ELECTRONIC DEVICE WITH LAMINATED STRUCTURE AND MANUFACTURING METHOD THEREOF
First Claim
1. A manufacturing method for an electronic device with a laminated structure, comprising the following steps of:
- disposing a solid-state adhesive layer between a first substrate and a second substrate; and
forming chemically linked chains between the solid-state adhesive layer and the first substrate and between the solid-state adhesive layer and the second substrate.
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Accused Products
Abstract
The present disclosure relates to an electronic device, and more particularly, to an electronic device with laminated structure and a manufacturing method thereof. The electronic device comprises: a first substrate; a second substrate; and a solid-state adhesive layer, wherein the adhesive layer is disposed between the first substrate and the second substrate. The solid-state adhesive layer reacts with the first substrate and the second substrate to form a chemically linked chain for bonding the first substrate and the second substrate. The present disclosure further selects a solid-state adhesive with both physical and chemical cohesiveness to laminate the two substrates; thereby making an electronic device more firm with higher shock resistance.
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Citations
11 Claims
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1. A manufacturing method for an electronic device with a laminated structure, comprising the following steps of:
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disposing a solid-state adhesive layer between a first substrate and a second substrate; and forming chemically linked chains between the solid-state adhesive layer and the first substrate and between the solid-state adhesive layer and the second substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification