ELECTROMAGNETIC CHUCK FOR OLED MASK CHUCKING

• US 20150343580A1
• Filed: 08/19/2014
• Published: 12/03/2015
• Est. Priority Date: 06/02/2014
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: WHITE, John M., WANG, Zuoqian
• Granted Patent: US 9,463,543 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B23Q 3/1546 using permanent magnets
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: Y10T 279/23 with magnetic or electrostatic means

Abstract

An electromagnetic mask chuck is described herein. The electromagnetic mask chuck includes a body with a plurality of electromagnets formed therein. The electromagnets can then deliver a magnetic force to a mask to position and hold the mask over or on the substrate for further deposition. The electromagnets are controlled using a power source, to deliver a controlled magnetic field to the mask.

Claims

1. A processing system comprising:

a process chamber configured to deposit a material on the substrate; and

an electromagnetic mask chuck positioned in the process chamber, the electromagnetic mask chuck comprising;

a plurality of electromagnets operable to chuck a mask to the substrate on the substrate carrier; and

a power source coupled to the plurality of electromagnets.

2. The processing system of claim 1, wherein the electromagnetic mask chuck is operable to sequential increase a magnetic field from the plurality of electromagnets.

3. The processing system of claim 2, wherein the electromagnetic mask chuck is operable to generate more force in a center region of the electromagnetic mask chuck relative to a peripheral region of the electromagnetic mask chuck.

4. The processing system of claim 2, wherein the electromagnetic mask chuck is operable to generate more force on one side of the electromagnetic mask chuck relative to an opposite side of the electromagnetic mask chuck.

5. The processing system of claim 1, wherein a first electromagnet of the plurality of electromagnets is configured to deliver a magnetic field having a strength different than a second electromagnet.

6. The processing system of claim 1, wherein the plurality of electromagnets are independently controllable.

7. The processing system of claim 1, wherein the plurality of electromagnets are each configured to produce a magnetic field with unequal strength as compared between them, such that one portion of the mask is pulled with more force than another proportion of the mask.

8. A substrate carrier for use in a process chamber, the substrate carrier comprising:

a support base configured to transport a substrate into and out of the processing chamber, the support base having a substrate supporting surface; and

an electromagnetic mask chuck coupled to the support base, the electromagnetic mask chuck comprising a plurality of electromagnets operable to chuck a mask to the substrate through the substrate carrier.

9. The substrate carrier of claim 8, wherein the plurality of electromagnets are positioned equidistant from the substrate supporting surface.

10. The substrate carrier of claim 8, wherein a distance between the electromagnets and the substrate supporting surface varies.

11. The substrate carrier of claim 8, wherein the plurality of electromagnets are rectangular magnets.

12. The substrate carrier of claim 8, wherein the electromagnets are independently controllable.

13. The substrate carrier of claim 8, wherein the electromagnetic mask chuck is operable to sequentially increase a magnetic field from the plurality of electromagnets.

14. The substrate carrier of claim 8, further comprising a power source coupled to the plurality of electromagnets.

15. The substrate carrier of claim 12, wherein the chuck body comprises a ceramic material.

16. A method for chucking a mask in a process chamber, the method comprising:

transferring a substrate disposed on a substrate supporting surface of a substrate carrier into a processing position in a process chamber;

electromagnetically chucking a mask to the substrate disposed on the substrate carrier; and

depositing a layer through the mask onto the substrate.

17. The method of claim 16, wherein the electromagnetically chucking the mask to the substrate comprises chucking the mask to the substrate in a center to edge sequence.

18. The method of claim 16, wherein the electromagnetically chucking the mask to the substrate comprises chucking the mask to the substrate in a first edge to second edge sequence.

19. The method of claim 16, wherein the electromagnetically chucking the mask to the substrate comprises independently controlling force generated by a plurality of electromagnets disposed in the process chamber.

20. The method of claim 16, wherein the transferring the substrate disposed the substrate carrier into the process chamber further comprises moving the electromagnets into the process chamber.