METHOD AND APPARATUS FOR CREATING A PORUS REFLECTIVE CONTACT

• US 20150372192A1
• Filed: 03/10/2014
• Published: 12/24/2015
• Est. Priority Date: 03/13/2013
• Status: Abandoned Application

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Koninklijke Philips N.V.
• Inventors: EPLER, JOHN EDWARD
• Application Number:
  US14/763,879
• Publication Number:
  US 20150372192A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 33/0062 for devices with an active region comprising only III-V compounds
• CPC Class Codes: H01L 33/0075 comprising nitride compounds
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/16 with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/42 Transparent materials

Abstract

A light emitting device includes a semiconductor structure having a light emitting region (102) disposed between an N-type region (103) and a P-type region (101). A porous region (103A) is disposed between the light emitting region (102) and a contact (N-contact 131) electrically connected to one of the N-type region (103) and the P-type regions (101). The porous region (102) scatters light away from the contact (131), which may improve light extraction from the device. In some embodiments the porous region (103A) is an N-type semiconductor material such as GaN or GaP. The porous region (103A) may be connected to a reflective contact comprised of ITO and/or silver regions. The reflective contact in conjunction with the porous region may reflect a diffuse light toward the primary light emitting surface(s).

Claims

1. A semiconductor structure, comprising:

a plurality of semiconductor regions, comprising a first semiconductor region and a second semiconductor region, wherein one of the semiconductor regions is an N-type region and the other of the semiconductor regions is a P-type region;

a light emitting region disposed between the semiconductor regions;

a first surface from which a substantial fraction of the light extracted from the semiconductor structure is emitted;

a second surface opposite to the first surface;

a first contact electrically connected to one of the semiconductor regions, the first contact comprising;

a first ITO region; and

a metallic region;

a first porous region disposed between the first contact and the light emitting region; and

a second contact electrically connected to one of the semiconductor regions;

wherein the first contact and the second contact are connected to different semiconductor regions.

2. The device of claim 1, wherein a portion of the first semiconductor region and light emitting layer are removed to expose a third surface of the second semiconductor region and the second contact is disposed on the third surface.

3. The device of claim 1 further comprising a matched substrate disposed on one of the first contact and the second contact.

4. The device of claim 1 further comprising a growth substrate, wherein one of the semiconductor regions is disposed on the growth substrate.

5. The device of claim 4 where the growth substrate is one of GaN, SiC or sapphire.

6. The device of claim 1 further comprising a conductive material disposed over a portion of the first surface of the semiconductor structure.

7. The device of claim 4 wherein the semiconductor region disposed on the growth substrate is the first semiconductor region and the first surface is the surface of the growth substrate is opposite to the second semiconducting region.

8. The device of claim 7 where the growth substrate is conductive GaN and the second contact is formed on the first surface.

9. The device of claim 13 where the growth substrate is removed and a transparent window semiconductor has been bonded to the second region, the first surface of the semiconductor structure being opposite to the bonded interface of the transparent window semiconductor.

10. The device of claim 1 wherein the light emitting region is disposed between the first surface and the first porous region.

11. The device of claim 1 wherein the first contact is electrically connected to the P-type region and the first porous region is disposed between the P-type region and the first contact.

12. The device of claim 1 wherein the first contact is electrically connected to the N-type region and the first porous region is disposed between the N-type region and the first contact.

13. The device of claim 12 further comprising a second contact electrically connected to the P-type region.

14. The device of claim 11 further comprising a second contact electrically connected to the N-type region.

15. The device of claim 1 the device further comprising a second contact, wherein one of the first and second contacts is disposed on a second surface of the semiconductor structure and the other of the first and second contacts is disposed in a void formed in the semiconductor structure.

16. The device of claim 6 wherein the conductive layer is a second ITO region.

17. The device of claim 16 further comprising a second contact comprising a contact metal disposed over the second ITO region.

18. The device of claim 2 wherein the growth substrate remains attached to the N-type region and the first surface is the surface of the growth substrate opposite to the N-region.

19. The device of claim 18 where the growth substrate is conductive GaN.

20. The device of claim 1 wherein a side surface of the semiconductor structure is substantially perpendicular to the first surface of the semiconductor structure.

21. The device of claim 1 wherein a side surface of the semiconductor structure is oblique to the first surface of the semiconductor structure.

22. The device of claim 1 wherein a side surface of the semiconductor structure is the surface of a second porous region.

23. The device of claim 1 wherein the metallic region comprises silver.

24. The device of claim 1 wherein the first porous region has a thickness between 0.4 and 40 microns.

25. The device of claim 1 wherein the first ITO region has a thickness is between 200 nm and 400 nm.

26. The device of claim 1 wherein the first porous region has a porosity between 5% and 80%, wherein the porosity is the percent volume of air in the first porous region.

27. The device of claim 1 wherein the first porous region has a porosity between 20% and 40%, wherein the porosity is the percent volume of air in the first porous region.

28. The device of claim 1 wherein the first porous region comprises a semiconducting alloy of composition Al_xIn_yGa_zAs_α

P<sub>1-α

where</sub> 0≧

x, y, z, α

≦

1, and x+y+z=1 or In<sub>β

Ga1-β</sub>

N where 0≧

β

≦

0.2.

33. The device of claim 1 wherein the first porous region is arranged such that all light emitted from the light emitting layer in the direction of the first contact strikes the first porous region before striking the first contact.

29. A device comprising:

a semiconductor structure having a first surface, the semiconductor structure comprising

a light emitting region disposed between an N-type region and a P-type region and a first contact electrically connected to one of the N-type region and the P-type region;

wherein;

the first contact comprises a first ITO region and a metallic region;

a first portion of the first surface is a first surface of a first porous region;

a second portion of the first surface is a first surface of a nonporous region;

the second portion of the first surface is the surface from which a majority of light extracted from the semiconductor structure is emitted; and

the first contact is disposed on the first porous region.

30. The device of claim 29 wherein a lateral extent of the light emitting layer corresponds to the second portion of the first surface.

31. The device of claim 29 wherein the porous region is GaN.

32. The device of claim 29 further comprising a metal contact disposed beneath the first region.