PRESSURE SENSOR AND MANUFACTURE METHOD THEREOF
First Claim
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1. A manufacture method of a pressure sensor, comprising:
- providing a first substrate comprising a metal layer, wherein the metal layer is partially exposed on a surface of the first substrate to form a first circuit, a second circuit and a conductive contact;
providing a second substrate comprising a first surface and a second surface;
mounting the second substrate to the surface of the first substrate in which the first surface of the second substrate faces to the first substrate to define a first chamber and a second chamber, wherein the first circuit is configured in the first chamber, and the second circuit is configured in the second chamber;
forming a MEMS element and a reference element on the second substrate, wherein the MEMS element corresponds to the first circuit, and the reference element corresponds to the second circuit;
forming a through slot surrounding the first chamber and penetrating the second surface of the second substrate and an interface between the first substrate and the second substrate;
forming a via penetrating the second surface of the second substrate and the surface between the first substrate and the second substrate to expose the conductive contact;
filling a filler to the through slot to form an airtight ring; and
filling a conductive material to the via to electrically connect the second substrate and the conductive contact.
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Abstract
A pressure sensor using the MEMS device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the surface between the first substrate and the second substrate and further breaks out the surface. The pressure sensor utilizes the airtight ring to retain the airtightness of the chamber. The manufacture method of the pressure sensor is also disclosed.
15 Citations
29 Claims
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1. A manufacture method of a pressure sensor, comprising:
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providing a first substrate comprising a metal layer, wherein the metal layer is partially exposed on a surface of the first substrate to form a first circuit, a second circuit and a conductive contact; providing a second substrate comprising a first surface and a second surface; mounting the second substrate to the surface of the first substrate in which the first surface of the second substrate faces to the first substrate to define a first chamber and a second chamber, wherein the first circuit is configured in the first chamber, and the second circuit is configured in the second chamber; forming a MEMS element and a reference element on the second substrate, wherein the MEMS element corresponds to the first circuit, and the reference element corresponds to the second circuit; forming a through slot surrounding the first chamber and penetrating the second surface of the second substrate and an interface between the first substrate and the second substrate; forming a via penetrating the second surface of the second substrate and the surface between the first substrate and the second substrate to expose the conductive contact; filling a filler to the through slot to form an airtight ring; and filling a conductive material to the via to electrically connect the second substrate and the conductive contact. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A pressure sensor, comprising:
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a first substrate comprising a metal layer, wherein the metal layer is partially exposed on a surface of the first substrate to form a first circuit, a second circuit and a conductive contact; and a second substrate comprising a first surface and a second surface, wherein the second substrate faces the surface of the first substrate with the first surface and is electrically connected to the conductive contact, wherein the second substrate comprises; a MEMS element corresponding to the first circuit and defining an airtight chamber with the first substrate and the second substrate; a reference element corresponding to the second circuit and kept a fixed distance from the second circuit; and a first airtight ring configured for surrounding the chamber, wherein the first airtight ring penetrates the second surface of the second substrate, extends to an interface between the first substrate and the second substrate, and protruding from the interface. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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Specification