SELF-SIMILAR AND FRACTAL DESIGN FOR STRETCHABLE ELECTRONICS

• US 20150380355A1
• Filed: 02/05/2014
• Published: 12/31/2015
• Est. Priority Date: 02/06/2013
• Status: Active Grant

• Current Assignee: Board of Trustees of The University of Illinois, Northwestern University
• Original Assignee: Board of Trustees of The University of Illinois, John A. Rogers, Jonathan Fan, Northwestern University, Woon-Hong Yeo, Yihui Zhang, Yonggang Huang
• Inventors: ROGERS, John A., FAN, Jonathan, HUANG, Yonggang, ZHANG, Yihui, YEO, Woon-Hong, SU, Yewang
• Granted Patent: US 9,613,911 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 23/538 the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates H05K takes precedence; manufacture or treatment H01L21/4846 ; mountings per se H01L23/12; materials H01L23/49866
• CPC Class Codes: H01L 23/5386 Geometry or layout of the interconnection structure
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/564 Details not otherwise provided for, e.g. protection against moisture getters H01L23/26
• CPC Class Codes: H01L 24/00 Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12032 Schottky diode
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H05K 1/0283 Stretchable printed circuits

Abstract

The present invention provides electronic circuits, devices and device components including one or more stretchable components, such as stretchable electrical interconnects, electrodes and/or semiconductor components. Stretchability of some of the present systems is achieved via a materials level integration of stretchable metallic or semiconducting structures with soft, elastomeric materials in a configuration allowing for elastic deformations to occur in a repeatable and well-defined way. The stretchable device geometries and hard-soft materials integration approaches of the invention provide a combination of advance electronic function and compliant mechanics supporting a broad range of device applications including sensing, actuation, power storage and communications.

Claims

1. A electronic circuit comprising:

an elastic substrate; and

a stretchable metallic or semiconducting device component supported by said elastic substrate;

said stretchable metallic or semiconducting device component comprising a plurality of electrically conductive elements each having a primary unit cell shape, said electrically conductive elements connected in a sequence having a secondary shape providing an overall two-dimensional spatial geometry characterized by a plurality of spatial frequencies;

wherein said two-dimensional spatial geometry of said metallic or semiconducting device component allows for accommodation of elastic strain along one or more in-plane or out of plane dimensions, thereby providing stretchability of said electronic circuit.

2. The electronic circuit of claim 1, wherein said two-dimensional spatial geometry allows said metallic or semiconducting device component to undergo elastic deformation.

3. The electronic circuit of any of claims 1-2, wherein said two-dimensional spatial geometry allows said metallic or semiconducting device component to undergo biaxial deformation, radial deformation or both.

4. The electronic circuit of any of claims 1-3, wherein said two-dimensional spatial geometry allows said metallic or semiconducting device component to undergo in plane deformation, out of plane deformation or both.

5. The electronic circuit of any of claims 1-4, wherein said two-dimensional spatial geometry is characterized by a first spatial frequency having a first length scale corresponding to said primary unit cell shape and a second spatial frequency having a second length scale corresponding to said secondary shape.

6. The electronic circuit of claim 5, wherein said first length scale of said first spatial frequency is at least 2 times smaller than said second length scale of said second spatial frequency.

7. The electronic circuit of claim 5, wherein said first length scale of said first spatial frequency is 2 to 10 times smaller than said second length scale of said second spatial frequency.

8. The electronic circuit of claim 5, wherein said first length scale of said first spatial frequency is selected from the range of 100 nm to 1 mm and wherein said second length scale of said second spatial frequency is selected from the range of 1 micron to 10 mm.

9. The electronic circuit of claim 5, wherein said plurality of spatial frequencies are characterized by a plurality of length scales characterized by a power series.

10. The electronic circuit of claim any of claims 1-9, wherein said two-dimensional spatial geometry is characterized by more than two spatial frequencies.

11. The electronic circuit of claim 10, wherein said sequence of electrically conductive elements is further characterized by a tertiary shape comprising a repeating series of said electrically conductive elements comprising said secondary shape.

