TOUCH PANEL

• US 20150355747A1
• Filed: 06/09/2014
• Published: 12/10/2015
• Est. Priority Date: 06/08/2013
• Status: Active Grant

• Current Assignee: TPK Touch Solutions (Xiamen) Inc. (TPK Holding Co., Ltd.)
• Original Assignee: TPK Touch Solutions (Xiamen) Inc. (TPK Holding Co., Ltd.)
• Inventors: Yu, Jing, Su, Yuncong, Huang, Li, Lin, Yalu
• Granted Patent: US 9,383,875 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06F 1/16 Constructional details or arrangements
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 2203/04111 Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H03K 17/962 Capacitive touch switches

Abstract

A touch panel is provided. The touch panel includes at least a bonding pad, a touch-sensing structure and at least a protection component. The bonding pad has a first long side, a first short side, a second long side, and a second short side. The first long side is adjacent to the first short side and the second short side, and the first long side is opposite to the second long side. A touch-sensing structure is electrically connected to the first short side of the bonding pad. The protection component is disposed at the first long side and the second long side.

Claims

1. A touch panel, comprising:

at least a bonding pad, including a first long side, a second long side, a first short side, and a second short side, wherein the first long side is adjacent to the first short side and the second short side, and opposite to the second long side;

a touch-sensing structure electrically connected to the first short side of the bonding pad; and

at least a protection component disposed at the first long side and the second long side of the bonding pad.

2. The touch panel of claim 1, wherein the protection component is further disposed at the second short side of the bonding pad.

3. The touch panel of claim 1, wherein the bonding pad further comprises a top surface adjacent to the first long side, the second long side, the first short side, and the second short side, and the protection component further extends to cover the top surface of the bonding pad and has at least one opening to expose a part of the top surface of the bonding pad.

4. The touch panel of claim 3, wherein the bonding pads are disposed apart from each other, a gap is formed between the adjacent bonding pads, and the protection component further covers the gap.

5. The touch panel of claim 3, further comprising a conductive component filling in the opening of the protection component.

6. The touch panel of claim 5, wherein the conductive component has a top surface level with a top surface of the protection component.

7. The touch panel of claim 1, wherein the material of the protection component comprises an insulating material.

8. The touch panel of claim 5, wherein the material of the conductive component comprises a metal and the material of the protection component comprises a non-conductive metal oxide.

9. The touch panel of claim 8, wherein the conductive component and the protection component are an integrated structure.

10. The touch panel of claim 4, wherein the protection component comprises a plurality of strips crossing each other and the strips of the protection component are integrated to form an insulating net-shaped structure on each of the bonding pads and each of the gaps between the bonding pads.

11. The touch panel of claim 4, wherein the protection component comprises a plurality of strips parallel to each other and the strips of the protection component are integrated to form an insulating fence-shaped structure on each of the bonding pads and each of the gaps between the bonding pads.

12. The touch panel of claim 11, wherein the strips parallel to each other are tilted to the first long side and the second long side of the bonding pads.

13. The touch panel of claim 3, further comprising conductive glue bonded onto the bonding pad, wherein the conductive glue includes a plurality of conductive particles, the conductive particles have a first thickness before bonding onto the bonding pad, the opening of the protection component has a height, and wherein the height of the opening is 0.1-0.7 times the first thickness.

14. The touch panel of claim 13, wherein the height of the opening is 0.5 times the first thickness.

15. The touch panel of claim 14, further comprising a flexible printed circuit board, wherein the conductive glue is bonded between the flexible printed circuit board and the bonding pads, the conductive particles have a second thickness after the flexible printed circuit board is bonded to the bonding pads, and the second thickness is equal to the height of the opening.

16. The touch panel of claim 1, further comprising:

a cover lens, having a lower surface; and

a mask layer disposed under the lower surface of the cover lens, wherein the cover lens is defined by the mask layer to have a viewable area and a non-viewable area, the mask layer is located at the non-viewable area, the touch-sensing structure is disposed under the lower surface of the cover lens and located at the viewable area, the bonding pad is disposed on the mask layer and shielded by the mask layer.

17. The touch panel of claim 1, further comprising:

a cover lens, having a lower surface;

a mask layer disposed under the lower surface of the cover lens, wherein the cover lens is defined by the mask layer to have a viewable area and a non-viewable area, and the mask layer is located at the non-viewable area; and

a substrate disposed under the cover lens, wherein the touch-sensing structure is disposed on the substrate and located at the viewable area, the bonding pad is disposed on the substrate and shielded by the mask layer.