NESTED-HELICAL TRANSFORMER

• US 20150371763A1
• Filed: 06/20/2014
• Published: 12/24/2015
• Est. Priority Date: 06/20/2014
• Status: Abandoned Application

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Gordin, Rachel, Shapiro, Michael J., Van Duyne, William F., NI, WAN
• Application Number:
  US14/310,054
• Publication Number:
  US 20150371763A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 2017/004 with the coil helically wound around an axis without a core
• CPC Class Codes: Y10T 29/49021 Magnetic recording reproducing transducer [e.g., tape head, core, etc.]

Abstract

Some examples describe a first helical electromagnetic coil of a transformer. In some instances, at least a portion of the first helical electromagnetic coil is inside a first semi-conductive substrate. Further, in some examples, the first helical electromagnetic coil has a shape with an internal space. Further, some examples describe a second helical electromagnetic coil of the transformer. In some instances, at least a portion of the second helical electromagnetic coil is nested within the internal space of the first helical electromagnetic coil. Further, in some examples, the at least the portion of the second electromagnetic coil is inside the first semi-conductive substrate.

Claims

1. An apparatus comprising:

a first helical electromagnetic coil of a transformer, wherein at least a first portion of the first helical electromagnetic coil is inside a first semi-conductive substrate, and wherein the first helical electromagnetic coil has a shape with an internal space; and

a second helical electromagnetic coil of the transformer, wherein at least a portion of the second helical electromagnetic coil is nested within the internal space of the first helical electromagnetic coil, and wherein the at least the portion of the second electromagnetic coil is inside the first semi-conductive substrate.

2. The apparatus of claim 1, wherein the first helical electromagnetic coil comprises first vias formed through the first semi-conductive substrate, and wherein the second helical electromagnetic coil is contained within the first semi-conductive substrate.

3. The apparatus of claim 1, wherein one or more of a second portion of the first helical electromagnetic coil and a second portion of the second helical electromagnetic coil are inside one or more additional semi-conductive substrates different from the first semi-conductive substrate.

4. The apparatus of claim 1, wherein the first helical electromagnetic coil comprises a first cuboid, double-helix frame with a space inside the first cuboid, double-helix frame, and wherein the second helical electromagnetic coil comprises a second cuboid, double-helix frame contained within the space inside the first cuboid, double-helix frame.

5. The apparatus of claim 4, wherein the first cuboid, double-helix frame comprises:

a first set of vias of the first helical structure formed through the first semi-conductive substrate at a first side of the cuboid, double-helix frame;

a second set of vias of the first helical structure are formed through the first semi-conductive substrate at a second side of the cuboid, double-helix frame opposite to the first side;

first metal wires at a third side of the cuboid, double-helix frame, wherein the first metal wires connect to first ends of the first set of vias and to first ends of the second set of vias; and

second metal wires at a fourth side of the cuboid, double-helix frame opposite to the third side, wherein the second metal wires connect to second ends of the first set of vias and to second ends of the second set of vias.

6. The apparatus of claim 5, wherein the first set of vias are parallel to the second set of vias, wherein the first metal wires are parallel to the second metal wires, and wherein the first set of vias and the second set of vias are perpendicular to the first metal wires and the second metal wires.

7. The apparatus of claim 5, wherein the first set of vias and the second set of vias are in the first semi-conductive substrate, wherein the first metal wires are inside a second semi-conductive substrate, wherein the third metal wires are inside a third semi-conductive substrate.

8. The apparatus of claim 7, wherein first micro-bumps at the first side of the first helical structure connect the first metal wires to the first ends of the first set of vias, wherein second micro-bumps at the second side of the first helical structure connect the first metal wires to the first ends of the second set of vias, wherein third micro-bumps at the first side of the first helical structure connect the second metal wires to the second ends of the first set of vias, and wherein fourth micro-bumps at the second side of the first helical structure connect the second metal wires to the second ends of the second set of vias.

9. The apparatus of claim 5, wherein the second helical structure has a second cuboid, double-helix frame comprising:

a third set of vias formed through the first semi-conductive substrate at a first side of the second cuboid, double-helix frame parallel to the first side of the first cuboid, double-helix frame;

a fourth set of vias formed through the first semi-conductive substrate at a second side of the second cuboid, double-helix frame parallel to the second side of the first cuboid, double-helix frame;

third metal wires at a third side of the second cuboid, double-helix frame, wherein the third metal wires connect to first ends of the third set of vias and to first ends of the fourth set of vias; and

fourth metal wires at a fourth side of the second cuboid, double-helix frame, wherein the fourth metal wires connect to second ends of the third set of vias and to second ends of the fourth set of vias, wherein the third vias are parallel to the fourth vias, and wherein the third metal wires are parallel to the fourth metal wires.