12. The electronic circuit of any of claims 1-11, wherein said two-dimensional spatial geometry is characterized by 2 to 5 spatial frequencies.

13. The electronic circuit of any of claims 1-12, wherein said two-dimensional spatial geometry is an iterative two-dimensional geometry.

14. The electronic circuit of any of claims 1-13, wherein said sequence of electrically conductive elements has a serial configuration or a branched configuration.

15. The electronic circuit of any of claims 1-14, wherein said two-dimensional spatial geometry has a deterministic two-dimensional shape or a random two-dimensional shape.

16. The electronic circuit of any of claims 1-15, wherein said two-dimensional spatial geometry has a spring-within-a-spring geometry, wherein said spring-within-in-spring geometry comprises a series of primary spring structures each independently having said primary unit cell shape connected to form one or more secondary spring structures having said secondary shape.

17. The electronic circuit of claim 16, wherein said primary spring structures, said secondary spring structures or both comprise a compression spring structure or coiled spring structure.

18. The electronic circuit of any of claims 1-17, wherein said two-dimensional spatial geometry is a self-similar two-dimensional geometry.

19. The electronic circuit of claim 18, wherein said self-similar two-dimensional geometry is characterized by said secondary shape being similar to said primary unit cell shape but having a different length scale.

20. The electronic circuit of claim 18, wherein said self-similar two-dimensional geometry is characterized by a length scale of said secondary shape at least 2 times larger than a length scale of said primary unit cell shape.

21. The electronic circuit of claim 18, wherein a length scale of said secondary shape is larger than a length scale of said primary unit cell shape by a factor selected from the range of 2 to 20.

22. The electronic circuit of any of claims 18, wherein said self-similar two-dimensional geometry is characterized by a first spatial frequency having a first length scale corresponding to said primary unit cell shape, a second spatial frequency having a second length scale corresponding to said secondary shape and a third spatial frequency having a third length scale corresponding to a tertiary shape.

23. The electronic circuit of claim 22, wherein said tertiary shape is similar to said primary unit cell shape and said secondary shape but having a different length scale.

24. The electronic circuit of any of claims 1-23, wherein said two-dimensional spatial geometry is a fractal-based two-dimensional geometry characterized by a fractal dimension greater than or equal to 1.

25. The electronic circuit of any of claims 1-24, wherein said two-dimensional spatial geometry is a fractal-based two-dimensional geometry characterized by a fractal dimension selected from the range of 1 to 2.

26. The electronic circuit of any of claims 1-25, wherein a said two-dimensional spatial geometry of said stretchable metallic or semiconducting device component provides a fill factor between first and second device components or provided over an active area of said electronic circuit greater than or equal to 20%.

27. The electronic circuit of any of claims 1-26, wherein a said two-dimensional spatial geometry of said stretchable metallic or semiconducting device component provides a fill factor between first and second device components or provided over an active area of said electronic circuit selected from the range of 20% to 90%.

28. The electronic circuit of any of claims 1-27, wherein said electrically conductive elements of said metallic or semiconducting device component comprise a continuous structure.

29. The electronic circuit of any of claims 1-28, wherein said electrically conductive elements of said metallic or semiconducting device component comprise a single unitary structure.

30. The electronic circuit of any of claims 1-29, wherein said electrically conductive elements of said metallic or semiconducting device component comprise one or more thin film structures.

31. The electronic circuit of any of claims 1-30, wherein said electrically conductive elements of said stretchable metallic or semiconducting device component are:

i. free standing structures at least partially supported by said elastic substrate;

ii. tethered structures at least partially connected to said elastic substrate;

iii. bound structures at least partially bound to said elastic substrate;

iv. embedded structures at least partially embedded in said elastic substrate or in an embedding layer supported by said substrate;

or

v. structures within a containment structure and in physical contact with a containment fluid or a containment solid.

32. The electronic circuit of any of claims 1-31, wherein each of said electrically conductive elements independently has a thickness selected from the range of 10 nm to 1 mm.

33. The electronic circuit of any of claims 1-32, wherein each of said electrically conductive elements independently has a thickness less than or equal to 1 micron.

