CHIP COIL COMPONENT

• US 20160012957A1
• Filed: 03/25/2015
• Published: 01/14/2016
• Est. Priority Date: 07/14/2014
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: LIM, Bong Sup
• Application Number:
  US14/668,830
• Publication Number:
  US 20160012957A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/292 Surface mounted devices

Abstract

There is provided a chip coil component including: a ceramic body in which a plurality of ceramic layers are disposed and of which a bottom surface is provided as a mounting surface; a first external electrode disposed on one end surface of the ceramic body in a length direction of the ceramic body and a top surface and the bottom surface of the ceramic body; and a second external electrode disposed on the other end surface of the ceramic body in the length direction of the ceramic body and the bottom surface of the ceramic body.

Claims

1. A chip coil component comprising:

a ceramic body in which a plurality of ceramic layers are disposed and of which a bottom surface is provided as a mounting surface;

a first external electrode disposed on one end surface of the ceramic body in a length direction of the ceramic body and a top surface and the bottom surface of the ceramic body; and

a second external electrode disposed on the other end surface of the ceramic body in the length direction of the ceramic body and the bottom surface of the ceramic body.

2. The chip coil component of claim 1, wherein the first and second external electrodes are further disposed on both side surfaces of the ceramic body in a width direction of the ceramic body.

3. The chip coil component of claim 1, further comprising internal coil parts including a plurality internal coil patterns disposed to be connected to each other on the plurality of ceramic layers within the ceramic body,

wherein the internal coil parts are connected to the first and second external electrodes.

4. The chip coil component of claim 3, wherein a length of a portion of the the second external electrode disposed on the other surface of the ceramic body is less than a distance from the bottom surface of the ceramic body to an uppermost internal coil pattern.

5. The chip coil component of claim 1, wherein the ceramic body includes:

an active part, a capacitance forming part; and

first and second cover parts disposed above and below the active part in a thickness direction of the ceramic body, and

the second cover part is thicker than the first cover part.

6. The chip coil component of claim 5, wherein a ratio of a thickness of the first cover part and a thickness of the second cover part is 1:

3.

7. The chip coil component of claim 1, further comprising a marking pattern disposed on the top surface of the ceramic body.

8. A chip coil component comprising:

a ceramic body in which a plurality of ceramic layers are disposed and of which a bottom surface is provided as a mounting surface;

internal coil parts including a plurality of internal coil patterns disposed to be connected to each other on the plurality of ceramic layers within the ceramic body; and

first and second external electrodes disposed on both end surfaces of the ceramic body in a length direction of the ceramic body,

wherein the plurality of internal coil patterns include first and second lead portions exposed to the end surfaces of the ceramic body in the length direction of the ceramic body and connected to the first and second external electrodes, respectively,

a length of a portion of the first external electrode disposed on one end surface of the ceramic body is greater than a distance from the bottom surface of the ceramic body to the first lead portion, and

a length of a portion of the second external electrode disposed on the other end surface of the ceramic body is less than a distance from the bottom surface of the ceramic body to the second lead portion.

9. The chip coil component of claim 8, wherein the first and second external electrodes are further disposed on both side surfaces of the ceramic body in a width direction of the ceramic body.

10. The chip coil component of claim 8, wherein the ceramic body includes:

an active part, a capacitance forming part; and

first and second cover parts disposed above and below the active part in a thickness direction of the ceramic body, and

the second cover part is thicker than the first cover part.

11. The chip coil component of claim 10, wherein a ratio of a thickness of the first cover part and a thickness of the second cover part is 1:

3.

12. The chip coil component of claim 8, further comprising a marking pattern disposed on the top surface of the ceramic body.