SILICON MICROSYSTEMS FOR HIGH-THROUGHPUT ANALYSIS OF NEURAL CIRCUIT ACTIVITY, METHOD AND PROCESS FOR MAKING THE SAME
First Claim
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1. A process for manufacturing a device comprising a plurality of electrical elements, comprising:
- applying a first module in direct contact with a first electrical element layer of a pre-treated substrate, wherein the first electrical element layer is selected from the group consisting of a metal layer, an insulating layer, a semiconductor layer, a layer of photoresist, and a combination thereof, and wherein the first module comprises, on a surface that forms direct contact with the first electrical element layer, a first template design; and
printing a first pattern on the first electrical element layer, wherein the first pattern is formed by a first material having a photo sensitivity.
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Abstract
Provided herein are multi-electrode probe/microsystem designs that readily allow recording with multiple electrodes simultaneously, and of two spatially distinct brain regions at the same time. Also provide are methods and processes for manufacturing the probes.
20 Citations
28 Claims
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1. A process for manufacturing a device comprising a plurality of electrical elements, comprising:
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applying a first module in direct contact with a first electrical element layer of a pre-treated substrate, wherein the first electrical element layer is selected from the group consisting of a metal layer, an insulating layer, a semiconductor layer, a layer of photoresist, and a combination thereof, and wherein the first module comprises, on a surface that forms direct contact with the first electrical element layer, a first template design; and printing a first pattern on the first electrical element layer, wherein the first pattern is formed by a first material having a photo sensitivity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 12, 13, 14, 15, 16, 17, 19, 20, 25)
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11. (canceled)
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18. (canceled)
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21-24. -24. (canceled)
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26. (canceled)
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27. A neural probe, comprising:
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a first implantable shaft; a first plurality of electrodes disposed on the first implantable shaft; a second implantable shaft; a second plurality of electrodes disposed on the second implantable shaft; a base to which the first implantable shaft and the second implantable shaft are attached and separated by a distance; and at least one contact pad on the base to which one electrode from the first plurality of electrodes and one electrode from the second plurality of electrodes are connected.
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28-36. -36. (canceled)
Specification