Microelectromechanical system and method for manufacturing a microelectromechanical system

• US 20150360934A1
• Filed: 06/16/2015
• Published: 12/17/2015
• Est. Priority Date: 06/17/2014
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Grabmaier, Florian
• Application Number:
  US14/740,462
• Publication Number:
  US 20150360934A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 20/026 with diffusion of soldering material
• CPC Class Codes: B23K 20/16 with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B81C 1/00095 Interconnects
• CPC Class Codes: B81C 2203/035 Soldering
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits

Abstract

A microelectromechanical system includes a microelectromechanical element and a substrate, in which an element surface of the element and a substrate surface of the substrate is integrally joined with the aid of an eutectic alloy at at least one joint. Also described is a method for manufacturing a microelectromechanical system.

Claims

1. A microelectromechanical system, comprising:

a microelectromechanical element; and

a substrate;

wherein an element surface of the element and a substrate surface of the substrate is integrally joined with the aid of an eutectic alloy at at least one joint.

2. The microelectromechanical system of claim 1, wherein at least one joint is electrically connected to an electrical contact of the element.

3. The microelectromechanical system of claim 1, wherein at least two joints are situated in a grid structure.

4. The microelectromechanical system of claim 1, wherein a joint having an intrinsically closed shape which surrounds the remaining joints is formed so that a hermetical seal for the remaining joints is formed with the aid of the substrate, the element and the intrinsically closed joint.

5. The microelectromechanical system of claim 1, wherein the substrate includes at least one via electrically connected to a joint for an electrical connection between the substrate surface and an additional substrate surface situated opposite the substrate surface.

6. The microelectromechanical system of claim 5, wherein at least one component electrically connected to the via is situated on the additional substrate surface.

7. The microelectromechanical system of claim 6, wherein the component is hermetically sealed with the aid of a cap.

8. The microelectromechanical system of claim 7, wherein the cap is soldered and/or welded onto the additional substrate surface.

9. A method for manufacturing a microelectromechanical system, the method comprising:

providing a microelectromechanical element and a substrate; and

integrally joining an element surface of the element and a substrate surface of the substrate with one another at at least one joint with the aid of an eutectic alloy.

10. The method of claim 9, wherein the element surface includes a first metal plating structure made of a first metal, the substrate surface includes a second metal plating structure made of a second metal, the first metal and the second metal forming an eutectic system, the joining including performing:

pressing the two metal plating structures onto each other so that at least one joint is formed corresponding to the metal plating structures; and

melting the two metals so that the molten metals form an eutectic alloy at the joint.