WAVELENGTH CONVERSION ELEMENT AND METHOD FOR MANUFACTURING SAME, AND LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

• US 20160013368A1
• Filed: 02/04/2013
• Published: 01/14/2016
• Est. Priority Date: 02/13/2012
• Status: Abandoned Application

• Current Assignee: Konica Minolta Inc.
• Original Assignee: Konica Minolta Inc.
• Inventors: GOTO, Kenji
• Application Number:
  US14/377,649
• Publication Number:
  US 20160013368A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 23/296 Organo-silicon compounds
• CPC Class Codes: H01L 24/01 Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A light-emitting device for lighting or other applications where uniformity of color is sought, wherein, in order to reduce the incidence of color variation to an adequately usable degree, and improve the prevention of sulfuration and light-extraction efficiency, the light-emitting device is manufactured using a method having: a step for applying to a light-emitting element a fluorescent substance, swellable particles, inorganic particles, and a first mixture containing a first solvent; a subsequent step for applying and heating a translucent ceramic material and a second mixture containing a second solvent; and a subsequent step for applying and heating a silicone sealant.

Claims

1. A method for producing a light emitting device comprising:

a step for applying a first mixed liquid, which contains a fluorescer, swelling particles, inorganic particles, and a first solvent, onto a light emitting element,

a step for applying a second mixed liquid, which contains a light-transmissive ceramic material and a second solvent, onto the first mixed liquid and heating the second mixed liquid, and further

a step for applying a silicone sealing material onto the second mixed liquid and heating the silicone sealing material.

2. The method for producing a light emitting device according to claim 1, wherein the second mixed liquid contains water and/or inorganic particles.

3. The method for producing a light emitting device according to claim 1, wherein the inorganic particles are a metal oxide.

4. The method for producing a light emitting device according to claim 1, wherein the silicone sealing material is phenyl silicone.

5. A light emitting device produced by a method for producing a light emitting device according to claim 1.

6. A method for producing a wavelength conversion element comprising:

a step for applying a first mixed liquid, which contains a fluorescer, swelling particles, inorganic particles, and a first solvent, onto at last one surface of a light-transmissive substrate,

a step for applying a second mixed liquid, which contains a light-transmissive ceramic material and a second solvent, onto the first mixed liquid and heating the second mixed liquid, and further

a step for applying a silicone sealing material onto the second mixed liquid and heating the silicone sealing material.

7. The method for producing a wavelength conversion element according to claim 6, wherein the second mixed liquid contains water and/or inorganic particles.

8. The method for producing a wavelength conversion element according to claim 6, wherein the inorganic particles are a metal oxide.

9. The method for producing a wavelength conversion element according to claim 6, wherein the silicone sealing material is phenyl silicone.

10. A wavelength conversion element produced by a method for producing a wavelength conversion element according to claim 6.

11. A method for producing a light emitting device comprising a step for disposing the wavelength conversion element onto a light emitting side of a light emitting element,

the step being added to a method for producing a wavelength conversion element according to claim 6.

12. A light emitting device produced by the method for producing a light emitting device according to claim 11.