PERMANENT MAGNETIC CHUCK FOR OLED MASK CHUCKING

• US 20150348812A1
• Filed: 08/20/2014
• Published: 12/03/2015
• Est. Priority Date: 06/02/2014
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: WHITE, John M., WANG, Zuoqian
• Granted Patent: US 9,959,961 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: H01F 7/0226 PM with variable field strength H01F7/0284 takes precedence
• CPC Class Codes: H01F 7/0252 PM holding devices H01F7/021, H01F7/0215, H01F7/0226 take precedence

Abstract

A permanent magnetic mask chuck is described herein. The permanent magnetic mask chuck includes a body with a plurality of permanent magnets positioned therein. The permanent magnets can then deliver a magnetic force to a mask to position and hold the mask over or on the substrate for further deposition.

Claims

1. A processing system comprising:

a process chamber configured to deposit a material on the substrate; and

a permanent magnetic mask chuck positioned in the process chamber, the permanent magnetic mask chuck comprising;

a positioning device;

a plurality of permanent magnets coupled to the positioning device, the positioning device configured to control a magnitude of magnetic force provided to the mask such that the mask is magnetically chucked in position over the substrate.

2. The processing system of claim 1, wherein the positioning device is configured to move the permanent magnets in a sequential fashion.

3. The processing system of claim 2, wherein the positioning device is operable to position permanent magnets in a center portion of the permanent magnetic mask chuck closer to the mask relative to permanent magnets in a peripheral portion of the permanent magnetic mask chuck.

4. The processing system of claim 2, wherein a magnetic field produced by the permanent magnets is greater in a center portion of the permanent magnetic mask chuck relative to a peripheral portion of the permanent magnetic mask chuck.

5. The processing system of claim 1, wherein the positioning device is operable to position permanent magnets at one side of the permanent magnetic mask chuck closer to the mask relative to permanent magnets at an opposite side of the permanent magnetic mask chuck.

6. The processing system of claim 1, further comprising:

a support base for supporting a substrate, the support base comprising an electrode assembly configured to generate an electrostatic substrate chucking force, the electrode assembly and support base forming a unitary body configured for transport into and out of the processing chamber.

7. The processing system of claim 6, wherein the electrode assembly comprises:

a plurality of distributed electrodes, the plurality of distributed electrodes further comprises interleaving a first electrode with a second electrode.

8. A substrate carrier for use in a process chamber, the substrate carrier comprising:

a support base configured to move into and out of a process chamber, the support base comprising;

a substrate supporting surface; and

an electrode assembly operable to electrostatically chuck a substrate to the substrate supporting surface; and

a permanent magnetic mask chuck coupled to the support base, the permanent magnetic mask chuck comprising;

a chuck body having a first wall and a second wall, the first wall being proximate to the support base and the second wall being distal to the support base;

a plurality of permanent magnets positioned in the chuck body, the permanent magnets having a magnetic field; and

a positioning device to move the permanent magnetic mask chuck independent of the support base.

9. The substrate carrier of claim 8, wherein the plurality of permanent magnets are positionable within the chuck body such that a first magnet is closer to the substrate supporting surface than a second magnet.

10. The substrate carrier of claim 8, wherein the plurality of permanent magnets are moveable relative to the substrate supporting surface.

11. The substrate carrier of claim 10, further comprising an actuator disposed in the chuck body and operable to control the position of the permanent magnets relative to the substrate supporting surface.

12. The substrate carrier of claim 8, wherein the plurality of permanent magnets are positionable to produce a magnetic force which applies more force to one portion of the mask relative to another portion of the mask.

13. The substrate carrier of claim 12, wherein the positioning device is operable to move the plurality of permanent magnets to produce a stronger magnetic force at one portion of the substrate supporting surface relative to another portion of the substrate supporting surface.

14. The substrate carrier of claim 12, wherein the positioning device is operable to position move the permanent magnets closer to the substrate supporting surface in a center to edge sequence or an edge to opposite edge sequence.

15. The substrate carrier of claim 8, wherein the plurality of permanent magnets facing the substrate supporting surface have alternating polarity.

16. A method for chucking a mask in a process chamber, the method comprising:

transferring a substrate disposed on a substrate supporting surface of a substrate carrier into a process chamber;

moving a magnetic chuck towards the substrate supporting surface such that a plurality of permanent magnets of the magnetic chuck a mask to the substrate disposed on the substrate carrier; and

depositing a layer through the mask onto the substrate.

17. The method of claim 16, wherein the moving the magnetic chuck toward the substrate supporting surface further comprises moving magnetic chuck towards the substrate carrier.

18. The method of claim 17, moving the magnetic chuck toward the substrate supporting surface further comprises moving the permanent magnets closer to a first region of the substrate supporting surface relative to a second region of the substrate supporting surface.

19. The method of claim 17, wherein the plurality of permanent magnets are disposed within the substrate carrier.

20. The method of claim 19, wherein the magnetic chuck is remote from the substrate carrier.