MULTI-AXIS SENSOR

• US 20150355219A1
• Filed: 01/05/2015
• Published: 12/10/2015
• Est. Priority Date: 06/10/2014
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: LEE, Jung Won, LEE, Hyun Kee, SONG, Jong Hyeong, KANG, Pil Joong
• Application Number:
  US14/589,206
• Publication Number:
  US 20150355219A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/0292 Sensors not provided for in B81B2201/0207 - B81B2201/0285
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: G01C 19/5783 Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/093 by photoelectric pick-up
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0842 the mass being of clover leaf shape

Abstract

Embodiments of the invention provide a multi-axis sensor, including a first sensor embedded in an embedded substrate to sense a position, and a second sensor formed on a lower cap substrate bonded on the embedded substrate by a wafer level package scheme to sense an inertial force.

Claims

1. A multi-axis sensor, comprising:

a first sensor embedded in an embedded substrate and configured to sense a position; and

a second sensor formed on a lower cap substrate bonded on the embedded substrate by a wafer level package scheme and configured to sense an inertial force.

2. The multi-axis sensor of claim 1, wherein the embedded substrate and the lower cap substrate are gap filled by having a vertical conductive epoxy interposed therebetween and bonded to each other.

3. The multi-axis sensor of claim 1, wherein the embedded substrate and the lower cap substrate each have a vertical length of 2 mm to 4 mm and a horizontal length of 1 mm to 2 mm.

4. The multi-axis sensor of claim 1, wherein the embedded substrate has a height of 100 μ

m to 300 μ

m.

5. The multi-axis sensor of claim 1, wherein the lower cap substrate comprises an electrical wiring formed in horizontal/vertical directions and is made of a hermetic seal bonding material.

6. The multi-axis sensor of claim 1, wherein the lower cap substrate is made of any one of low temperature co-fired ceramic, glass, interposer, application specific integrated circuit, and silicon.

7. The multi-axis sensor of claim 1, wherein the first sensor is a 3-axis earth magnetic field sensor, which is formed by a single-in-line package scheme to sense a position.

8. The multi-axis sensor of claim 7, wherein the earth magnetic field sensor has a width of 1 m² to 1.5 m².

9. The multi-axis sensor of claim 7, wherein one surface of the earth magnetic field sensor is provided with an electrode pad, and the other surface opposite to the one surface of the earth magnetic field sensor is bonded and embedded in a cavity formed on the embedded substrate, so that the electrode pad is exposed to the outside.

10. The multi-axis sensor of claim 9, wherein the electrode pad is formed on upper and lower surfaces or both sides of the earth magnetic field sensor.

11. The multi-axis sensor of claim 9, wherein the cavity is formed to be wider than the earth magnetic field sensor.

12. The multi-axis sensor of claim 9, wherein the embedded substrate comprises:

a core layer provided with the cavity;

an insulating layer deposited on a lower surface of the core layer to support the earth magnetic field sensor;

a plurality of wiring patterns formed on the core layer and electrically connected to the earth magnetic field sensor, which is boned and embedded in the cavity; and

a build-up layer stacked on an upper surface of the core layer including the earth magnetic field sensor.

13. The multi-axis sensor of claim 12, wherein the embedded substrate further comprises a plurality of through holes, which are formed by vertically penetrating through the build-up layer, the core layer, and the insulating layer and electrically connected to the earth magnetic field sensor through the wiring patterns.

14. The multi-axis sensor of claim 9, wherein the embedded substrate comprises:

a core layer provided with the cavity;

an insulating layer formed on a lower surface of the core layer to support the earth magnetic field sensor; and

a plurality of wiring patterns formed in the insulating layer and electrically connected to the earth magnetic field sensor, which is boned and embedded in the cavity.

15. The multi-axis sensor of claim 1, wherein the second sensor comprises a 3-axis acceleration sensor and a 3-axis angular velocity sensor.

16. The multi-axis sensor of claim 1, wherein the second sensor comprises a hermetic seal, which is made of any one of glass, silicon nitride and metal.

17. The multi-axis sensor of claim 1, wherein the second sensor comprises an upper cap substrate and the lower cap substrate, and the upper cap substrate and the lower cap substrate are each formed of an application specific integrated circuit.