SEMICONDUCTOR DEVICE

• US 20150373836A1
• Filed: 06/18/2015
• Published: 12/24/2015
• Est. Priority Date: 06/20/2014
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toyota Jidoshokki (Toyota Motor Corporation)
• Original Assignee: Kabushiki Kaisha Toyota Jidoshokki (Toyota Motor Corporation)
• Inventors: MASUTANI, Munehiko
• Application Number:
  US14/743,169
• Publication Number:
  US 20150373836A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 25/07 the devices being of a type provided for in group H01L29/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/181 associated with surface mounted components

Abstract

There is provided a semiconductor device including a mounting substrate, a semiconductor element mounted on the mounting substrate, a laminated body laminated by a positive terminal plate and a negative terminal plate with a first insulating layer interposed therebetween, and a shield plate bonded to the laminated body with a second insulating layer interposed therebetween on the side of the laminated body that is opposite from the mounting substrate. The positive terminal plate and the negative terminal plate are electrically connected to the semiconductor element.

Claims

1. A semiconductor device comprising:

a mounting substrate;

a semiconductor element mounted on the mounting substrate;

a laminated body laminated by a positive terminal plate and a negative terminal plate with a first insulating layer interposed therebetween, the positive terminal plate and the negative terminal plate being electrically connected to the semiconductor element; and

a shield plate bonded to the laminated body with a second insulating layer interposed therebetween on the side of the laminated body that is opposite from the mounting substrate.

2. The semiconductor device according to claim 1, further comprising

a circuit substrate driving the semiconductor element, wherein the shield plate lies over at least a part of the semiconductor element in a laminated direction of the laminated body and wherein the circuit substrate lies over the shield plate.

3. The semiconductor device according to claim 1, further comprising

a positive electrode connecting plate that is electrically connected to the semiconductor element and extends in a direction away from the mounting substrate in the laminated direction of the laminated body, wherein the positive terminal plate has a positive terminal portion that integrally extends in a direction away from the mounting substrate in the laminated direction of the laminated body, wherein the laminated body has an opening through which the positive electrode connecting plate is inserted, wherein the shield plate has therein a void portion through which the positive terminal portion and the positive electrode connecting plate are inserted, and wherein the positive terminal portion and the positive electrode connecting plate are connected through metal junction on the side of the shield plate that is opposite from the laminated body.

4. The semiconductor device according to claim 1, further comprising

a negative electrode connecting plate that is electrically connected to the semiconductor element and extends in a direction away from the mounting substrate in the laminated direction of the laminated body, wherein the negative terminal plate having a negative terminal portion that integrally extends in a direction away from the mounting substrate in the laminated direction of the laminated body, wherein the laminated body has an opening through which the negative electrode connecting plate is inserted, wherein the shield plate has therein a void portion through which the negative terminal portion and the negative electrode connecting plate are inserted, and wherein the negative terminal portion and the negative electrode connecting plate are connected through metal junction on the side of the shield plate that is opposite from the laminated body.