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METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS

  • US 20150340310A1
  • Filed: 07/31/2015
  • Published: 11/26/2015
  • Est. Priority Date: 12/19/2012
  • Status: Active Grant
First Claim
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1. An interconnect element, comprising:

  • a semiconductor or insulating material layer having a first thickness and defining a first surface;

    a thermally conductive layer having a second thickness of at least 10 microns and defining a second surface of the interconnect element;

    a plurality of conductive elements extending from the first surface of the interconnect element to the second surface of the interconnect element; and

    a dielectric coating between at least a portion of each conductive element and the thermally conductive layer.

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