34. The electronic circuit of any of claims 1-33, wherein each unit cell shape of said electrically conductive elements is independently characterized by lateral dimensions selected from the range of 100 nm to 10 mm.

35. The electronic circuit of any of claims 1-34, wherein said stretchable metallic or semiconducting device component is characterized by a pathlength selected from the range of 0.1 μ

m to 100 cm.

36. The electronic circuit of any of claims 1-35, wherein said stretchable metallic or semiconducting device component provides for electrical connection between two connection points separated by a straight line distance selected from the range of 0.1 μ

m to 100 cm.

37. The electronic circuit of any of claims 1-36, wherein stretchable metallic or semiconducting device component provides for electrical connection between first and second connection points and independently has a pathlength extending between said first and second connection points at least 2 times larger than the shortest straight line distance between said first and second connection points.

38. The electronic circuit of any of claims 1-37, wherein said stretchable metallic or semiconducting device component provides for electrical connection between first and second connection points and independently has a pathlength extending between said first and second connection points 2 to 6 times larger than the shortest straight line distance between said first and second connection points.

39. The electronic circuit of any of claims 1-38, wherein said electrically conductive elements comprise a wire, a ribbon or nanomembrane.

40. The electronic circuit of any of claims 1-39, wherein said electrically conductive elements independently comprise a metal, an alloy, a single crystalline inorganic semiconductor or an amorphous inorganic semiconductor.

41. The electronic circuit of any of claims 1-40, wherein said primary unit cell shape of said electrically conductive elements comprises a spring, a fold, a loop, a mesh or any combinations of these.

42. The electronic circuit of any of claims 1-41, wherein said primary unit cell shape comprises a plurality of spatially offset features selected from the group consisting of opposing segments, adjacent segments or a combination of opposition and adjacent segments.

43. The electronic circuit of claim 42, wherein said spatially offset features of said primary unit cell shape comprise a plurality of convex segments, concave segments, circular segments, ellipsoidal segments, triangular segments, rectangular segments, square segments, or any combination of these.

44. The electronic circuit of claim 43, wherein said convex segments, concave segments, circular segments, ellipsoidal segments, triangular segments, rectangular segments or square segments of said unit cell shape are separated by one or more straight line segments.

45. The electronic circuit of any of claims 1-44, wherein said primary unit cell shape of said electrically conductive elements is selected from the group consisting of one or more of a von Koch curve, a Peano curve, a Hilbert curve, a Moore curve, a Vicsek fractal, a Greek cross, and any combination of these.

46. The electronic circuit of any of claims 1-45, wherein said stretchable metallic or semiconducting device component comprises an electrode or an electrode array.

47. The electronic circuit of claim 46, wherein said electrode or said electrode array is a component of sensor, actuator, or a radio frequency device.

48. The electronic circuit of claim 46, wherein said electrode or said electrode array provides a fill factor over an active area of said electronic circuit selected from the range of 25% to 90%.

49. The electronic circuit of any of claims 1-45, said stretchable metallic or semiconducting device component comprises one or more electrical interconnects.

50. The electronic circuit of claim 49, further comprising one or more rigid island structures, wherein at least a portion of said one or more electrical interconnects is in electrical contact with said one or more rigid island structures.

51. The electronic circuit of claim 49, wherein said rigid island structures comprise inorganic semiconductor devices or device components.

52. The electronic circuit of claim 49, further comprising a plurality of said stretchable metallic or semiconducting device component in electrical contact with each of said rigid island structures.

53. The electronic circuit of claim 50, wherein said inorganic semiconductor devices or device components comprise a transistor, a diode, an amplifier, a multiplexer, a light emitting diode, a laser, a photodiode, an integrated circuit, a sensor, a temperature sensor, a thermistor, a heater, a resistive heater, an actuator or any combination of these.

54. The electronic circuit of any of claims 1-53, wherein said elastic substrate has an average thickness selected from the range of 0.25 μ

m to 10,000 μ

m.

