WAFER LEVEL STEPPED SENSOR HOLDER

• US 20150358510A1
• Filed: 06/10/2014
• Published: 12/10/2015
• Est. Priority Date: 06/10/2014
• Status: Active Grant

• Current Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Original Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Inventors: Wan, Tsung-Wei, Deng, Jau-Jan, Chen, Wei-Ping
• Granted Patent: US 9,467,606 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

An apparatus includes an image sensor that is bonded to a spacer. The spacer has a thinned wall that defines a step and a recess in an interior wall at a first end of the spacer. The image sensor is bonded to the step within the recess of the spacer such that the image sensor is accepted completely within the recess of the spacer. A glass wafer is mounted on a second end of the spacer. A lens is mounted on the glass wafer such that light is to be directed through the lens to the image sensor.

Claims

1. An apparatus comprising:

an image sensor;

a spacer having a thinned wall that defines a step and a recess in an interior wall at a first end of the spacer, wherein the image sensor is bonded to the step within the recess of the spacer such that the image sensor is accepted completely within the recess of the spacer;

a glass wafer mounted on a second end of the spacer; and

a lens mounted on the glass wafer, wherein light is to be directed through the lens to the image sensor.

2. The apparatus of claim 1 wherein lateral sidewalls of the image sensor are enclosed completely by the thinned wall of the spacer.

3. The apparatus of claim 2 wherein the thinned wall of the spacer blocks completely all light leaks proximate to the lateral sidewalls of the image sensor.

4. The apparatus of claim 1 further comprising a plurality of solder balls mounted to the image sensor on a side of the image sensor opposite the spacer.

5. The apparatus of claim 1 wherein the spacer is a first spacer, the glass wafer is a first glass wafer, and the lens is a first lens, wherein the apparatus further comprises:

a second spacer mounted to the first glass wafer such that the first glass wafer is disposed between the first spacer and the second spacer;

a second glass wafer mounted to the second spacer such that the second spacer is disposed between the first glass wafer and the second glass wafer; and

a second lens mounted on the second glass wafer, wherein light is to be directed through the second lens and the first lens to the image sensor.

6. The apparatus of claim 5 wherein the first and second lenses are two of a plurality of lenses mounted to the first and second glass wafers.

7. The apparatus of claim 1 wherein the spacer comprises at least one of resin, plastic and glass.

8. The apparatus of claim 1 wherein the spacer, the glass wafer and the lens are included in a lens stack, wherein the lens stack is attached to the image sensor without a barrel.

9. An imaging system, comprising:

an image sensor including a pixel array having a plurality of pixel cells arranged therein;

a spacer having a thinned wall that defines a step and a recess in an interior wall at a first end of the spacer, wherein the image sensor is bonded to the step within the recess of the spacer such that the image sensor is accepted completely within the recess of the spacer;

a glass wafer mounted on a second end of the spacer; and

a lens mounted on the glass wafer, wherein light is to be directed through the lens to the image sensor;

control circuitry coupled to the pixel array to control operation of the pixel array; and

readout circuitry coupled to the pixel array to readout image data from the plurality of pixel cells.

10. The imaging system of claim 9 further comprising function logic coupled to the readout circuitry to store the image data readout from the plurality of pixel cells.

11. The imaging system of claim 9 wherein lateral sidewalls of the image sensor are enclosed completely by the thinned wall of the spacer.

12. The imaging system of claim 11 wherein the thinned wall of the spacer blocks completely all light leaks proximate to the lateral sidewalls of the image sensor.

13. The imaging system of claim 9 further comprising a plurality of solder balls mounted to the image sensor on a side of the image sensor opposite the spacer.

14. The imaging system of claim 9 wherein the spacer is a first spacer, the glass wafer is a first glass wafer, and the lens is a first lens, wherein the apparatus further comprises:

a second spacer mounted to the first glass wafer such that the first glass wafer is disposed between the first spacer and the second spacer;

a second glass wafer mounted to the second spacer such that the second spacer is disposed between the first glass wafer and the second glass wafer; and

a second lens mounted on the second glass wafer, wherein light is to be directed through the second lens and the first lens to the image sensor.

15. The imaging system of claim 14 wherein the first and second lenses are two of a plurality of lenses mounted to the first and second glass wafers.

16. The imaging system of claim 9 wherein the spacer comprises at least one of resin, plastic and glass.

17. The imaging system of claim 9 wherein the spacer, the glass wafer and the lens are included in a lens stack, wherein the lens stack is attached to the image sensor without a barrel.