ELECTRONIC SKIN, PREPARATION METHOD AND USE THEREOF

• US 20160011063A1
• Filed: 01/28/2014
• Published: 01/14/2016
• Est. Priority Date: 01/29/2013
• Status: Active Grant

• Current Assignee: Suzhou Institute of Nano-Tech and Nano-Bionics
• Original Assignee: Suzhou Institute of Nano-Tech and Nano-Bionics
• Inventors: Zhang, Ting, Wang, Xuewen, Xiong, Zuoping, Gu, Yang, Gu, Wen
• Granted Patent: US 9,816,882 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61B 1/00149 using articulated arms
• CPC Class Codes: A61B 2562/0204 Acoustic sensors
• CPC Class Codes: A61B 2562/0285 Nanoscale sensors
• CPC Class Codes: A61B 3/16 for measuring intraocular pressure, e.g. tonometers
• CPC Class Codes: A61B 34/30 Surgical robots
• CPC Class Codes: A61B 5/0205 Simultaneously evaluating both cardiovascular conditions and different types of body conditions, e.g. heart and respiratory condition
• CPC Class Codes: A61B 5/021 Measuring pressure in heart or blood vessels A61B5/0205 takes precedence
• CPC Class Codes: A61B 5/024 Detecting, measuring or recording pulse rate or heart rate A61B5/0205, A61B5/021 take precedence
• CPC Class Codes: A61B 5/11 Measuring movement of the entire body or parts thereof, e.g. head or hand tremor, mobility of a limb for measuring pulse A61B5/02 ;A61B5/1038 takes precedence; motion detection to correct for motion artifacts in physiological signals A61B5/721
• CPC Class Codes: A61B 5/4803 Speech analysis specially adapted for diagnostic purposes
• CPC Class Codes: B29C 41/02 for making articles of definite length, i.e. discrete articles
• CPC Class Codes: B29C 41/42 Removing articles from moulds, cores or other substrates B29C33/444 and B29C37/0017 take precedence
• CPC Class Codes: B29C 65/00 Joining or sealing of preformed parts , e.g. welding of plastics materials; Apparatus therefor general aspects of processes or apparatus for joining preformed parts B29C66/00; using porous material formed by internal pressure generated therein for joining preformed parts B29C44/1228, B29C44/326
• CPC Class Codes: B29K 2083/00 Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
• CPC Class Codes: B29K 2995/0003 having particular electrical or magnetic properties, e.g. piezoelectric
• CPC Class Codes: B29K 2995/0005 Conductive
• CPC Class Codes: B29L 2009/005 coated
• CPC Class Codes: B29L 2031/34 Electrical apparatus, e.g. sparking plugs or parts thereof
• CPC Class Codes: B29L 2031/7546 Surgical equipment
• CPC Class Codes: G01L 1/14 by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
• CPC Class Codes: G01L 1/18 : using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
• CPC Class Codes: G06F 3/041 : Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Abstract

The invention provides a piezoresistive electronic skin, a preparation method and a use thereof. The piezoresistive electronic skin uses carbon nanotube film as the conductive layer and uses materials provided with micro-nano patterns, such as polydimethylsiloxane, polyethylene terephthalate, polyvinyl alcohol, polyvinyl formal, polyethylene, and so on, as the substrate, enabling the substrate has advantages of high flexibility and being pliable, and it needs low operating voltage and little power consumption, but has high sensitivity and short response time. More importantly, the invention uses the patterned flexible substrate as the basis, greatly improving the sensitivity of electronic skin reacting to tiny applied force from outside. The invention also provides a capacitive electronic skin and a preparation method thereof. Further, the invention also provides a use of the piezoresistive electronic skin or the capacitive electronic skin on speech recognition, pulse detection, medical robot, etc.

Claims

1. A piezoresistive electronic skin, characterized by comprising:

a plurality of overlapped flexible substrates;

a conductive layer arranged on contact surface of adjacent flexible substrates, wherein at least one contact area of said conductive layer has non-planar structure; and

conductive electrodes electrically connected with said conductive layer.

3. The piezoresistive electronic skin according to claim 1,

characterized in that at least one of said flexible substrates is made of one or a combination of more of the following materials:

polydimethylsiloxane (PDMS) film, polyvinylidene fluoride (PVDF), polyvinyl fluoride (PVF), polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), polystyrene (PS), polymethyl methacrylate (PMMA), nylon (Nylon), polycarbonate (PC), polyurethane (PU), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET, PETE), and high-polymer rubber materials.

