LIGHT EMITTING DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
First Claim
1. A light emitting device package structure, comprising:
- a light emitting device, having an upper surface and a lower surface opposite to each other, a side surface connecting the upper surface and the lower surface and a first electrode pad and a second electrode pad located on the lower surface and separated from each other; and
a protecting element, encapsulating the side surface of the light emitting device and exposing at least portion of the upper surface of the light emitting device, at least portion of a first bottom surface of the first electrode pad and at least portion of a second bottom surface of the second electrode pad.
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Accused Products
Abstract
A light emitting device package structure and a manufacturing method thereof are provided. The light emitting device package structure includes a light emitting device and a protecting element. The light emitting device has an upper surface and a lower surface opposite to each other, a side surface connecting the upper surface and the lower surface and a first electrode pad and a second electrode pad located on the lower surface and separated from each other. The protecting element encapsulates the side surface of the light emitting device and exposes at least portion of the upper surface, at least portion of a first bottom surface of the first electrode pad and at least portion of a second bottom surface of the second electrode pad.
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Citations
34 Claims
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1. A light emitting device package structure, comprising:
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a light emitting device, having an upper surface and a lower surface opposite to each other, a side surface connecting the upper surface and the lower surface and a first electrode pad and a second electrode pad located on the lower surface and separated from each other; and a protecting element, encapsulating the side surface of the light emitting device and exposing at least portion of the upper surface of the light emitting device, at least portion of a first bottom surface of the first electrode pad and at least portion of a second bottom surface of the second electrode pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A manufacturing method of a light emitting device package structure, the manufacturing method comprising:
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disposing a plurality of light emitting devices ranged interval on a substrate, wherein each light emitting device comprises a first electrode pad and a second electrode pad located on a lower surface and separated from each other, and the first electrode pad and the second electrode pad are disposed on the substrate; forming a protecting element to encapsulate each light emitting device; removing a part of the protecting element to expose an upper surface of each light emitting device; cutting the protecting element by performing a cutting process to form a plurality of light emitting device package structures separated from each other, wherein each light emitting device package structure comprises at least one light emitting device and the protecting element encapsulating a side surface of the light emitting device and exposing the upper surface; and removing the substrate to expose a bottom surface of the protecting element of each light emitting device package structure, and expose a first bottom surface of the first electrode pad and a second bottom surface of the second electrode pad. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22)
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23. A manufacturing method of a light emitting device package structure, the manufacturing method comprising:
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disposing a plurality of light emitting devices ranged interval on a substrate, wherein each light emitting device comprises a first electrode pad and a second electrode pad located on a lower surface and separated from each other, and an upper surface of each light emitting device is disposed on the substrate; forming a protecting element to encapsulate each light emitting device; removing a part of the protecting element to expose a first bottom surface of the first electrode pad and a second bottom surface of the second electrode pad of each light emitting device; forming an extension electrode layer to electrically connect to the first electrode pad and the second electrode pad of each light emitting device; and cutting the protecting element and the extension electrode layer by performing a cutting process to form a plurality of light emitting device package structures separated from each other, wherein each light emitting device package structure comprises at least one light emitting device, the protecting element at least encapsulating the side surface of the light emitting device, a first extension electrode and a second extension electrode, and the first extension electrode and the second extension electrode are separated from each other and cover at least a part of a bottom surface of the protecting element. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification