having first and second main surfaces and an electrically conductive film between said first and second main surfaces, said connecting device connecting said switching device in an internally circuit-conforming manner; a plurality of load connection devices; a pressure device which is movable relative to said housing in a first direction generally normal to said substrate, and having a pressure body with a second passage opening, said second passage opening being in alignment with said first passage opening, said pressure device further having a first recess; a pressure element arranged in said recess, such that it projects out of said recess, said pressure element pressing onto a section of said second main surface of said connecting device, said section being arranged within the surface of said power semiconductor component and projecting therefrom in a second direction generally normal to said substrate; and a fastener disposed at least partially within said first and second passage openings for fastening said power semiconductor module on a cooling device in a force-fitting manner. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. An arrangement comprising:
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a power semiconductor module having a housing; a switching device; a substrate connected to said housing, said substrate having a first central passage opening and a plurality of conductor tracks which are electrically insulated from one another; a power semiconductor component arranged on, and cohesively connected to, one of said plurality of conductor tracks of said substrate; a connecting device having first and second main surfaces and an electrically conductive film between said first and second main surfaces, said connecting device connecting said switching device in an internally circuit-conforming manner; a plurality of load connection devices; a pressure device which is movable relative to said housing in a first direction generally normal to said substrate, and having a pressure body with a second passage opening, said second passage opening being in alignment with said first passage opening, said pressure device further having a first recess; and a fastener disposed at least partially within said first and second passage openings; and a cooling device; wherein said fastener introduces force onto said pressure device so that said pressure device connects said substrate to said cooling device in a force-fitting manner. - View Dependent Claims (17, 18, 19, 20, 21)
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Specification