6. The piezoresistive electronic skin according to claim 1, characterized in that said conductive layer comprises a carbon nanotube film which comprises networks formed by cross-linked carbon nanotubes.

7. The piezoresistive electronic skin according to claim 6, characterized in that the light transmittance of said carbon nanotube film is between 50% and 97%, and the sheet resistance is between 102 Ω

/sq and 107 Ω

/sq.

8. The piezoresistive electronic skin according to claim 7, characterized in that the thickness of said carbon nanotube film is between 10 nm and 500 nm, said carbon nanotube film is made of one type or a combination of more types of single-walled carbon nanotubes, double-walled carbon nanotubes and multi-walled carbon nanotubes, wherein said single-walled carbon nanotubes are metallic single-walled carbon nanotubes, semiconductor-type carbon nanotubes or hybrid single-walled carbon nanotubes containing both metallic single-walled carbon nanotubes and semiconductor-type carbon nanotubes.

9. The piezoresistive electronic skin according to claim 1, characterized in that said conductive layer is made of one or a combination of more of any conductive metal among copper, silver and gold, and semiconductor materials.

10. The piezoresistive electronic skin according to claim 1, characterized in that said conductive layer is attached with organic polymer material on the surfaces, said organic polymer material is one or a combination of more of materials as follows:

polyvinylidene fluoride (PVDF), polyvinyl fluoride (PVF), polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), polystyrene (PS), polymethyl methacrylate (PMMA), nylon (Nylon), polycarbonate (PC), polyurethane (PU), polytetraflouroethylene (PTFE), polyethylene terephthalate (PET, PETE), polydimethylsiloxane (PDMS), and high-polymer rubber materials.

12. The piezoresistive electronic skin according to claim 1, characterized in that said conductive electrodes are made of one or a combination of more materials of gold, platinum, nickel, silver, indium, copper, carbon nanotube and graphene.

19. A use of the piezoresistive electronic skin according to claim 1 in detecting human pulse, cardiac pulsation, tension, breathing, intraocular pressure, vibration of muscle groups in the throat, speech recognition, muscle and skin movement caused by moving, blood pressure, and in medical robot, endoscopic robot system, surgery mechanical arm on the aspect of touching, sensing and protecting human organ.

2. (canceled)

11. (canceled)

13. A preparation method of the piezoresistive electronic skin, characterized by comprising steps as follows:

S1. preparing two patterned flexible substrates;

S2. preparing a solution for the conductive layer, respectively coating it to the patterned surfaces of the two flexible substrates to form conductive layers, assembling the conductive layers by making the patterned surfaces face to face to form a film device with the conductive layers being contacted with each other;

S3. forming upper, lower conductive electrodes respectively on the two conductive layers by conductive material, and leading wires from the conductive electrodes, thereby obtaining a piezoresistive electronic skin.

14. The preparation method of the piezoresistive electronic skin according to claim 13, characterized in that the solution for the conductive layer is a solution of carbon nanotubes, and the conductive layer is made of carbon nanotube film.

15. The preparation method of the piezoresistive electronic skin according to claim 13, characterized in that at least one layer of said flexible substrates is made of polydimethylsiloxane film, and said flexible substrates in said step S1 are prepared by steps as follows:

S11. degassing polydimethylsiloxane in vacuum for 1-30 minutes and coating it onto a template provided with patterns, wherein the polydimethylsiloxane has a thickness of 0.1 mm to 3 mm, and then heating it for more than 0.5 hour at a temperature of 50°

C. to 100°

C. to solidify and mold it;

S12. removing the solidified and molded polydimethylsiloxane from the template by ultrasound in organic solvent for 5 to 30 minutes.

16. The preparation method of the piezoresistive electronic skin according to claim 15, characterized in that said template is chosen from a silicon substrate provided with microstructure, a glass substrate provided with microstructure, a metallic substrate provided with microstructure, a plastic substrate, fabric or silk article provided with microstructure, and a bio-organ provided with microstructure;

said organic solvent may be methanol, ethyl alcohol and ethylene glycol.

