APPARATUS AND METHODS FOR PREDICTING WAFER-LEVEL DEFECT PRINTABILITY

• US 20160012579A1
• Filed: 08/10/2015
• Published: 01/14/2016
• Est. Priority Date: 05/06/2014
• Status: Active Grant

• Current Assignee: KLA-Tencor Corporation (KLA Corporation)
• Original Assignee: KLA-Tencor Corporation (KLA Corporation)
• Inventors: Shi, Rui-fang, Sezginer, Abdurrahman
• Granted Patent: US 9,547,892 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01N 2021/95676 Masks, reticles, shadow masks
• CPC Class Codes: G01N 21/956 Inspecting patterns on the surface of objects contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G06T 2207/10144 Varying exposure
• CPC Class Codes: G06T 2207/10152 Varying illumination
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/001 using an image reference approach

Abstract

Disclosed are methods and apparatus for qualifying a photolithographic reticle. A reticle inspection tool is used to acquire images at different imaging configurations from each of the pattern areas of a calibration reticle. A reticle near field is recovered for each of the pattern areas of the calibration reticle based on the acquired images from each pattern area of the calibration reticle. Using the recovered reticle near field for the calibration reticle, a lithography model for simulating wafer images is generated based on the reticle near field. Images are then acquired at different imaging configurations from each of the pattern areas of a test reticle. A reticle near field for the test reticle is then recovered based on the acquired images from the test reticle. The generated model is applied to the reticle near field for the test reticle to simulate a plurality of test wafer images, and the simulated test wafer images are analyzed to determine whether the test reticle will likely result in an unstable or defective wafer.

Claims

1. A method of qualifying a photolithographic reticle, the method comprising:

using an optical reticle inspection tool, acquiring a plurality of images at different imaging configurations from each of a plurality of pattern areas of a calibration reticle;

recovering a reticle near field for each of the pattern areas of the calibration reticle based on the acquired images from each pattern area of the calibration reticle;

using the recovered reticle near field for the calibration reticle, generating a lithography model for simulating a plurality of wafer images based on the reticle near field;

using an optical reticle inspection tool, acquiring a plurality of images at different imaging configurations from each of a plurality of pattern areas of a test reticle;

recovering a reticle near field for each of the pattern areas of the test reticle based on the acquired images from each pattern area of the test reticle;

applying the generated model to the reticle near field for the test reticle to simulate a plurality of test wafer images; and

analyzing the simulated test wafer images to determine whether the test reticle will likely result in an unstable or defective wafer.

2. The method of claim 1, wherein the reticle near field is recovered using a quasi-Newton or conjugate gradient technique for determining the reticle near field.

3. The method of claim 1, wherein the reticle near field is recovered by a regressive technique that minimizes a sum of a plurality of squared differences between the acquired images and a plurality of images that are calculated from the reticle near field.

4. The method of claim 1, wherein the reticle near field is recovered using a Hopkins approximation.

5. The method of claim 1, wherein the reticle near field is recovered without using a design database that was used to fabricate the reticle.

6. The method of claim 1, wherein the acquired images include at least three images that are acquired at different imaging conditions that are selected to result in a same reticle near field.

7. The method of claim 6, wherein the different process conditions include different focus settings, different illumination directions or patterns, different linear polarization for an entire illumination pupil or different parts of an illumination pupil, and/or different apodization settings to obscure different portions of a collection beam.

8. The method of claim 1, wherein the lithography model simulates a photolithography process, including the effect of a particular photoresist material.

9. The method of claim 1, wherein the lithography model is generated by comparing a plurality of wafer images resulting from the model with a plurality of reference images of a wafer that was fabricated using the calibration reticle and adjusting a plurality of model parameters of the model until a difference between the acquired and reference images is minimized.

10. The method of claim 1, wherein the calibration reticle is also used to calibrate an optical proximity correction model.

