Electrically Bonded Arrays of Transfer Printed Active Components
5 Assignments
0 Petitions
Accused Products
Abstract
An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.
41 Citations
37 Claims
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1-20. -20. (canceled)
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21. An electronic component, comprising:
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an active layer; an electrical connection in contact with the active layer; and a tab comprising a broken portion of a tether, the tab extending from a periphery of the electronic component. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
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22. The electronic component of claim 21, wherein the electronic component is a light-emitting diode.
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23. An electronic component array comprising a target substrate and a plurality of electronic components of claim 21 thereon.
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24. The electronic component array of claim 23, wherein the target substrate is different from the active layer.
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25. The electronic component array of claim 23, wherein the target substrate has conductive traces thereon, and wherein each of the conductive traces is electrically coupled to the electrical connection of a corresponding electronic component.
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26. The electronic component array of claim 23, wherein the target substrate comprises at least one of a flexible substrate and a polymer substrate.
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27. The electronic component of claim 21, wherein the electrical connection is electrically coupled to the active layer.
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28. The electronic component of claim 21, comprising:
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a first metal layer on a first side of the active layer; and a second metal layer on a second side of the active layer, opposite the first side, wherein the electrical connection is in electrical contact with the second metal layer.
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29. The electronic component of claim 28, comprising:
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a first electrical interconnect at least in part on the second side of the active layer and electrically connected to the first metal layer; and a second electrical interconnect at least in part on the second side of the active layer and electrically connected to the second metal layer.
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30. The electronic component of claim 29, comprising:
an insulator at least partially between the active layer and the first electrical interconnect.
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31. The electronic component of claim 29, wherein the electronic component is on a target substrate with the second metal layer therebetween.
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32. The electronic component of claim 31, comprising:
an adhesive layer between the electrical connection and the target substrate.
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33. The electronic component of claim 32, wherein the adhesive layer electrically connects the electrical connection to an electrical contact on the target substrate.
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34. The electronic component of claim 33, wherein the adhesive layer comprises a conductive layer.
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35. The electronic component of claim 33, wherein the adhesive layer comprises a material configured to transition between a nonconductive state and a conductive state responsive to curing thereof.
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36. The electronic component of claim 33, wherein the adhesive layer comprises at least one of a eutectic layer, a conductive film, and conductive nano-particles.
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37. The electronic component of claim 21, wherein the active layer comprises a crystalline, microcrystalline, polycrystalline, or amorphous semiconductor layer.
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22. The electronic component of claim 21, wherein the electronic component is a light-emitting diode.
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Specification
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Current AssigneeX Display Company Technology Limited (Sensinnovat BVBA)
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Original AssigneeSemprius, Inc.