55. The electronic circuit of any of claims 1-54, wherein said elastic substrate has an average thickness less than or equal to 1000 μ

m.

56. The electronic circuit of any of claims 1-55, wherein said elastic substrate is a prestrained elastic substrate.

57. The electronic circuit of any of claims 1-56, wherein said elastic substrate has a Young'"'"'s modulus selected from the range of 0.5 KPa to 100 GPa.

58. The electronic circuit of any of claims 1-57, wherein said elastic substrate has a net bending stiffness selected from the range of 0.1×

10⁴ GPa μ

m⁴ to 1×

10⁹ GPa μ

m⁴.

59. The electronic circuit of any of claims 1-58, wherein said elastic substrate comprises a material selected from the group consisting of:

a polymer, an inorganic polymer, an organic polymer, a plastic, an elastomer, a biopolymer, a thermoset, a rubber silk and any combination of these.

60. The electronic circuit of any of claims 1-59, comprising an energy storage device, a photonic device, an optical sensor, a strain sensor, an electrical sensor, a temperature sensor, a chemical sensor, an actuator, a communication device, a micro- or nano-fluidic device, an integrated circuit or any component thereof.

61. The electronic circuit of any of claims 1-60, comprising a tissue mounted electronic device, a radio frequency antenna or a sensor compatible with magnetic resonance imaging.

62. An electronic sensor compatible with magnetic resonance imaging comprising:

an elastic substrate; and

a stretchable electrode array supported by said elastic substrate;

said electrode array comprising a plurality of electrically conductive elements each having a primary unit cell shape, said electrically conductive elements connected in a sequence having a secondary shape providing an overall two-dimensional spatial geometry characterized by a plurality of spatial frequencies;

wherein said stretchable electrode array is substantially transparent to radio frequency electromagnetic radiation having frequencies selected from the range of 1 MHz to 100 GHz, and wherein said two-dimensional spatial geometry of said stretchable electrode array allows for accommodation of elastic strain along one or more in-plane or out of plane dimensions, thereby providing stretchability of said electronic sensor.

63. The electronic sensor of claim 62, wherein said stretchable electrode array does not include any closed loop structures over an active area of said electronic sensor.

64. The electronic sensor of any of claims 62-63, wherein said stretchable electrode array does not result in observable distortion or shadowing when using in combination with magnetic resonance imaging.

65. The electronic sensor of claim 64, wherein said magnetic resonance imaging includes exposure of said electronic sensor to RF pulses having said frequencies selected from the range of 100 to 300 MHz.

66. An electrode array comprising:

a plurality of stretchable metallic or semiconducting device components supported by said elastic substrate, wherein each of said stretchable metallic or semiconducting device components independently comprises a plurality of electrically conductive elements each having a primary unit cell shape, wherein said electrically conductive elements of each stretchable metallic or semiconducting device component are independently connected in a sequence having a secondary shape providing an overall two-dimensional spatial geometry characterized by a plurality of spatial frequencies;

wherein said plurality of stretchable metallic or semiconducting device components provide a fill factor greater than or equal to 50% for an active area of said electrode array; and

wherein said two-dimensional spatial geometries of said metallic or semiconducting device components allows for accommodation of elastic strain along one or more in-plane or out of plane dimensions, thereby providing stretchability of said electrode array.

67. A stretchable electronic device comprising:

a plurality of rigid island structures supported by an elastic substrate;

wherein each of said rigid island structures independently comprises an inorganic semiconductor device or device component;

a plurality of stretchable metallic or semiconducting device components electrically interconnecting at least a portion of said rigid island structures, wherein each of said stretchable metallic or semiconducting device components independently comprises a plurality of electrically conductive elements each having a primary unit cell shape, wherein said electrically conductive elements of each stretchable metallic or semiconducting device component are independently connected in a sequence having a secondary shape providing an overall two-dimensional spatial geometry characterized by a plurality of spatial frequencies;

wherein said two-dimensional spatial geometries of said metallic or semiconducting device components allows for accommodation of elastic strain along one or more in-plane or out of plane dimensions, thereby providing stretchability of said stretchable electronic device.