×

Pressure Profiling System

  • US 20160011074A1
  • Filed: 02/05/2014
  • Published: 01/14/2016
  • Est. Priority Date: 02/05/2013
  • Status: Active Grant
First Claim
Patent Images

1. A system comprising:

  • an object; and

    a pressure sensor node affixed to the object, the pressure sensor node comprising;

    a substrate;

    a set of pressure sensors mounted to the substrate;

    a processing component mounted to the substrate and operatively connected to the set of pressure sensors; and

    a wireless communications component mounted to the substrate and operatively connected to the processing component, wherein the pressure sensor node is affixed to the object in a manner that enables the set of pressure sensors to acquire data corresponding to a pressure at a set of locations on a surface of the object, and wherein the processing component is configured to receive data from the set of pressure sensors and communicate pressure data corresponding to the pressure at the set of locations to a computer system using the wireless communications component.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×