MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS

• US 20150373793A1
• Filed: 06/18/2015
• Published: 12/24/2015
• Est. Priority Date: 06/18/2014
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Bower, Christopher, Meitl, Matthew, Gomez, David, Bonafede, Salvatore, Kneeburg, David, Fecioru, Alin, Prevatte, Carl
• Granted Patent: US 9,444,015 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F21V 9/08 for producing coloured light, e.g. monochromatic; for reducing intensity of light with provision for controlling the colour F21V9/40
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 26/04 by periodically varying the intensity of light, e.g. using choppers shutters, diaphragms for cameras G03B9/00; devices for eliminating or reducing the effect of flicker in projection systems G03B21/40
• CPC Class Codes: G02F 1/167 by electrophoresis
• CPC Class Codes: G09G 2300/0452 Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
• CPC Class Codes: G09G 2300/0842 forming a memory circuit, e.g. a dynamic memory with one capacitor
• CPC Class Codes: G09G 2310/0264 Details of driving circuits
• CPC Class Codes: G09G 3/22 using controlled light sources
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/4821 Bridge structure with air gap
• CPC Class Codes: H01L 23/5381 Crossover interconnections, e.g. bridge stepovers
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/36 : characterised by the electrodes
• CPC Class Codes: H01L 33/38 : with a particular shape
• CPC Class Codes: H01L 33/385 : the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/405 : Reflective materials
• CPC Class Codes: H01L 33/48 : characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H01L 33/502 : Wavelength conversion materials
• CPC Class Codes: H01L 33/508 : having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/09 : Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 1/182 : associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/0329 : Intrinsically conductive polymer [ICP]; Semiconductive polymer
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10128 : Display
• CPC Class Codes: H05K 2201/10166 : Transistor
• CPC Class Codes: H05K 5/0017 : with operator interface units

Abstract

The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

Claims

1. A inorganic light emitting diode (LED) display, the display comprising:

a display substrate;

a plurality of pixels, each pixel comprising a set of primary inorganic LEDs connected to a display circuit and a set of redundant inorganic LEDs unconnected to the display circuit, wherein each of the redundant inorganic LEDs can be electrically connected to the display circuit to replace a corresponding defective LED that is one of the primary inorganic LEDs, wherein;

each primary and redundant inorganic LED is formed in or on a native substrate distinct and separate from the display substrate; and

the native substrates are on the display substrate.

2. The display of claim 1, comprising a redundant LED electrically connected to the display circuit.

3. The display of claim 1, comprising a conductive jumper electrically connecting a redundant LED to the display circuit.

6. The display of claim 1, wherein:

the set of primary inorganic LEDs comprises a plurality of red inorganic LED that emits red light, a plurality of green inorganic LED that emits green light, and a plurality of blue inorganic LED that emits blue light, and

the set of redundant inorganic LEDs comprises a plurality of redundant red inorganic LED that emits red light, a plurality of redundant green inorganic LED that emits green light, and a plurality of redundant blue inorganic LED that emits blue light.

7. The display of claim 1, wherein the set of primary inorganic LEDs comprises a plurality of yellow inorganic LEDs that emit yellow light;

and the set of redundant inorganic LEDs comprises a plurality of redundant yellow inorganic LEDs that emit yellow light.

8. The display of claim 1, wherein the set of primary inorganic LEDs and the set of redundant inorganic LEDs are directly on the display substrate.

9. The display of claim 1, wherein each pixel comprises an inorganic integrated circuit electrically connected to each inorganic LED in a respective pixel.

10. The display of claim 1, wherein each pixel comprises a primary micro integrated circuit and a redundant micro integrated circuit.

11. The display of claim 1, wherein the display substrate is a member selected from the group consisting of polymer, plastic, resin, polyimide, PEN, PET, metal, metal foil, glass, a semiconductor, and sapphire.

12. The display of claim 1, wherein each inorganic LED has a width from 2 to 5 μ

m, 5 to 10 μ

m, 10 to 20 μ

m, or 20 to 50 μ

m.

13. The display of claim 1, wherein each inorganic LED has a length from 2 to 5 μ

m, 5 to 10 μ

m, 10 to 20 μ

m, or 20 to 50 μ

m.

14. The display of claim 1, wherein each inorganic LED has with a height from 2 to 5 μ

m, 4 to 10 μ

m, 10 to 20 μ

m, or 20 to 50 μ

m.

15. The display of claim 1, wherein display substrate has a transparency greater than or equal to 50%, 80%, 90%, or 95% for visible light.

16. The display of claim 1, wherein the display substrate has a contiguous display substrate area that includes the set of primary inorganic LEDs and the set of redundant inorganic LEDs, each LED has a light-emissive area, and the combined light-emissive areas of LEDs is less than or equal to one-quarter of the contiguous display substrate area.

17. The display of claim 16, wherein the combined light-emissive areas of the LEDs is less than or equal to one eighth, one tenth, one twentieth, one fiftieth, one hundredth, one five-hundredth, one thousandth, one two-thousandth, or one ten-thousandth of the contiguous display substrate area.

4. A inorganic light emitting diode (LED) display, the display comprising:

a display substrate;

a plurality of pixels, each pixel comprising a set of primary inorganic LEDs and a set of redundant inorganic LEDs, wherein;

each primary and redundant inorganic LED is formed in or on a native substrate distinct and separate from the display substrate;

the native substrates are on the display substrate; and

each inorganic LED of the redundant set is connected in series with a resistor to form a LED-resistor pair, and each LED-resistor pair is wired in parallel with a inorganic LED of the primary set.

5. A inorganic light emitting diode (LED) display, the display comprising:

a display substrate;

a plurality of pixels, each pixel comprising a set of primary inorganic LEDs and a set of redundant inorganic LEDs, wherein;

each primary and redundant inorganic LED is formed in or on a native substrate distinct and separate from the display substrate;

the native substrates are on the display substrate; and

each inorganic LED of the redundant set is connected in series with a diode to form an LED-diode pair, and each LED-diode pair is wired in parallel with an inorganic LED of the primary set.

18-36. -36. (canceled)