WAFER-LEVEL MOLDING CHASE DESIGN

• US 20150364456A1
• Filed: 06/12/2014
• Published: 12/17/2015
• Est. Priority Date: 06/12/2014
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Yu, Chen-Hua, Liu, Chung-Shi, Huang, Hui-Min, Huang, Chih-Fan, Cheng, Ming-Da, Chen, Meng-Tse, Jang, Bor-Ping, Hwang, Chien Ling
• Granted Patent: US 10,020,211 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B29C 2045/0049 the injected material flowing against a mould cavity protruding part
• CPC Class Codes: B29C 2045/14663 the mould cavity walls being lined with a film, e.g. release film
• CPC Class Codes: B29C 45/0046 Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
• CPC Class Codes: B29C 45/02 Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29C 45/14836 Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage B29C45/14434 takes precedence
• CPC Class Codes: B29C 45/34 having venting means
• CPC Class Codes: B29L 2031/34 Electrical apparatus, e.g. sparking plugs or parts thereof
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 24/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/18161 of a flip chip

Abstract

An apparatus includes a mold chase, which includes a top portion and an edge ring having a ring-shape. The edge ring is underlying and connected to an edge of the top portion. The edge ring has an injection port and a venting port. A molding guide kit is configured to be inserted into the injection port. The molding guide kit includes a front sidewall having a curved front edge.

Claims

1. An apparatus comprising:

a mold chase comprising;

a top portion; and

an edge ring having a ring-shape, wherein the edge ring is underlying and connected to an edge of the top portion, and wherein the edge ring comprises an injection port and a venting port; and

a molding guide kit configured to be inserted into the injection port, wherein the molding guide kit comprises a front sidewall having a curved front edge.

2. The apparatus of claim 1, wherein the edge ring comprises an inner edge facing an inner space encircled by the edge ring, wherein the edge ring has a first radius, and wherein the curved front edge of the front sidewall of the molding guide kit has a second radius substantially equal to the first radius.

3. The apparatus of claim 2, wherein the molding guide kit is configured to have the curved front edge aligned to the inner edge of the edge ring with the molding guide kit in the injection port.

4. The apparatus of claim 1, wherein the front sidewall of the molding guide kit is a slanted sidewall.

5. The apparatus of claim 1, wherein the front sidewall of the molding guide kit is a vertical sidewall.

6. The apparatus of claim 1, wherein the mold chase further comprises a protrusion at a joint of the top portion and the edge ring of the mold chase, and the protrusion is misaligned from a diameter of the mold chase connecting the injection port to the venting port.

7. The apparatus of claim 1, wherein the molding guide kit is configured to seal the injection port.

8. The apparatus of claim 1 further comprising a venting blocker configured to block the venting port when the venting blocker is at a pushed-down position, wherein the venting blocker comprises a curved edge facing an inner space of the mold chase.

9. An apparatus comprising:

a mold chase comprising an edge ring having a ring-shape, wherein the edge ring comprises;

an injection port; and

a venting port aligned to a diameter of the edge ring, wherein the injection port and the venting port connect an inner space encircled by the edge ring to a space outside of the edge ring; and

a molding guide kit configured to be inserted into the injection port, wherein the molding guide kit comprises;

a channel connected to the inner space; and

a front sidewall facing the inner space, wherein the front sidewall is curved.

10. The apparatus of claim 9 further comprising a venting blocker configured to block the venting port, wherein the venting blocker comprises a curved inner sidewall facing the inner space.

11. The apparatus of claim 10, wherein the inner sidewall of the venting blocker is aligned to an inner edge of the edge ring, with the inner sidewall of the venting blocker and the inner edge of the edge ring having a substantially same radius.

12. The apparatus of claim 10, wherein portions of an inner edge of the edge ring on opposite sides of the venting port are curved.

13. The apparatus of claim 9, wherein the channel comprises a shallow portion and a deep portion deeper than the shallow portion, wherein the deep portion is connected to the shallow portion.

14. The apparatus of claim 9, wherein the mold chase further comprises:

a top portion, with the edge ring connected to a round edge of the top portion; and

a protrusion at a joint of the top portion and the edge ring of the mold chase, wherein the protrusion is misaligned from the diameter connecting the injection port to the venting port.

15. A method comprising:

placing a release film on an inner surface of a mold chase, wherein the mold chase comprises;

a top portion; and

an edge ring having a ring-shape, wherein the edge ring is underlying and connected to an edge of the top portion, and the edge ring comprises an injection port and a venting port;

placing the mold chase and the release film over a package structure, with the edge ring encircling the package structure; and

inserting a molding guide kit into the injection port, wherein the molding guide kit comprises;

a channel connected to an inner space encircled by the edge ring; and

a front sidewall facing the inner space, with the front sidewall having a curved front edge aligned to an inner edge of the edge ring of the mold chase.

16. The method of claim 15 further comprising injecting a molding material into the inner space through the channel.

17. The method of claim 15, wherein the package structure comprises:

a carrier; and

a plurality of device dies over the carrier, wherein the plurality of device dies is arranged as a plurality of rows and columns with streets separating the plurality of rows and columns, and wherein after the placing the mold chase, the injection port and the venting port are aligned to one of the streets.

18. The method of claim 17 further comprising:

attaching a pressure sensor to a bottom surface of the top portion of the mold chase, wherein the pressure sensor is not directly over any of top device dies of the package structure.

19. The method of claim 15, wherein the molding chase comprises a protrusion at a joint of the top portion and the edge ring, wherein the protrusion is misaligned from a line connecting the injection port and the venting port.

20. The method of claim 15 further comprising pushing down a venting blocker to block the venting port, wherein the venting blocker comprises a curved inner sidewall.