PACKAGE STRUCTURE FOR FLEXIBLE ORGANIC LIGHT EMITTING DIODE DEVICE, METHOD FOR PACKAGING THE SAME AND FLEXIBLE DISPLAY DEVICE

• US 20150364718A1
• Filed: 06/12/2014
• Published: 12/17/2015
• Est. Priority Date: 09/09/2013
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: ZHOU, Weifeng, HUANG, Wei
• Granted Patent: US 9,431,630 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 2102/351 Thickness
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/80 using temporary substrates
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells

Abstract

According to the present disclosure, there is provided a package structure for a flexible organic light emitting diode (OLED) device, which may include: a flexible substrate, arranged to support the OLED device; a packaging layer, provided on the flexible substrate; the OLED device, provided on the packaging layer; and a waterproof and oxygenproof transparent thin film, covering the OLED device.

Claims

1. A package structure for a flexible organic light emitting diode (OLED) device, comprising:

a flexible substrate, arranged to support the OLED device;

a packaging layer, provided on the flexible substrate;

the OLED device, provided on the packaging layer; and

a waterproof and oxygenproof transparent thin film, covering the OLED device.

2. The package structure for the flexible OLED device according to claim 1, further comprising:

the flexible substrate, provided on the waterproof and oxygenproof transparent thin film.

3. The package structure for the flexible OLED device according to claim 1, wherein the flexible substrate comprises:

ultra-thin glass, having flexibility; and

a waterproof and oxygenproof resin layer, covering the ultra-thin glass.

4. The package structure for the flexible OLED device according to claim 3, wherein

a size of the waterproof and oxygenproof resin layer is slightly larger than that of the ultra-thin glass.

5. The package structure for the flexible OLED device according to claim 4, wherein both length and width of the waterproof and oxygenproof resin layer exceed those of the ultra-thin glass by 0.1-2 mm.

6. The package structure for the flexible OLED device according to claim 3, wherein a thickness of the ultra-thin glass is 0.05-0.2 mm and a flexible radius thereof is 40-80 mm;

and

a thickness of the waterproof and oxygenproof resin layer is 0.03-3 mm.

8. The package structure for the flexible OLED device according to claim 1, wherein the flexible substrate comprises:

a metal thin film; and

a waterproof and oxygenproof resin layer, covering the metal thin film.

7. (canceled)

9. A flexible display device, which comprises a package structure for a flexible organic light emitting diode (OLED) device, the flexible display device comprising:

a flexible substrate, arranged to support the OLED device;

a packaging layer, provided on the flexible substrate;

the OLED device, provided on the packaging layer; and

a waterproof and oxygenproof transparent thin film, covering the OLED device.

10. The flexible display device according to claim 9, wherein

the flexible display device comprises at least one of electronic papers, televisions (TVs), display devices, digital photo frames, mobile phones and tablet computers.

17. The flexible display device according to claim 9, further comprising:

the flexible substrate, provided on the waterproof and oxygenproof transparent thin film.

18. The flexible display device according to claim 9, wherein the flexible substrate comprises:

ultra-thin glass, having flexibility; and

a waterproof and oxygenproof resin layer, covering the ultra-thin glass.

19. The flexible display device according to claim 18, wherein

a size of the waterproof and oxygenproof resin layer is slightly larger than that of the ultra-thin glass.

20. The flexible display device according to claim 19, wherein both length and width of the waterproof and oxygenproof resin layer exceed those of the ultra-thin glass by 0.1-2 mm.

21. The flexible display device according to claim 18, wherein a thickness of the ultra-thin glass is 0.05-0.2 mm and a flexible radius thereof is 40-80 mm;

and a thickness of the waterproof and oxygenproof resin layer is 0.03-3 mm.

22. The flexible display device according to claim 9, wherein the flexible substrate comprises:

a metal thin film; and

a waterproof and oxygenproof resin layer, covering the metal thin film.

11. A method for packaging a flexible organic light emitting diode (OLED) device, comprising:

providing a first transparent rigid substrate attached with a waterproof and oxygenproof transparent thin film;

attaching the OLED device on the waterproof and oxygenproof transparent thin film;

forming a packaging layer on the OLED device;

providing a second transparent rigid substrate;

forming a flexible substrate on the second transparent rigid substrate;

forming a cell by using the first transparent rigid substrate on which the packaging layer is formed and the second transparent rigid substrate on which the flexible substrate is formed, and packaging the first transparent rigid substrate and the second transparent rigid substrate within the cell; and

removing the first transparent rigid substrate and the second transparent rigid substrate.

12. The method according to claim 11, wherein the step of forming a flexible substrate on the second transparent rigid substrate comprises:

attaching ultra-thin glass having flexibility on the second transparent rigid substrate; and

forming a waterproof and oxygenproof resin layer covering the ultra-thin glass on the ultra-thin glass.

13. The method according to claim 11, wherein the flexible substrate is further provided between the waterproof and oxygenproof transparent thin film and the first transparent rigid substrate.

14. The method according to claim 11, wherein the step of forming a flexible substrate on the second transparent rigid substrate comprises:

attaching a metal thin film on the second transparent rigid substrate; and

forming a waterproof and oxygenproof resin layer covering the metal thin film on the metal thin film.

15. The method according to claim 11, wherein

if an adhesive tape is used to attach the first transparent rigid substrate with the waterproof and oxygenproof transparent thin film and to attach the second transparent rigid substrate with the flexible substrate, then a mechanical method is applied in the step of removing the first transparent rigid substrate and the second transparent rigid substrate;

or

if a removable layer is used to attach the first transparent rigid substrate with the waterproof and oxygenproof transparent thin film and to attach the second transparent rigid substrate with the flexible substrate, then an ultraviolet irradiation method is applied in the step of removing the first transparent rigid substrate and the second transparent rigid substrate.

16. (canceled)