10. An method of forming a nested helical transformer, said method comprising:

forming a first helical electromagnetic coil of the nested helical transformer, wherein at least a portion of the first helical electromagnetic coil is inside a first semi-conductive substrate, and wherein a helical shape of first windings of the first helical electromagnetic includes an internal space; and

forming a second helical electromagnetic coil of the transformer, wherein at least a portion of the second helical electromagnetic coil is nested within the internal space of the first helical electromagnetic coil, and wherein the at least the portion of the second electromagnetic coil is inside the first semi-conductive substrate.

11. The method of claim 10, wherein the forming the first helical electromagnetic coil comprises forming first vias through the first semi-conductive substrate, and wherein the second helical electromagnetic coil is contained within the first semi-conductive substrate.

12. The method of claim 10, wherein the forming the first helical electromagnetic coil comprises forming at least an additional portion of the first helical electromagnetic coil inside a second semi-conductive substrate different from the first semi-conductive substrate.

13. The method of claim 10, wherein the forming the first helical electromagnetic coil comprises forming a first cuboid, double-helix shape with a cuboid space inside the first cuboid, double-helix shape, and wherein the forming the second helical electromagnetic coil comprises forming a second cuboid, double-helix shape contained within the cuboid space inside the first cuboid, double-helix shape.

14. The method of claim 13, wherein the forming the first cuboid, double-helix shape comprises:

forming a first set of vias through the first semi-conductive substrate as a first side of the first cuboid, double-helix shape;

forming a second set of vias through the first semi-conductive substrate as a second side of the first cuboid, double-helix shape opposite to the first side;

forming first metal wires as a third side of the first cuboid, double-helix shape;

connecting the first metal wires to first ends of the first set of vias;

connecting the second metal wires to first ends of the second set of vias;

forming second metal wires as a fourth side of the first cuboid, double-helix shape opposite to the third side;

connecting the second metal wires to second ends of the first set of vias; and

connecting the second to second ends of the second set of vias.

15. The method of claim 14, wherein the first set of vias are parallel to the second set of vias, wherein the first metal wires are parallel to the second metal wires, and wherein the first set of vias and the second set of vias are perpendicular to the first metal wires and the second metal wires.

16. The method of claim 14, wherein the first set of vias and the second set of vias are in the first semi-conductive substrate, wherein the first metal wires are inside a second semi-conductive substrate, wherein the third metal wires are inside a third semi-conductive substrate.

17. The method of claim 16 further comprising:

forming first micro-bumps at the first side of the first cuboid, double-helix shape, wherein the first micro-bumps connect the first metal wires to the first ends of the first set of vias;

forming second micro-bumps at the second side of the first cuboid, double-helix shape, wherein the second micro-bumps connect the first metal wires to the first ends of the second set of vias;

forming third micro-bumps at the first side of the first cuboid, double-helix shape, wherein the third micro-bumps connect the second metal wires to the second ends of the first set of vias; and

forming fourth micro-bumps at the second side of the first cuboid, double-helix shape, wherein the fourth micro-bumps connect the second metal wires to the second ends of the second set of vias.

18. The method of claim 14, wherein the forming the second cuboid, double-helix shape comprises:

forming a third set of vias through the first semi-conductive substrate as a first side of the second cuboid, double-helix shape parallel to the first side of the first cuboid, double-helix shape;

forming a fourth set of vias through the first semi-conductive substrate as a second side of the second cuboid, double-helix shape parallel to the second side of the first cuboid, double-helix shape;

forming third metal wires as a third side of the second cuboid, double-helix shape, wherein the third metal wires connect to first ends of the third set of vias and to first ends of the fourth set of vias; and

forming fourth metal wires at a fourth side of the second cuboid, double-helix shape, wherein the fourth metal wires connect to second ends of the third set of vias and to second ends of the fourth set of vias, wherein the third vias are parallel to the fourth vias, and wherein the third metal wires are parallel to the fourth metal wires.

19. An apparatus comprising:

a first stratum of a stacked semi-conductive structure;

a second stratum of the stacked semi-conductive structure;

a first helical electromagnetic coil of a transformer, wherein a first portion of the first helical electromagnetic coil is inside the first stratum, wherein a second portion of the first helical electromagnetic coil is inside the second stratum, and wherein the first helical electromagnetic coil has a shape with an internal space; and

a second helical electromagnetic coil of the transformer, wherein at least a portion of the second helical electromagnetic coil is nested within the internal space of the first helical electromagnetic coil, and wherein the at least the portion of the second electromagnetic coil is inside the second stratum.

20. The apparatus of claim 19, wherein the first stratum is included in a first semi-conductive die, wherein the second stratum is included in a second semi-conductive die stacked on the first semi-conductive die, wherein the first portion of the first helical electromagnetic coil comprises metal wires inside the first stratum, wherein the second portion of the first helical electromagnetic coil comprises through-silicon vias inside the second stratum, and further comprising:

micro-bumps, wherein the micro-bumps connect the metal wires inside the first stratum to the through-silicon vias inside the second stratum.