ENCAPSULATION STRUCTURES, ENCAPSULATION METHODS, AND DISPLAY DEVICES OF ORGANIC ELECTROLUMINESCENT DEVICES

• US 20150380683A1
• Filed: 06/27/2014
• Published: 12/31/2015
• Est. Priority Date: 09/29/2013
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: YOU, Juanjuan
• Granted Patent: US 9,728,746 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H10K 2102/351 Thickness
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 59/8731 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/40 Thermal treatment, e.g. annealing in the presence of a solvent vapour
• CPC Class Codes: H10K 85/111 comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene

Abstract

Disclosed are encapsulation structures, encapsulation methods and display devices of organic electroluminescent devices. The encapsulation structure comprises: a substrate (3); an organic electroluminescent device (2) located on the substrate (3); and at least one film encapsulation layer (1) covering the organic electroluminescent device (2), wherein the film encapsulation layer (1) comprises an inorganic film (11) and a fluorocarbon polymer film (13). The encapsulation structure can effectively improve the film encapsulation layer (1)'"'"'s ability to block water and oxygen so as to effectively extend the lifetime of OLED devices.

Claims

1-16. -16. (canceled)

17. An encapsulation structure of an organic electroluminescent device, comprising:

a substrate;

an organic electroluminescent device located on the substrate; and

at least one film encapsulation layer covering the organic electroluminescent device, wherein the film encapsulation layer comprises an inorganic film and a fluorocarbon polymer film.

18. The encapsulation structure of an organic electroluminescent device according to claim 17, wherein the film encapsulation layer further comprises an organic polymer film disposed between the inorganic film and the fluorocarbon polymer film.

19. The encapsulation structure of an organic electroluminescent device according to claim 17, wherein the organic electroluminescent device is covered with 1˜

20 layers of the film encapsulation layer.

20. The encapsulation structure of an organic electroluminescent device according to claim 18, wherein the organic electroluminescent device is covered with 1˜

20 layers of the film encapsulation layer.

21. The encapsulation structure of an organic electroluminescent device according to claim 17, wherein the fluorocarbon polymer film is a polymer film formed by treating a plasma of fluorocarbon gas comprising one or a combination of CHF₃, C₃F₈, C₄F₁₀, C₂F₄ and C₄F₈.

22. The encapsulation structure of an organic electroluminescent device according to claim 18, wherein the fluorocarbon polymer film is a polymer film formed by treating a plasma of fluorocarbon gas comprising one or a combination of CHF₃, C₃F₈, C₄F₁₀, C₂F₄ and C₄F₈.

23. The encapsulation structure of an organic electroluminescent device according claim 17, wherein the thickness of the inorganic film is from about 5 nm to about 200 nm, and the thickness of the fluorocarbon polymer film is from about 5 nm to about 200 nm.

24. The encapsulation structure of an organic electroluminescent device according claim 18, wherein the thickness of the organic polymer film is from about 5 nm to about 200 nm.

25. The encapsulation structure of an organic electroluminescent device according to claim 17, wherein the material of the inorganic film is selected from one or combinations of Al₂O₃, TiO₂, ZrO₂, MgO, HfO₂, Ta₂O₅, Si₃N₄, AlN, SiN, SiNO, SiO, SiO₂, SiO_x, SiC and ITO.

26. A display device comprising the encapsulation structure of an organic electroluminescent device according to claim 17.

27. A display device comprising the encapsulation structure of an organic electroluminescent device according to claim 18.

28. An encapsulation method of an organic electroluminescent device, comprising:

providing a substrate;

manufacturing an organic electroluminescent device on the substrate; and

forming at least one film encapsulation layer on the organic electroluminescent device, wherein the film encapsulation layer comprises an inorganic film and a fluorocarbon polymer film.

29. The encapsulation method of an organic electroluminescent device according to claim 28, wherein the film encapsulation layer further comprises an organic polymer film disposed between the inorganic film and the fluorocarbon polymer film.

30. The encapsulation method of an organic electroluminescent device according to claim 28, wherein the forming at least one film encapsulation layer on the organic electroluminescent device comprises:

forming the inorganic film by depositing inorganic materials on the organic electroluminescent device; and

forming the fluorocarbon polymer film by treatment of a fluorocarbon gas plasma.

31. The encapsulation method of an organic electroluminescent device according to claim 29, wherein the forming at least one film encapsulation layer on the organic electroluminescent device comprises:

forming the inorganic film by depositing inorganic materials on the organic electroluminescent device; and

forming the fluorocarbon polymer film by treatment of a fluorocarbon gas plasma.

32. The encapsulation method of an organic electroluminescent device according to claim 30, further comprising:

forming the organic polymer film by depositing an organic polymer on the inorganic film.

33. The encapsulation method of an organic electroluminescent device according to claim 30, wherein the treatment of a fluorocarbon gas plasma comprises fluorocarbon gas plasma polymerization or fluorocarbon gas plasma modification.

34. The encapsulation method of an organic electroluminescent device according to claim 30, wherein the forming the fluorocarbon polymer film by treatment of a fluorocarbon gas plasma comprises:

producing a plasma of fluorocarbon gas through radio-frequency discharge of the fluorocarbon gas, wherein the frequency of the radio-frequency source is about 13.56 MHz, the power of the radio-frequency source is from about 50 W to about 200 W, the ambient pressure is from about 300 mTorr to about 400 mTorr, and the flow velocity of the fluorocarbon gas is from about 20 sccm to about 80 sccm.

35. The encapsulation method of an organic electroluminescent device according to claim 30, wherein the forming the inorganic film by depositing an inorganic material on the organic electroluminescent device comprises:

forming the inorganic film by depositing an inorganic material on the organic electroluminescent device through ion beam sputtering deposition, magnetic sputtering deposition or atomic layer deposition.

36. The encapsulation method of an organic electroluminescent device according to claim 32, wherein the forming the organic polymer film by depositing an organic polymer on the inorganic film comprises:

forming the organic polymer film by depositing an organic polymer on the inorganic film through a solution film-forming method or a chemical vapor deposition.