USE OF SEMI-AROMATIC COPOLYAMIDE FOR TRANSPORTING REFRIGERANT FLUID
First Claim
1. A vapor compression circuit element comprising at least one layer composed of a composition comprising copolyamide of formula X/10.T/Y, in which:
- X represents alternatively the residues of an aliphatic amino acid comprising from 8 to 18 carbon atoms, or a lactam, or the unit X1.X2 which represents the residues resulting from the condensation of an aliphatic diamine comprising from 6 to 18 carbon atoms and a (cyclo)aliphatic dicarboxylic acid comprising from 6 to 18 carbon atoms;
10.T represents the residues from the condensation of a decane diamine and terephthalic acid; and
Y represents the residues from the condensation of an aliphatic diamine comprising from 9 to 14 carbon atoms and an aromatic dicarboxylic acid, Y being different from the unit 10.T;
the molar proportion of units 10.T in the copolyamide being greater than 0%;
the molar proportion of the units Y relative to the total of units 10.T and Y being from 0% to 30%; and
the proportion of units X being from 0.4 to 0.8 mol per mole of semi-aromatic units 10.T and Y.
1 Assignment
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Accused Products
Abstract
The invention relates to the use of a layer consisting of a composition comprising a copolyamide of formula X/10.T/Y for transporting a heat transfer fluid in a vapor compression circuit, wherein: X represents either the residues of an aliphatic amino acid comprising between 8 and 18 carbon atoms, or a lactam, or the unit X1.X2 representing the residues resulting from the condensation of an aliphatic diamine comprising between 6 and 18 carbon atoms and a (cyclo)aliphatic diacid comprising between 6 and 18 carbon atoms; 10.T represents the residues resulting from the condensation of a decanediamine and terephthalic acid; and Y represents the residues resulting from the condensation of an aliphatic diamine comprising between 9 and 14 carbon atoms and an aromatic diacid, Y being different from the unit 10.T; the molar proportion of 10.T units being higher than 0%.
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Citations
28 Claims
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1. A vapor compression circuit element comprising at least one layer composed of a composition comprising copolyamide of formula X/10.T/Y, in which:
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X represents alternatively the residues of an aliphatic amino acid comprising from 8 to 18 carbon atoms, or a lactam, or the unit X1.X2 which represents the residues resulting from the condensation of an aliphatic diamine comprising from 6 to 18 carbon atoms and a (cyclo)aliphatic dicarboxylic acid comprising from 6 to 18 carbon atoms; 10.T represents the residues from the condensation of a decane diamine and terephthalic acid; and Y represents the residues from the condensation of an aliphatic diamine comprising from 9 to 14 carbon atoms and an aromatic dicarboxylic acid, Y being different from the unit 10.T; the molar proportion of units 10.T in the copolyamide being greater than 0%; the molar proportion of the units Y relative to the total of units 10.T and Y being from 0% to 30%; and the proportion of units X being from 0.4 to 0.8 mol per mole of semi-aromatic units 10.T and Y. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 23, 24, 25, 26, 27, 28)
each of the first composition and the second composition comprising an elastomeric material.
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14. The vapor compression circuit element as claimed in claim 1, wherein the vapor compression circuit element is an extruded article.
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15. A heat transfer device comprising a vapor compression circuit which comprises at least one vapor compression circuit element as claimed in claim 1.
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16. The heat transfer device as claimed in claim 15, wherein the heat transfer device is selected from the group consisting of mobile and stationary air conditioning devices, refrigeration devices, freezing devices, Rankine-cycle and heat-pump heating devices.
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17. The heat transfer device as claimed in claim 15, wherein the vapor compression circuit contains a heat transfer fluid selected from the group consisting of hydrocarbon, hydrofluorocarbon, ether, hydrofluoroether, and fluoroolefin compounds.
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18. The heat transfer device as claimed in claim 17, wherein the heat transfer fluid is admixed with a lubricant.
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23. A method for heating or cooling a liquid or a body by means of a vapor compression circuit containing a heat transfer fluid, said method comprising in succession the evaporation of the heat transfer fluid, the compression of the heat transfer fluid, the condensation of the heat fluid, and the expansion of the heat transfer fluid, wherein the vapor compression circuit comprises a vapor compression circuit element as claimed in claim 1.
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24. The method as claimed in claim 23, which is a method for heating, air conditioning, refrigerating, or freezing.
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25. The method as claimed in claim 23, wherein the heat transfer fluid is selected from the group consisting of hydrocarbon, hydrofluorocarbon, ether, hydrofluoroether and fluoroolefin compounds.
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26. A method for producing the circuit element as claimed in claim 1, comprising a step of applying a layer of a composition comprising a copolyamide of formula X/10.T/Y.
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27. The method as claimed in claim 26, wherein said layer is applied by injection molding, extrusion, extrusion-blow molding, coextrusion, or multiple injection molding.
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28. The method as claimed in claim 26, wherein the circuit element is a multilayer tube, comprising the successive extrusion, on a mandrel, of an inner layer, optionally of a first intermediate layer, optionally of a second intermediate layer then of an outer layer.
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19. (canceled)
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20. (canceled)
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21. (canceled)
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22. (canceled)
Specification