×

Configuring Signal Devices in Thermal Processing Systems

  • US 20150332071A1
  • Filed: 07/23/2015
  • Published: 11/19/2015
  • Est. Priority Date: 04/04/2012
  • Status: Abandoned Application
First Claim
Patent Images

1. A material processing head for reducing communication interference between data tags and an antenna, the material processing head comprising:

  • a body;

    the antenna disposed within the body;

    a first tag, associated with a first consumable component, disposed within a flux communication zone of the body at a first distance from the antenna, the first tag having a first resonant frequency; and

    a second tag, associated with a second consumable component, disposed within the flux communication zone of the body at a second distance from the antenna, the second tag having a second resonant frequency that is different than the first resonant frequency,wherein the first and second resonant frequencies are tuned based upon at least one of;

    i) a difference between the first distance and the second distance;

    or ii) a characteristic (e.g., shape) of the flux communication zone in which the first tag and/or the second tag is disposed.

View all claims
  • 6 Assignments
Timeline View
Assignment View
    ×
    ×