SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
First Claim
1. A three-dimensional semiconductor device, comprising:
- a substrate including a cell region and a connection region;
gate electrodes stacked on top of each other on the cell region of the substrate, the gate electrodes including a lowermost gate electrode;
a vertical channel structure penetrating the gate electrodes on top of the lowermost gate electrode, the vertical channel structure including a first gate dielectric pattern;
pads extended from the gate electrodes, the pads stacked on top of each other on the connection region of the substrate, the pads including a lowermost pad;
a dummy pillar penetrating at least some of the pads on top of the lowermost pad, the dummy pillar including a second gate dielectric pattern;
a first semiconductor pattern between the vertical channel structure and the substrate, the first gate dielectric pattern of the vertical channel structure on the first semiconductor pattern, the first semiconductor pattern penetrating the lowermost gate electrode; and
a second semiconductor pattern between the dummy pillar and the substrate, the second semiconductor pattern penetrating the lowermost pad, the second gate dielectric pattern of the dummy pillar covering a whole top surface of the second semiconductor pattern.
1 Assignment
0 Petitions
Accused Products
Abstract
According to example embodiments, a three-dimensional semiconductor device including a substrate with cell and connection regions, gate electrodes stacked on the cell region, a vertical channel structure, pads, a dummy pillar, and first and second semiconductor patterns. The vertical channel structure penetrates the gate electrodes on a lowermost gate electrode and includes a first gate dielectric pattern. The pads extend from the gate electrodes and are stacked on the connection region. The dummy pillar penetrates some of the pads on a lowermost pad and includes a second gate dielectric pattern. The first semiconductor patterns are between the vertical channel structure and the substrate. The second semiconductor patterns are between the dummy pillar and the substrate. The first and second gate dielectric patterns may be on the first and second semiconductor patterns, respectively. The second gate dielectric pattern may cover a whole top surface of the second semiconductor pattern.
-
Citations
35 Claims
-
1. A three-dimensional semiconductor device, comprising:
-
a substrate including a cell region and a connection region; gate electrodes stacked on top of each other on the cell region of the substrate, the gate electrodes including a lowermost gate electrode; a vertical channel structure penetrating the gate electrodes on top of the lowermost gate electrode, the vertical channel structure including a first gate dielectric pattern; pads extended from the gate electrodes, the pads stacked on top of each other on the connection region of the substrate, the pads including a lowermost pad; a dummy pillar penetrating at least some of the pads on top of the lowermost pad, the dummy pillar including a second gate dielectric pattern; a first semiconductor pattern between the vertical channel structure and the substrate, the first gate dielectric pattern of the vertical channel structure on the first semiconductor pattern, the first semiconductor pattern penetrating the lowermost gate electrode; and a second semiconductor pattern between the dummy pillar and the substrate, the second semiconductor pattern penetrating the lowermost pad, the second gate dielectric pattern of the dummy pillar covering a whole top surface of the second semiconductor pattern. - View Dependent Claims (2, 3, 6, 7, 10, 11, 12, 13, 14, 15, 16)
-
-
4-5. -5. (canceled)
-
8-9. -9. (canceled)
-
17. A three-dimensional semiconductor device, comprising:
-
a substrate including a cell region and a connection region; gate electrodes stacked on top of each other on the cell region of the substrate, the gate electrodes defining a part of a channel hole that exposes a part of the cell region of the substrate, the gate electrodes being separated from each other in a vertical direction; pads extended from the gate electrodes, the pads stacked on top of each other on the connection region of the substrate, at least some of the pads defining a part of a dummy hole that exposes a part of the connection region of the substrate; a first semiconductor pattern on the cell region of the substrate in a lower portion of the channel hole, a top surface of the first semiconductor pattern including a recessed dent; and a second semiconductor pattern on the connection region of the substrate in a lower portion of the dummy hole, a top surface of the second semiconductor pattern being flat. - View Dependent Claims (18, 21)
-
-
19-20. -20. (canceled)
-
22-30. -30. (canceled)
-
31. A three-dimensional semiconductor device, comprising:
-
a substrate including a cell region and a connection region; a plurality of conductive layers stacked on top of each other on the substrate and spaced apart from each other in a vertical direction, the conductive layers each including a gate electrode portion over the cell region and a pad portion over the connection region; a first semiconductor pattern on a part of the cell region, the first semiconductor pattern extending vertically through the gate electrode portion of a lowermost conductive layer among the plurality of conductive layers; a first vertical channel pattern extending vertically through the gate electrode portions of the conductive layers over the lowermost conductive layer, the first vertical channel pattern electrically connected to the first semiconductor pattern; a second semiconductor pattern on a part of the connection region and extending vertically through the pad portion of the lowermost conductive layer; and a dummy gate dielectric pattern extending vertically through the pad portions of some of the conductive layers over the lowermost conductive layer, the dummy gate dielectric pattern covering a whole top surface of the second semiconductor pattern. - View Dependent Claims (32, 33, 34, 35)
-
Specification