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InventorsMenard, Etienne, Bower, Christopher, Meitl, Matthew, Garrou, Philip
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Application NumberUS14/715,191Publication NumberTime in Patent OfficeDaysField of SearchUS Class Current1/1CPC Class CodesH01L 21/6835 using temporarily an auxili...H01L 21/76898 formed through a semiconduc...H01L 2221/6835 used as a support during bu...H01L 2221/68372 used to support a device or...H01L 2221/68381 Details of chemical or phys...H01L 2224/02371 connecting the bonding area...H01L 2224/02372 connecting to a via connect...H01L 2224/0239 Material of the redistribut...H01L 2224/04026 Bonding areas specifically ...H01L 2224/05548 Bonding area integrally for...H01L 2224/056 with a principal constituen...H01L 2224/08238 the bonding area connecting...H01L 2224/13111 Tin [Sn] as principal const...H01L 2224/24011 Deposited, e.g. MCM-D typeH01L 2224/24137 the bodies being arranged n...H01L 2224/24147 the HDI interconnect not co...H01L 2224/24226 the HDI interconnect connec...H01L 2224/245 MaterialH01L 2224/24998 Reinforcing structures, e.g...H01L 2224/2731 in liquid formH01L 2224/29078 : being disposed next to each...H01L 2224/291 : with a principal constituen...H01L 2224/29101 : the principal constituent m...H01L 2224/29111 : Tin [Sn] as principal const...H01L 2224/2919 : with a principal constituen...H01L 2224/2929 : with a principal constituen...H01L 2224/29344 : Gold [Au] as principal cons...H01L 2224/3012 : LayoutH01L 2224/32104 : relative to the bonding are...H01L 2224/32146 : the layer connector connect...H01L 2224/32227 : the layer connector connect...H01L 2224/73267 : Layer and HDI connectorsH01L 2224/76155 : Jetting means, e.g. ink jetH01L 2224/80203 : Thermocompression bonding, ...H01L 2224/80224 : using a laserH01L 2224/81192 : wherein the bump connectors...H01L 2224/82007 : involving a permanent auxil...H01L 2224/821 : Forming a build-up intercon...H01L 2224/82102 : using jetting, e.g. ink jetH01L 2224/82106 : by subtractive methodsH01L 2224/83093 : Transient conditions, e.g. ...H01L 2224/83121 : Active alignment, i.e. by a...H01L 2224/83191 : wherein the layer connector...H01L 2224/83192 : wherein the layer connector...H01L 2224/83805 : involving forming a eutecti...H01L 2224/83815 : Reflow solderingH01L 2224/8384 : SinteringH01L 2224/83851 : being an anisotropic conduc...H01L 2224/83855 : Hardening the adhesive by c...H01L 2224/83859 : Localised curing of parts o...H01L 2224/83862 : Heat curingH01L 2224/83868 : Infrared [IR] curingH01L 2224/83871 : Visible light curingH01L 2224/83874 : Ultraviolet [UV] curingH01L 2224/92143 : the second connecting proce...H01L 2224/92244 : the second connecting proce...H01L 23/481 : Internal lead connections, ...H01L 24/02 : Bonding areas on insulating...H01L 24/05 : of an individual bonding areaH01L 24/08 : of an individual bonding areaH01L 24/24 : of an individual high densi...H01L 24/27 : Manufacturing methodsH01L 24/29 : of an individual layer conn...H01L 24/30 : of a plurality of layer con...H01L 24/32 : of an individual layer conn...H01L 24/73 : Means for bonding being of ...H01L 24/82 : by forming build-up interco...H01L 24/83 : using a layer connectorH01L 24/92 : Specific sequence of method...H01L 27/1214 : comprising a plurality of T...H01L 27/1266 : the substrate on which the ...H01L 27/14618 : ContainersH01L 2924/00 : Indexing scheme for arrange...H01L 2924/00014 : the subject-matter covered ...H01L 2924/01005 : Boron [B]H01L 2924/01006 : Carbon [C]H01L 2924/01013 : Aluminum [Al]H01L 2924/01023 : Vanadium [V]H01L 2924/01029 : Copper [Cu]H01L 2924/01032 : Germanium [Ge]H01L 2924/01033 : Arsenic [As]H01L 2924/01047 : Silver [Ag]H01L 2924/01049 : Indium [In]H01L 2924/0105 : Tin [Sn]H01L 2924/01057 : Lanthanum [La]H01L 2924/01075 : Rhenium [Re]H01L 2924/01079 : Gold [Au]H01L 2924/01082 : Lead [Pb]H01L 2924/0132 : Binary AlloysH01L 2924/01322 : Eutectic Alloys, i.e. obtai...H01L 2924/0133 : Ternary AlloysH01L 2924/014 : Solder alloysH01L 2924/10329 : Gallium arsenide [GaAs]H01L 2924/12041 : LEDH01L 2924/12042 : LASERH01L 2924/12044 : OLEDH01L 2924/14 : Integrated circuitsH01L 2924/15153 : the die mounting substrate ...H01L 2924/15787 : Ceramics, e.g. crystalline ...H01L 31/0203 : Containers; Encapsulations ...H01S 5/02315 : Support members, e.g. bases...H01S 5/0233 : Mounting configuration of l...H01S 5/02345 : Wire-bondingH01S 5/0235 : Method for mounting laser c...H05K 1/18 : Printed circuits structural...H05K 3/0058 : Laminating printed circuit ...H05K 3/10 : in which conductive materia...Y10T 29/4913 : Assembling to base an elect...Y10T 29/49139 : by inserting component lead...