17-18. -18. (canceled)

20. A capacitive electronic skin, characterized by comprising a flexible sensitive layer, at least one of an upper surface and a lower surface of said sensitive layer having non-planar structure, and an upper electrode layer and a lower electrode layer respectively formed on the upper surface and the lower surface of said sensitive layer, at least one of the upper surface and the lower surface of said upper electrode layer has non-planar structure, and/or at least one of the upper surface and the lower surface of said lower electrode layer has non-planar structure.

4. The piezoresistive electronic skin according to claim 23,

characterized in that at least one surface of said polydimethylsiloxane film is provided with patterns, the sizes of said patterns are between 0.1 and 500 μ

m, and the unit amount of said patterns in a square centimeter is between 1 and 1012.

5. The piezoresistive electronic skin according to claim 4, characterized in that said patterns are molded by coating said polydimethylsiloxane onto a template and solidifying it,

said template is anyone of a silicon substrate provided with microstructure, a glass substrate provided with microstructure, a metallic substrate provided with microstructure, a plastic substrate, fabric or silk article provided with microstructure, and a bio-organ provided with microstructure.

22. The capacitive electronic skin according to claim 20, characterized in that said sensitive layer is made of high molecular material, and said high molecular material is one or a combination of more of polydimethylsiloxane (PDMS), polyvinylidene fluoride (PVDF), polyvinyl fluoride (PVF), polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), polystyrene (PS), polymethyl methacrylate (PMMA), nylon (Nylon), polycarbonate (PC), polyurethane (PU), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET, PETE), and high-polymer rubber material, the thickness of said sensitive layer is in a range of 2-50 μ

m.

23. The capacitive electronic skin according to claim 22, characterized in that at least one surface of said sensitive layer is provided with patterns formed by coating said polydimethylsiloxane onto a template;

and

said template is anyone of a silicon substrate provided with microstructure, a glass substrate provided with microstructure, a metallic substrate provided with microstructure, a plastic substrate, fabric or silk article provided with microstructure, and a bio-organ provided with microstructure.

25. The capacitive electronic skin according to claim 20, characterized in that a flexible support layer is arranged between said sensitive layer and said lower electrode layer, or arranged on the lower surface of said lower electrode layer.

26. The capacitive electronic skin according to claim 25, characterized in that said support layer is made of one or a combination of more of polyethylene (PE) film, polyvinyl chloride (PVC) film and polyvinylidene chloride (PVDC) film with high-transparency and high-flexibility, the thickness of which is in a range of 1-100 μ

m.

28. The capacitive electronic skin according to claim 20, characterized in that the material of said upper electrode layer and said lower electrode layer is one or a combination of gold, platinum, nickel, silver, indium, copper, carbon nanotube, graphene, and silver nanowire.

37. A use of the capacitive electronic skin according to claim 20 in detecting arterial pulsation, cardiac pulsation, tension detection, breathing, intraocular pressure, vibration of muscle groups in the throat, speech recognition, muscle and skin movement caused by moving, blood pressure, and in medical robot, endoscopic robot system, surgery mechanical arm on the aspect of touching, sensing and protecting human organ.

21. (canceled)

24. (canceled)

27. (canceled)

29-31. -31. (canceled)

32. A preparation method of the capacitive electronic skin, characterized by comprising steps as follows:

S1. providing a template which is capable of being formed with said non-planar structure;

S2. coating an organic molecular layer on the surface of the template;

S3. forming a sensitive layer on the organic molecular layer;

S4. stripping the solidified sensitive layer from the template after heat-treating it;

S5. coating an upper electrode layer and a lower electrode layer respectively on the upper surface and the lower surface of the sensitive layer.

33. The preparation method of the capacitive electronic skin according to claim 32, characterized in that said template is anyone of a silicon substrate provided with microstructure, a glass substrate provided with microstructure, a metallic substrate provided with microstructure, a plastic substrate, fabric or silk article provided with microstructure, and a bio-organ provided with microstructure.

34. The preparation method of the capacitive electronic skin according to claim 32, comprising, after said step S3, arranging a support layer on said sensitive layer, and then coating the lower electrode layer on the lower surface of said support layer.

35. The preparation method of the capacitive electronic skin according to claim 32, comprising forming a sensitive layer on the lower surface of said lower electrode layer after said step S5.

36. The preparation method of the capacitive electronic skin according to claim 32, characterized in that said organic molecular layer is selected from trimethylchlorosilane and perfluorooctyl trichlorosilane.

38-46. -46. (canceled)