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MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

  • US 20160009544A1
  • Filed: 07/14/2015
  • Published: 01/14/2016
  • Est. Priority Date: 03/02/2015
  • Status: Abandoned Application
First Claim
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1. A method of bonding an engineered substrate having first and second wafers bonded together, the first wafer having an isolation trench isolating an electrode region of the first wafer, the method comprising:

  • forming a redistribution layer on an integrated circuit (IC) wafer having an IC;

    forming a solder bump array on the redistribution layer; and

    solder bump bonding the engineered substrate with the IC wafer such that the first wafer of the engineered substrate is between the IC wafer and the second wafer of the engineered substrate,wherein a first solder bump of the solder bump array electrically contacts the electrode region of the first wafer.

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