11. The method of claim 1, wherein the model is applied to the test reticle near field under a plurality of different lithography process conditions and analyzing the simulated test wafer images includes determining whether the test reticle will likely result in an unstable wafer under the different lithography process conditions by comparing the simulated test images having different process conditions and being associated with a same reticle area.

12. The method of claim 11, wherein the test reticle is determined to be unstable when comparing the simulated test images results in a difference above a predefined threshold.

13. The method of claim 12, wherein different reticle areas have different predefined thresholds.

14. The method of claim 1, further comprising repairing the test reticle, discarding the test reticle, or monitoring particular areas of a wafer that is fabricated with such test reticle based on a determination that the test reticle will likely result in an unstable or defective wafer.

15. The method of claim 1, wherein the simulated test images are analyzed by comparing the simulated test images to a plurality of images formed from the pre-OPC design database to determine whether the test reticle will likely result in an unstable or defective wafer.

16. An inspection system for qualifying a photolithographic reticle, the system comprising:

a light source for generating an incident beam;

an illumination optics module for directing the incident beam onto a reticle;

a collection optics module for directing an output beam from each pattern area of the reticle to at least one sensor;

at least one sensor for detecting the output beam and generating an image or signal based on the output beam; and

a controller that is configured to perform the following operations;

causing the acquiring of a plurality of images at different imaging configurations from each of a plurality of pattern areas of a calibration reticle;

recovering a reticle near field for each of the pattern areas of the calibration reticle based on the acquired images from each pattern area of the calibration reticle;

using the recovered reticle near field for the calibration reticle, generating a lithography model for simulating a plurality of wafer images based on the reticle near field;

causing the acquiring of a plurality of images at different imaging configurations from each of a plurality of pattern areas of a test reticle;

recovering a reticle near field for each of the pattern areas of the test reticle based on the acquired images from each pattern area of the test reticle;

applying the generated model to the reticle near field for the test reticle to simulate a plurality of test wafer images; and

analyzing the simulated test wafer images to determine whether the test reticle will likely result in an unstable or defective wafer.

17. The system of claim 16, wherein the reticle near field is recovered using a quasi-Newton or conjugate gradient technique for determining the reticle near field.

18. The system of claim 16, wherein the reticle near field is recovered by a regressive technique that minimizes a sum of a plurality of squared differences between the acquired images and a plurality of images that are calculated from the reticle near field.

19. The system of claim 16, wherein the reticle near field is recovered using a Hopkins phase approximation.

20. The system of claim 16, wherein the reticle near field is recovered without using a design database that was used to fabricate the reticle.

21. The system of claim 16, wherein the acquired images include at least three images that are acquired at different imaging conditions that are selected to result in a same reticle near field.

22. The system of claim 21, wherein the different process conditions include different focus settings, different illumination directions or patterns, different linear polarization for an entire illumination pupil or different parts of an illumination pupil, and/or different apodization settings to obscure different portions of a collection beam.

23. The system of claim 16, wherein the lithography model simulates a photolithography process, including the effect of a particular photoresist material.

24. The system of claim 16, wherein the lithography model is generated by comparing a plurality of wafer images resulting from the model with a plurality of reference images of a wafer that was fabricated using the calibration reticle and adjusting a plurality of model parameters of the model until a difference between the acquired and reference images is minimized.

25. The system of claim 16, wherein the calibration reticle is also used to calibrate an optical proximity correction model.

26. The system of claim 16, wherein the model is applied to the test reticle near field under a plurality of different lithography process conditions and analyzing the simulated test wafer images includes determining whether the test reticle will likely result in an unstable wafer under the different lithography process conditions by comparing the simulated test images having different process conditions and being associated with a same reticle area.

27. The system of claim 26, wherein the test reticle is determined to be unstable when comparing the simulated test images results in a difference above a predefined threshold.

28. The system of claim 27, wherein different reticle areas have different predefined thresholds.

29. The system of claim 16, wherein the simulated test images are analyzed by comparing the simulated test images to a plurality of images formed from the pre-OPC design database to determine whether the test reticle will likely result in an unstable or defective wafer.