LIQUID DISCHARGING HEAD AND METHOD FOR PRODUCING THE SAME

• US 20150343777A1
• Filed: 05/27/2015
• Published: 12/03/2015
• Est. Priority Date: 05/30/2014
• Status: Active Grant

• Current Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Original Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Inventors: Seki, Sayaka, Tsujiuchi, Naoko, Kimura, Satoshi, Kudo, Kiyomitsu, Idogawa, Kazuhiro
• Granted Patent: US 9,463,624 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B41J 2/14024 Assembling head parts
• CPC Class Codes: B41J 2/14072 Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
• CPC Class Codes: B41J 2/1433 Structure of nozzle plates
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/162 Manufacturing of the nozzle plates
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1753 Details of contacts on the cartridge, e.g. protection of contacts
• CPC Class Codes: B41J 2/17553 Outer structure
• CPC Class Codes: B41J 2002/14491 Electrical connection

Abstract

A liquid discharging head includes a recording element substrate configured to discharge a liquid; an electric wiring substrate that is provided with a lead terminal that is connected to the recording element substrate; and a supporting member to which the electric wiring substrate is bonded. The electric wiring substrate is bonded to the supporting member with two or more types of adhesives including at least a first adhesive and a second adhesive whose volume resistivity is higher than that of the first adhesive, a bond strength of the first adhesive is higher than a bond strength of the second adhesive, and, at the supporting member, the second adhesive is applied such that the second adhesive is provided closer to the lead terminal than the first adhesive.

Claims

1. A liquid discharging head comprising:

a recording element substrate configured to discharge a liquid;

an electric wiring substrate that is provided with a lead terminal that is connected to the recording element substrate; and

a supporting member to which the electric wiring substrate is bonded,

wherein the electric wiring substrate is bonded to the supporting member with two or more types of adhesives including at least a first adhesive and a second adhesive whose volume resistivity is higher than that of the first adhesive, a bond strength of the first adhesive is higher than a bond strength of the second adhesive, and, at the supporting member, the second adhesive is applied such that the second adhesive is provided closer to the lead terminal than the first adhesive.

2. The liquid discharging head according to claim 1, wherein the second adhesive is applied in a C shape so as to partly surround the lead terminal.

3. The liquid discharging head according to claim 1, wherein the supporting member includes a recessed portion between a first application region to which the first adhesive is applied and a second application region to which the second adhesive is applied.

4. The liquid discharging head according to claim 3, wherein the recessed portion has a C shape so as to partly surround the second adhesive applied to the second application region.

5. The liquid discharging head according to claim 3, wherein an area of the first application region is larger than an area of the second application region.

6. The liquid discharging head according to claim 1, wherein a viscosity of the second adhesive is higher than a viscosity of the first adhesive.

7. The liquid discharging head according to claim 1, wherein the first adhesive is a photo-curable adhesive and the second adhesive is a thermosetting adhesive.

8. The liquid discharging head according to claim 1, wherein a portion of the second adhesive overflows towards the lead terminal from between the electric wiring substrate and the supporting member.

9. A method for producing a liquid discharging head including a recording element substrate configured to discharge a liquid, an electric wiring substrate that is provided with a lead terminal that is connected to the recording element substrate, and a supporting member to which the electric wiring substrate is bonded, the method comprising the steps of:

applying two or more types of adhesives including at least a first adhesive and a second adhesive whose volume resistivity is higher than that of the first adhesive, and

bonding the electric wiring substrate to the supporting member with the two or more types of adhesives,

wherein, in the applying step, after the first adhesive whose bond strength is higher than that of the second adhesive has been applied to the supporting member, at the supporting member, the second adhesive is applied such that the second adhesive is provided closer to the lead terminal than the first adhesive.

10. The method according to claim 9, wherein, in the applying step, the second adhesive is applied in a C shape so as to partly surround the lead terminal.

11. A liquid discharging head comprising:

a recording element substrate configured to discharge a liquid;

an electric wiring substrate that is provided with a wire for transmitting a drive signal to the recording element substrate;

an electric connecting portion that electrically connects the recording element substrate and the electric wiring substrate with each other; and

a supporting member to which the electric wiring substrate is bonded,

wherein the electric wiring substrate is bonded to the supporting member with two or more types of adhesives including at least a first adhesive and a second adhesive whose volume resistivity is higher than that of the first adhesive, a bond strength of the first adhesive is higher than a bond strength of the second adhesive, and, at the supporting member, the second adhesive is applied such that the second adhesive is provided closer to the electric connecting portion than the first adhesive.

12. The liquid discharging head according to claim 11, wherein a portion of the second adhesive overflows towards the electric connecting portion from between the electric wiring substrate and the supporting member.