METHOD FOR FABRICATING AND MANUFACTURING MICRO- and NANO-FABRICATED DEVICES AND SYSTEMS SECURELY

• US 20150371890A1
• Filed: 06/19/2014
• Published: 12/24/2015
• Est. Priority Date: 06/19/2014
• Status: Active Grant

• Current Assignee: Corporation for National Research Initiatives
• Original Assignee: Corporation for National Research Initiatives
• Inventors: Huff, Michael A.
• Granted Patent: US 9,646,878 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B81C 99/0055 Manufacturing logistics
• CPC Class Codes: H01L 21/76838 characterised by the formation and the after-treatment of the conductors etching for patterning the conductors H01L21/3213
• CPC Class Codes: H01L 21/823892 with a particular manufacturing method of the wells or tubs, e.g. twin tubs, high energy well implants, buried implanted layers for lateral isolation [BILLI]

Abstract

A method is disclosed for manufacturing integrated circuits, microelectronics, micro-electro-mechanical systems (MEMS), nano-electro-mechanical systems (NEMS), photonic, and any micro- and nano-fabricated devices and systems designs that allow these designs to be kept secure. The manufacturing of the devices in the substrates is performed in a traditional manner at a foundry that can be located anywhere in the world., The manufacturing at this foundry is stopped just before the fabrication of the first layer of electrical interconnects. At this stage, the semiconductor substrates with the devices, minus electrical interconnects, are sent back to the design organization (or their designated trusted foundry) to perform the fabrication of the electrical interconnects to complete the entire manufacturing process. Since the electrical interconnection wiring diagram is the critical component of the design, this de-coupling of the manufacturing allows the designs of the devices and systems to be kept secure and confidential.

Claims

1. A method for the manufacturing of devices, systems or devices and systems using microfabrication or nanofabrication technologies, the method comprising:

having a first organization develop a design of the devices or systems to be manufactured;

sending a portion of the design to a second organization;

having the second organization perform part of a process for manufacturing the devices or systems;

sending another portion of the design to a third organization;

having the third organization perform the remainder of the process for manufacturing the devices or systems to complete the manufacturing of the devices or systems.

2. The method of claim 1, wherein the devices or systems are one or more of the following technologies, including:

integrated circuits;

microelectronics;

micro-electro-mechanical systems (MEMS);

nano-electro-mechanical systems (NEMS);

photonics;

or any micro- and nano-fabricated devices and systems fabricated using micro- and nano-fabrication methods.

3. The method of claim 1, wherein the developed design is a design layout file that includes designs of the photolithography masks used in the manufacturing of the devices or systems.

4. The method of claim 1, wherein the second organization is a semiconductor foundry.

5. The method of claim 1, wherein the third organization is a semiconductor foundry.

6. The method of claim 5, wherein the third organization is a semiconductor foundry that performs the manufacturing of the electrical interconnections of the device or systems.

7. The method of claim 1, wherein the design of the devices or systems sent to the second organization includes the fabrication steps for manufacturing the devices or systems, except those fabrication steps involving the fabrication of electrical interconnection layers.

8. The method of claim 1, wherein the fabrication performed by the second organization includes the fabrication steps for manufacturing the devices or systems, except those fabrication steps involving the fabrication of electrical interconnection layers.

9. The method of claim 1, wherein the design of the devices or systems sent to the third organization include the fabrication steps for manufacturing the devices or systems involving the fabrication of electrical interconnection layers.

10. The method of claim 1, wherein the fabrication performed by the third organization includes the fabrication steps for manufacturing the devices or systems involving the fabrication of electrical interconnection layers.

11. The method of claim 1, wherein the first organization is a business and legal entity separate from the second organization.

12. The method of claim 1, wherein the first organization is a business and legal entity separate from the second and third organizations.

13. The method of claim 1, wherein the first organization is a business and legal entity not separate from the third organization.

14. The method of claim 1, wherein the technology manufactured by the second and third organizations is field-programmable gate arrays (FPGAs).

15. The method of claim 1, wherein the technology manufactured by the second and third organizations is field-programmable analog arrays (FPAAs).

16. The method of claim 1, wherein the technology manufactured by the second and third organizations is application-specific integrated circuits (ASICs).

17. A method for the manufacturing of devices, systems or devices and systems comprised of integrated circuits;

microelectronics;

micro-electro-mechanical systems (MEMS);

nano-electro-mechanical systems (NEMS);

photonics;

or any micro- and nano-fabricated devices and systems that are fabricated using micro- and nano-fabrication technologies, the method comprising;

having a first organization develop a design of the devices or systems to be manufactured;

sending a part of the design to a second organization;

having the second organization perform part of a process for manufacturing the devices or systems;

sending another part of the design to a third organization;

having the third organization perform the remainder of the process for manufacturing the devices or systems to complete the manufacturing method.

18. A method for the secure and confidential manufacturing of devices, systems or devices and systems comprised of integrated circuits;

microelectronics;

micro-electro-mechanical systems (MEMS);

nano-electro-mechanical systems (NEMS);

photonics;

or any micro- and nano-fabricated devices and systems that are fabricated using micro- and nano-fabrication technologies, the method comprising;

having a first organization develop a design of the devices or systems to be manufactured;

sending a portion of the design to a second organization;

having the second organization perform part of the manufacturing process of the devices or systems;

sending another part of the design to a third organization;

having a third organization perform the remainder of the manufacturing process of the devices or systems to complete the manufacturing process.