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LED LEADFRAME OR LED SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LED LEADFRAME OR LED SUBSTRATE

  • US 20150325763A1
  • Filed: 07/17/2015
  • Published: 11/12/2015
  • Est. Priority Date: 03/30/2010
  • Status: Active Grant
First Claim
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1. An LED resin-attached leadframe comprising:

  • a die pad for mounting an LED element;

    a lead portion disposed in a spaced relation to the die pad; and

    an outer resin portion formed on the die pad and the lead portion,wherein the die pad and the lead portion have an opposing surface, respectively, the opposing surface of the die pad and the opposing surface of the lead portion opposing each other over a space between the die pad and the lead portion,the opposing surface of the die pad has a protrusion positioned in a middle portion of the die pad in a thickness direction of the die pad and protruding toward the space,the die pad has a mounting surface for mounting the LED element and a bottom surface located on an opposite side of the mounting surface,in a vertical section of the die pad, a curved line is formed between the protrusion and the bottom surface, the curved line curving toward the mounting surface, andthe outer resin portion fills in the space between the die pad and the lead portion.

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