ISOLATED POWER CONVERTER WITH MAGNETICS ON CHIP

• US 20150348687A1
• Filed: 08/13/2015
• Published: 12/03/2015
• Est. Priority Date: 06/30/2011
• Status: Abandoned Application

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Chen, Baoxing
• Application Number:
  US14/826,083
• Publication Number:
  US 20150348687A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 5/003 Printed circuit coils
• CPC Class Codes: H01F 5/06 Insulation of windings
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 3/335 using semiconductor devices only

Abstract

An integrated circuit fabricated with a number of layer may include a substrate, a transformer having a first winding, a second winding and a magnetic core. The first winding and the second winding may surround the magnetic core. The transformer may be disposed above a first side of the substrate. A flux conductor may be disposed on a second surface of the substrate opposite to the first surface.

Claims

1-33. -33. (canceled)

34. An integrated circuit, comprising:

an integrated circuit substrate; and

a transformer formed on one side of the integrated circuit substrate, the transformer including a first winding, a second winding, and a magnetic core, the first and second windings winding about the magnetic core.

35. The integrated circuit of claim 34, wherein the first and second windings are intertwined with each other about a same portion of the magnetic core.

36. The integrated circuit of claim 34, wherein the first winding winds about a first portion of the magnetic core, and the second winding winds about a second portion of the magnetic core different than the first portion.

37. The integrated circuit of claim 34, wherein the magnetic core is a solid magnetic core.

38. The integrated circuit of claim 34, wherein the magnetic core is a segmented magnetic core including at least one void between adjacent segments and a dielectric material in the at least one void between adjacent segments.

39. The integrated circuit of claim 34, wherein the first and second windings are positioned relative to the integrated circuit substrate to conduct magnetic flux in a direction parallel to the side of the integrated circuit substrate.

40. The integrated circuit of claim 34, wherein the first and second windings spiral about an axis substantially parallel to the side of the integrated circuit substrate and passing through the magnetic core.

41. The integrated circuit of claim 34, further comprising at least one layer of dielectric material between the magnetic core and the first winding to provide electric isolation between the magnetic core and the first winding.

42. The integrated circuit of claim 34, further comprising at least one layer of dielectric material between the magnetic core and the second winding to provide electric isolation between the magnetic core and the second winding.

43. The integrated circuit of claim 34, further comprising at least one layer of dielectric material between the first winding and the second winding to provide electric isolation between the first winding and the second winding.

44. The integrated circuit of claim 34, further comprising at least one layer of dielectric material between the transformer and the integrated circuit substrate to provide electric isolation between the transformer and the integrated circuit substrate.

45. The integrated circuit of claim 34, wherein the first and second windings include at least one layer of the integrated circuit.

46. The integrated circuit of claim 34, wherein the magnetic core includes at least one layer of the integrated circuit.

47. The integrated circuit of claim 34, wherein the integrated circuit substrate is a semiconductor substrate.

48. The integrated circuit of claim 34, wherein the transformer is formed by integrated circuit processing.

49. The integrated circuit of claim 34, further comprising:

a switching circuit formed on the integrated circuit substrate and connected to the first winding of the transformer; and

a rectifying circuit formed on the integrated circuit substrate and connected to the second winding of the transformer.

50. A power converter system, comprising:

the integrated circuit of claim 34;

a switching circuit formed on a second integrated circuit substrate and connected to the first winding of the transformer; and

a rectifying circuit formed on a third integrated circuit substrate and connected to the second winding of the transformer.

51. The integrated circuit of claim 34, further comprising a flux conductor separate from the magnetic core, the flux conductor formed on a second side of the integrated circuit substrate facing a second direction opposite to a first direction faced by the side of the integrated circuit on which the transformer is formed.

52. An integrated circuit, comprising:

an integrated circuit substrate; and

a transformer formed on one side of the integrated circuit substrate, the transformer including a first winding, a second winding, and a magnetic core, wherein the first and second windings intertwine with each other to wind about a same portion of the magnetic core, and the magnetic core is a solid magnetic core.

53. The integrated circuit of claim 52, wherein the first and second windings spiral about an axis substantially parallel to the side of the integrated circuit substrate and passing through the magnetic core.

54. The integrated circuit of claim 52, further comprising at least one layer of dielectric material between the magnetic core and the first and second windings to provide electric isolation between the magnetic core and the first and second windings.

55. The integrated circuit of claim 52, further comprising at least one layer of dielectric material between the first winding and the second winding to provide electric isolation between the first winding and the second winding.

56. The integrated circuit of claim 52, further comprising at least one layer of dielectric material between the transformer and the integrated circuit substrate to provide electric isolation between the transformer and the integrated circuit substrate.

57. The integrated circuit of claim 52, wherein the first and second windings include at least one layer of the integrated circuit.

58. An integrated circuit, comprising:

an integrated circuit substrate;

means for providing a first electrically conductive path;

means for providing a second electrically conductive path; and

means for providing a magnetically conductive path,

wherein the means for providing the first electrically conductive path, the means for providing the second electrically conductive path, and the means for providing the magnetically conductive path are formed on one side of the integrated circuit substrate, and

wherein the means for providing the first electrically conductive path and the means for providing the second electrically conductive path intertwine about a same portion of the means for providing the magnetically conductive path.