HOUSING FOR ELECTRONIC DEVICES

• US 20150342069A1
• Filed: 05/20/2014
• Published: 11/26/2015
• Est. Priority Date: 05/20/2014
• Status: Abandoned Application

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Foong, Chee Seng
• Application Number:
  US14/281,917
• Publication Number:
  US 20150342069A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0999 Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 2203/1469 Circuit made after mounting or encapsulation of the components
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/0044 Mechanical working of the substrate, e.g. drilling or punching H05K3/0008 takes precedence
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/0064 onto a polymeric substrate
• CPC Class Codes: H05K 3/102 by bonding of conductive powder, i.e. metallic powder H05K3/12 takes precedence
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49135 and shaping, e.g., cutting or bending, etc.

Abstract

Traces are formed and electronic components are mounted on an interior surface of a housing of an electronic device. Various methods are disclosed for integrating the housing with the electronic components including vacuum molding, metal forming, injection molding, and 3D printing of traces. The housing may be used to save space and reduce the size of the electronic devices as well as reduce assembly times.

Claims

1. A method of manufacturing an electronic device, the method comprising:

(a) forming a housing having an interior surface and an exterior surface, wherein a portion of the interior surface has traces formed thereon; and

(b) mounting electronic components on the portion of the interior surface so that the electronic components are electrically connected to the traces.

2. An electronic device formed by the method of manufacture of claim 1.

3. The method of claim 1, wherein:

the housing comprises a substrate and a flexible printed circuit board (PCB) film mounted on the substrate, wherein the flexible PCB film forms the portion of the interior surface;

the flexible PCB film has the traces formed thereon; and

step (b) comprises mounting the electronic components on the flexible PCB film so that the electronic components are electrically connected to the traces of the flexible PCB film.

4. The method of claim 3, wherein:

the substrate is made of plastic; and

further comprising vacuum molding the plastic substrate to form a portion of the housing for the electronic device.

5. The method of claim 4, wherein the vacuum molding is performed after step (b).

6. An electronic device formed by the method of manufacture of claim 5.

7. The method of claim 3, wherein step (a) comprises:

placing the flexible PCB film in a mold; and

injection molding substrate material into the mold to form a portion of the housing for the electronic device, wherein the portion comprises the substrate with the flexible PCB film mounted thereon.

8. An electronic device formed by the method of manufacture of claim 7.

9. The method of claim 3, wherein:

the substrate is made of metal; and

step (a) comprises;

laminating the flexible PCB film onto the metal substrate to form the housing material; and

punching the housing material to form a portion of the housing for the electronic device, the portion comprising the substrate with the flexible PCB film mounted thereon.

10. An electronic device formed by the method of manufacture of claim 9.

11. The method of claim 1, wherein step (a) comprises:

applying conductive material to a substrate; and

sintering or melting selected portions of the conductive material to form the traces directly on the substrate.

12. An electronic device formed by the method of manufacture of claim 11.

13. A method of manufacturing an electronic device, the method comprising:

mounting electronic components upside-down on a substrate;

placing conductive material over the electronic components; and

sintering or melting selected portions of the conductive material to form traces that electrically connect the electronic components.

14. The method of claim 13, further comprising:

forming a housing from the substrate, wherein the housing has an interior surface and an exterior surface and the electronic components are mounted on a portion of the interior surface.

15. An electronic device formed by the method of claim 14.

16. An electronic device, comprising:

a housing having an interior surface and an exterior surface;

a flexible printed circuit board (PCB) forming a portion of the interior surface of the housing, wherein the flexible PCB has traces formed thereon; and

electronic components mounted on and electrically connected to the traces,

wherein the housing and the PCB are shaped one to the other.

17. The electronic device of claim 16, wherein the housing and the PCB are shaped one to the other via vacuum.

18. The electronic device of claim 17, wherein the housing and the PCB are shaped one to the other via punching.

19. The electronic device of claim 17, wherein the PCB comprises a film.

20. The electronic device of claim 19, wherein the film is attached to the housing with an adhesive.