INTEGRATED INDUCTION COIL & MICROWAVE ANNTENNA AS AN ALL-PLANAR SOURCE

• US 20150348756A1
• Filed: 05/28/2014
• Published: 12/03/2015
• Est. Priority Date: 05/28/2014
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Ventzek, Peter L.G., Chen, Lee
• Granted Patent: US 9,530,621 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01J 37/3211 Antennas, e.g. particular shapes of coils
• CPC Class Codes: H01J 37/32192 Microwave generated discharge H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence
• CPC Class Codes: H01J 37/3222 Antennas
• CPC Class Codes: H01J 37/32229 Waveguides

Abstract

This disclosure relates to a plasma processing system that can use a single power source assembly to generate inductively coupled plasma (ICP) and surface wave plasma using the same physical hardware. The power source assembly may include an antenna plate that may include a conductive material be used an ICP coil for a radio frequency (RF) power source and as a slot antenna for a microwave source.

Claims

1. A plasma processing device for a substrate, comprising:

a plasma processing chamber;

a substrate holder, disposed in the plasma processing chamber, that can receive the substrate;

a microwave power supply that can generate microwave energy;

a radio frequency (RF) power supply that can generate RF energy; and

a slot antenna comprising;

a first dielectric component coupled to the microwave power supply and that can transmit the microwave energy;

a second dielectric component disposed between the first dielectric component and the substrate holder; and

a metal layer disposed between the first dielectric component and the second dielectric component and being coupled to the radio frequency power supply.

2. The device of claim 1, wherein the metal layer pattern comprises a pattern that enables the transmission of the microwave energy from the first dielectric component to the second dielectric component.

3. The device of claim 2, wherein the pattern comprises a continuous low impedance path starting proximate to the edge of the slot antenna and ending proximate to a center region of the slot antenna.

4. The device of claim 3, wherein the continuous path comprises a spiral, square, circle, rectangle, or triangle.

5. The device of claim 4, further comprising a ground proximate to the center of the slot antenna or at an outer edge of the slot antenna.

6. The device of claim 1, where in the metal layer comprises a thickness less than or equal to 1 mm.

7. The device of claim 5, wherein the first dielectric component comprises quartz or ceramic comprising a thickness that is proportional to no more than a ¼

wavelength of the power provided by the microwave power supply.

8. The device of claim 6, wherein the second dielectric component comprises quartz or ceramic comprising a thickness ranging from ¼

to ½

wavelength of the power provided by the microwave power supply.

9. The device of claim 1, wherein the conformal metal layer pattern can transmit the RF energy in an azimuthal direction and the second dielectric component can transmit the microwave energy and the RF energy.

10. The device of claim 1, wherein the metal layer pattern comprises a spiral shape starting proximate to an edge of the slot antenna and ending proximate to a center region of the slot antenna.

11. The device of claim 1, wherein the metal layer comprises a conformal metal layer pattern on a surface of the first dielectric component and the second dielectric component.

12. An antenna for generating plasma for treating a semiconductor substrate, comprising:

a first dielectric component that can be coupled to a microwave power supply and that can transmit microwave energy to generate the plasma for treating the semiconductor substrate;

a second dielectric component opposite from the first dielectric component; and

a metal layer on a surface of the first dielectric component or the second dielectric component, the metal layer that can be coupled to a radio frequency power supply.

13. A method for a substrate, comprising:

receiving the substrate on a substrate holder in a plasma processing chamber;

applying microwave power to a transmission assembly for the plasma processing chamber, the transmission assembly being opposite the substrate holder and comprising;

a microwave waveguide; and

a dielectric component opposite the microwave guide; and

applying radio frequency (RF) power to a metal electrode disposed between the dielectric component and the microwave waveguide, the metal electrode being coupled to a RF power source and electrical ground and comprising an opening used to transmit the microwave power towards the substrate holder.

14. The method of claim 13, wherein the application of the RF power and the microwave power is done concurrently or done in sequence.

15. The method of claim 13, wherein the applying of the microwave power further comprises generating plasma within the plasma processing chamber by energizing gas disposed within the plasma processing chamber.

16. The method of claim 15, wherein the applying of the RF power further comprises generating inductively coupled plasma within the plasma processing chamber by energizing gas disposed within the plasma processing chamber.

17. The method of claim 13, wherein the metal electrode forms a substantially concentric shape along the microwave waveguide comprising a RF power supply terminal proximate to a first end of the metal electrode and an electrical ground terminal proximate to a second end of the metal electrode.

18. The method of claim 13, wherein the metal electrode forms a substantially rectangular shape along the microwave waveguide comprising a RF power supply terminal proximate to a first end of the metal electrode and an electrical ground terminal proximate to a second end of the metal electrode.

19. The method of claim 13, wherein the metal electrode conforms to a side of the microwave waveguide.

20. The method of claim 13, wherein the opening comprises a rectangular, a square or oblong shape.