IMAGING UNIT

• US 20160006911A1
• Filed: 06/16/2015
• Published: 01/07/2016
• Est. Priority Date: 07/01/2014
• Status: Active Grant

• Current Assignee: Ricoh Company Limited
• Original Assignee: Masashi Adachi, Shuji Takamatsu, Shu Kambe, Tomonori Kimura
• Inventors: TAKAMATSU, Shuji, KIMURA, Tomonori, KAMBE, Shu, YASUI, Maiko, ADACHI, Masashi
• Granted Patent: US 9,854,225 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B60R 11/04 Mounting of cameras operative during drive; Arrangement of controls thereof relative to the vehicle
• CPC Class Codes: B60R 2300/107 using stereoscopic cameras
• CPC Class Codes: G03B 17/55 with provision for heating or cooling, e.g. in aircraft
• CPC Class Codes: G03B 35/08 by simultaneous recording
• CPC Class Codes: H04N 13/239 using two 2D image sensors having a relative position equal to or related to the interocular distance H04N13/243 takes precedence
• CPC Class Codes: H04N 2213/001 Constructional or mechanical details
• CPC Class Codes: H04N 23/50 Constructional details
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/52 Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 23/90 Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums

Abstract

An imaging unit includes a plurality of imaging devices configured to capture images of an object; a circuit substrate configured to generate image data based on the images captured by the imaging devices; a chassis that holds the imaging devices; and a heat transfer member including a contacting portion configured to contact an installed member in a case where the imaging unit is installed on the installed member. The heat transfer member contacts the chassis or the circuit substrate, and heat conductivity of the heat transfer member is greater than the heat conductivity of the chassis.

Claims

1. An imaging unit comprising:

a plurality of imaging devices configured to capture images of an object;

a circuit substrate configured to generate image data based on the images captured by the plurality of imaging devices;

a chassis that holds the plurality of imaging devices; and

a heat transfer member including a contacting portion configured to contact an installed member in a case where the imaging unit is installed on the installed member, the heat transfer member contacting the chassis or the circuit substrate, heat conductivity of the heat transfer member being greater than the heat conductivity of the chassis.

2. The imaging unit as claimed in claim 1, wherein the heat transfer member is arranged so as to contact a region of the chassis between the plurality of imaging devices.

3. The imaging unit as claimed in claim 1 wherein the circuit substrate includes:

an imaging element substrate, provided to each of the plurality of imaging devices, configured to generate an electric signal based on an image captured by the imaging device; and

an image processing substrate configured to generate the image data based on the electric signal.

4. The imaging unit as claimed in claim 1 wherein the circuit substrate is attached to the chassis by a fastening member in a region where the circuit substrate contacts the chassis.

5. The imaging unit as claimed in claim 1 wherein the heat transfer member is attached to the circuit substrate via the chassis.

6. The imaging unit as claimed in claim 1 wherein the heat transfer member directly contacts the circuit substrate.

7. The imaging unit as claimed in claim 3 wherein the heat transfer member contacts both the imaging element substrate and the image processing substrate.

8. The imaging unit as claimed in claim 1 wherein a material of the heat transfer member is aluminum.

9. The imaging unit as claimed in claim 1, wherein the heat transfer member is provided so as to contact the chassis between the plurality of imaging devices, and the circuit substrate includes an imaging element substrate of the imaging device and an image processing substrate configured to process an image captured by the imaging device.

10. An imaging unit comprising:

a plurality of imaging devices configured to capture images of an object;

a circuit substrate configured to generate image data based on the images captured by the plurality of imaging devices, the circuit substrate including an image processing substrate configured to generate the image data based on electric signals generated based on the images;

a chassis that holds the plurality of imaging devices; and

a heat transfer member arranged so as to contact the chassis and the image processing substrate inside the chassis.

11. The imaging unit as claimed in claim 10 wherein the chassis is subjected to a surface treatment to reduce solar light absorptance on a surface which is opposed to an installed member in a case where the imaging unit is installed on the installed member.

12. The imaging unit as claimed in claim 10 wherein the chassis is subjected to a surface treatment to increase a radiation rate on a surface other than a surface which is opposed to an installed member in a case where the imaging unit is installed on the installed member.

13. The imaging unit as claimed in claim 10 wherein an inner surface of the chassis is subjected to surface treatment to reduce a radiation rate.

14. The imaging unit as claimed in claim 10 wherein a material of the heat transfer member is aluminum.