Encapsulation Layers with Improved Reliability
First Claim
1. An encapsulation layer for encapsulating organic light-emitting diodes, comprising:
- a first inorganic layer having multiple sub-layers;
a second inorganic layer; and
a transparent dielectric layer interposed between the first and second inorganic layers.
1 Assignment
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Accused Products
Abstract
An electronic device may include a display having an array of organic light-emitting diodes formed on a substrate. An encapsulation layer may be formed over the array of organic light-emitting diodes to protect the organic light-emitting diodes from moisture and other contaminants. The encapsulation layer may include a transparent sheet of material interposed between upper and lower inorganic films. The reliability of the encapsulation layer is increased by dividing one or both of the inorganic films into multiple sub-layers. The sub-layers may have different densities and may be deposited in sequential steps. Additional moisture protection may be provided by forming a conformal thin-film coating over the organic light-emitting diodes. The conformal thin-film coating may be an aluminum oxide layer that is formed using atomic layer deposition techniques.
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Citations
20 Claims
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1. An encapsulation layer for encapsulating organic light-emitting diodes, comprising:
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a first inorganic layer having multiple sub-layers; a second inorganic layer; and a transparent dielectric layer interposed between the first and second inorganic layers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for forming an encapsulation layer for encapsulating organic light-emitting diodes, comprising:
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with deposition equipment, depositing a first inorganic layer over the organic light-emitting diodes; depositing a transparent dielectric layer over the first inorganic layer; and with the deposition equipment, depositing a second inorganic layer over the transparent dielectric layer, where depositing the second inorganic layer comprises depositing a first sub-layer of inorganic material over the transparent dielectric layer and depositing a second sub-layer of inorganic material over the first sub-layer of inorganic material. - View Dependent Claims (12, 13, 14, 15)
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16. A display, comprising:
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a substrate; an array of organic light-emitting diodes formed on the substrate; and an encapsulation layer formed over the organic light-emitting diodes, wherein the encapsulation layer comprises a transparent sheet of material interposed between first and second inorganic films, wherein at least the first inorganic film comprises first and second sub-layers. - View Dependent Claims (17, 18, 19, 20)
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Specification