METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
First Claim
1. A method of manufacturing a semiconductor device, comprising:
- forming a first conductive layer on a substrate, the first conductive layer comprising a gate and a first electrode;
forming a first insulating layer to cover the first conductive layer;
forming a semiconductor layer on the first insulating layer, the semiconductor layer comprising an active layer and an etching stop layer;
forming a second insulating layer on the semiconductor layer;
patterning the second insulating layer to form a first opening, a second opening and a third opening, the first opening and the second opening exposing the active layer, and the third opening exposing the etching stop layer; and
forming a second conductive layer on the second insulating layer, the second conductive layer comprising a source, a drain and a second electrode, the source and the drain contacting with the active layer through the first opening and the second opening, and the second electrode contacting with the etching stop layer through the third opening.
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Abstract
A semiconductor device includes a gate, a first electrode, a first insulating layer, an active layer, an etching stop layer, a second insulating layer, a source, a drain and a second electrode. The first insulating layer covers the gate and the first electrode. The active layer and the etching stop layer are disposed on the first insulating layer above the gate and the first electrode respectively. The second insulating layer covers the active layer and the etching stop layer and has a first opening and a second opening exposing the active layer and a third opening exposing the etching stop layer. The source and the drain are disposed on the second insulating layer and contact with the active layer through the first opening and the second opening respectively. The second electrode is located on the second insulating layer and contacts with the etching stop layer through the third opening.
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Citations
5 Claims
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1. A method of manufacturing a semiconductor device, comprising:
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forming a first conductive layer on a substrate, the first conductive layer comprising a gate and a first electrode; forming a first insulating layer to cover the first conductive layer; forming a semiconductor layer on the first insulating layer, the semiconductor layer comprising an active layer and an etching stop layer; forming a second insulating layer on the semiconductor layer; patterning the second insulating layer to form a first opening, a second opening and a third opening, the first opening and the second opening exposing the active layer, and the third opening exposing the etching stop layer; and forming a second conductive layer on the second insulating layer, the second conductive layer comprising a source, a drain and a second electrode, the source and the drain contacting with the active layer through the first opening and the second opening, and the second electrode contacting with the etching stop layer through the third opening. - View Dependent Claims (2, 3, 4, 5)
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Specification