Electronic module, electronic system and method of manufacturing the same

• US 20150327390A1
• Filed: 05/09/2015
• Published: 11/12/2015
• Est. Priority Date: 05/12/2014
• Status: Active Grant

• Current Assignee: Infineon Technologies Austria Ag (Infineon Technologies AG)
• Original Assignee: Infineon Technologies Austria Ag (Infineon Technologies AG)
• Inventors: BRUCCHI, Fabio
• Granted Patent: US 9,648,776 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/145 Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
• CPC Class Codes: H05K 13/04 Mounting of components , e.g. of leadless components
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 3/36 Assembling printed circuits with other printed circuits H05K7/142 takes precedence
• CPC Class Codes: H05K 3/366 substantially perpendicularly to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 7/1457 Power distribution arrangements
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

An electronic module is provided, comprising an electronic chip arranged in the electronic module; at least two contact terminals electrically connected to the electronic chip each extending out of a package of the electronic module, wherein at least one of the at least two contact terminals is a signal contact terminal comprising a distal signal contact area, and at least another one of the at least two contact terminals is a power contact terminal comprising a distal power contact area; wherein the distal power contact area is adapted to be electrically connected to a power circuit external to the electronic module, wherein the external power circuit is oriented in a first plane; and wherein the distal signal contact area is adapted to be electrically connected to a signal circuit external to the electronic module, wherein the external signal circuit is oriented in a second plane extending perpendicular to the first plane.

Claims

1. An electronic module, comprising:

an electronic chip arranged in the electronic module;

at least two contact terminals electrically connected to the electronic chip each extending out of a package of the electronic module,

wherein at least one of the at least two contact terminals is a signal contact terminal comprising a distal signal contact area, and at least another one of the at least two contact terminals is a power contact terminal comprising a distal power contact area;

wherein the distal power contact area is adapted to be electrically connected to a power circuit external to the electronic module, wherein the external power circuit is oriented in a first plane; and

wherein the distal signal contact area is adapted to be electrically connected to a signal circuit external to the electronic module, wherein the external signal circuit is oriented in a second plane extending perpendicular to the first plane.

2. The electronic module according to claim 1, comprising four contact terminals, wherein two are signal contact terminals and the other two are power contact terminals.

3. The electronic module according to claim 1, wherein the at least two contact terminals exiting the package at the same side and either the signal contact terminal or the power contact terminal comprises a bent having an angle of 90 degrees.

4. The electronic module according to claim 1, wherein the at least one power contact terminal and the at least one signal contact terminal exit the package on different sides which are perpendicular to each other.

5. The electronic module according to claim 1, wherein the electronic chip comprises at least one transistor and the at least one signal contact terminal is connected to a switching contact of the transistor and the at least one power contact terminal is connected to a switched contact of the transistor.

6. The electronic module according to claim 1,

wherein the at least two contact terminals are formed by predefined leads of a leadframe.

7. An electronic system comprising:

an electronic module according to claim 1;

a power board; and

a signal board,

wherein the power board and the signal board are oriented with respect to each other that they are perpendicular to each other;

wherein the power contact area of the electronic module is electrically connected to the power board; and

wherein the signal contact area of the electronic module is electrically connected to the signal board.

8. The electronic system according to claim 7, wherein the power board is a printed circuit board.

9. The electronic system according to claim 7, wherein the signal board is a printed circuit board.

10. The electronic system according to claim 7,

wherein the at least one power contact terminal and the at least one signal contact terminal exiting the electronic module at the same side;

and

wherein the signal contact terminal comprises a bent of 90 degrees while the power contact terminal is formed by a straight lead.

11. The electronic system according to claim 7,

wherein the at least one power contact area is soldered to the power board.

12. The electronic system according to claim 7, further comprising a plurality of electronic modules.

13. A method of manufacturing an electronic system, the method comprising:

providing a power board;

placing a signal board on the power board in such a way that a main surface of the signal board is perpendicular to a main surface of the power board; and

contacting an electronic module according to claim 1 to the power board and the signal board by contacting the power contact terminals to the power board and contacting the signal contact terminals to the signal board.