DOUBLE-STRUCTURE BUSH AND BEARING ASSEMBLY COMPRISING SAME

• US 20150376864A1
• Filed: 10/18/2013
• Published: 12/31/2015
• Est. Priority Date: 02/21/2013
• Status: Active Grant

• Current Assignee: HD Hyundai Infracore Co., Ltd.
• Original Assignee: Doosan Infracore Company Limited
• Inventors: Choi, Ji Won, Lim, Dong Pil
• Granted Patent: US 9,624,645 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: E02F 9/006 Pivot joint assemblies in general F16C11/04
• CPC Class Codes: E02F 9/2275 Hoses and supports therefor and protection therefor
• CPC Class Codes: F16C 17/02 for radial load only
• CPC Class Codes: F16C 2208/02 comprising fillers, fibres
• CPC Class Codes: F16C 2240/06 Temperature
• CPC Class Codes: F16C 33/20 Sliding surface consisting mainly of plastics F16C33/22 - F16C33/28 take precedence
• CPC Class Codes: F16C 33/205 with two layers
• CPC Class Codes: F16C 33/208 Methods of manufacture, e.g. shaping, applying coatings

Abstract

The present disclosure relates to a double-structure bush usable in a joint portion which operates in low speed and high load, and to a bearing assembly comprising same.

Claims

1. A double-structure bush made of a polymeric composite, comprising:

a slide layer configured to receive a pin unit, in which the inner circumferential surface of the slide layer is in contact with the pin unit to support rotation of the pin unit; and

a load support layer integrally stacked on the outer circumferential surface of the slide layer, configured to be received in a boss, in which the load support layer is in contact with the inner circumferential surface of the boss to support radial load of the pin unit,

wherein the ratio T₂/T₁ of the thermal expansion coefficient T₂ of the load support layer to the thermal expansion coefficient T₁ of the boss in a temperature range of −

40 to 50°

C. is 1.5 to 3.1, and the ratio T₄/T₃ of the thermal expansion coefficient T₄ of the slide layer to the thermal expansion coefficient T₃ of the load support layer in a temperature range of 50 to 130°

C. is 3.5 to 5.

2. The double-structure bush of claim 1, wherein the ratio T₂/T₁ of the thermal expansion coefficient T₂ of the load support layer to the thermal expansion coefficient T₁ of the boss in a temperature range of −

40 to 50°

C. is 1.8 to 2.2, and the ratio T₄/T₃ of the thermal expansion coefficient T₄ of the slide layer to the thermal expansion coefficient T₃ of the load support layer in a temperature range of 50 to 130°

C. is 4.0 to 4.6.

3. The double-structure bush of claim 1, wherein the slide layer is made of a first polymeric composite comprising (a) a first polymeric matrix, (b) a self-lubricative material, and (c) a first fiber base.

4. The double-structure bush of claim 1, wherein the load support layer is made of a second polymeric composite comprising (a) a second polymeric matrix and (b) a second fiber base.

5. The double-structure bush of claim 1, wherein the bush is used at surface pressure of 2 to 6 kgf/mm² and a sliding speed of 0.25 to 5 cm/sec.

6. A bearing assembly comprising the double-structure bush of claim 1.

7. The bearing assembly of claim 6, wherein the ratio T₂/T₁ of the thermal expansion coefficient T₂ of the load support layer to the thermal expansion coefficient T₁ of the boss in a temperature range of −

40 to 50°

C. is 1.8 to 2.2, and the ratio T₄/T₃ of the thermal expansion coefficient T₄ of the slide layer to the thermal expansion coefficient T₃ of the load support layer in a temperature range of 50 to 130°

C. is 4.0 to 4.6.

8. The bearing assembly of claim 6, wherein the slide layer is made of a first polymeric composite comprising (a) a first polymeric matrix, (b) a self-lubricative material, and (c) a first fiber base.

9. The bearing assembly of claim 6, wherein the load support layer is made of a second polymeric composite comprising (a) a second polymeric matrix and (b) a second fiber base.

10. The bearing assembly of claim 6, wherein the bush is used at surface pressure of 2 to 6 kgf/mm² and a sliding speed of 0.25 to 5 cm/sec.