LIGHT EMITTING UNIT AND LIGHT EMITTING MODULE

• US 20160013384A1
• Filed: 09/01/2014
• Published: 01/14/2016
• Est. Priority Date: 07/14/2014
• Status: Abandoned Application

• Current Assignee: Genesis Photonics Inc.
• Original Assignee: Genesis Photonics Inc.
• Inventors: Ting, Shao-Ying, Huang, Kuan-Chieh, Huang, Jing-En, Huang, Yi-Ru, Wu, Sie-Jhan, Ke, Long-Lin
• Application Number:
  US14/474,277
• Publication Number:
  US 20160013384A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other

Abstract

A light emitting unit includes multiple light emitting dice, a molding compound, a substrate and a patterned metal layer. Each of the light emitting dice includes a light emitting component, a first electrode and a second electrode. The molding compound encapsulates the light emitting dice and exposes a first surface of the first electrode and a second surface of the second electrode of each of the light emitting dice. The molding compound is located between the substrate and the light emitting dice. The patterned metal layer is disposed on the first surface of the first electrode and the second surface of the second electrode of each of the light emitting dice. The light emitting dice are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection by the patterned metal layer.

Claims

1. A light emitting unit, comprising:

a plurality of light emitting dice, each of the light emitting dice comprising a light emitting component, a first electrode, and a second electrode, wherein the first electrode and the second electrode are disposed on the same side of the light emitting component, and a gap is set between the first electrode and the second electrode;

a molding compound, encapsulating the light emitting dice and exposing a first surface of the first electrode and a second surface of the second electrode of each of the light emitting dice;

a substrate, wherein the molding compound is located between the substrate and the light emitting dice, and the substrate is a substrate plate; and

a patterned metal layer, disposed on the first surface of the first electrode and the second surface of the second electrode of each of the light emitting dice, wherein the light emitting dice are electrically connected to each other in a series connection, a parallel connection, or a series-parallel connection through the patterned metal layer.

2. The light emitting unit as claimed in claim 1, wherein the molding compound has a lower surface, and the first surface of the first electrode and the second surface of the second electrode of each of the light emitting dice are aligned with the lower surface of the molding compound.

3. The light emitting unit as claimed in claim 1, wherein the molding compound comprises a transparent molding compound or a molding compound mixed with a phosphor.

4. The light emitting unit as claimed in claim 1, wherein each of the light emitting dice is a flip chip light emitting die.

5. The light emitting unit as claimed in claim 1, wherein the light emitting unit is a flip chip light emitting unit.

6. The light emitting unit as claimed in claim 1, wherein a material of the substrate comprises glass, a glass phosphorous material, ceramic, or sapphire.

13. The light emitting unit as claimed in claim 1, wherein the substrate is a rigid substrate.

7. A light emitting module, comprising:

a light emitting unit, comprising;

a plurality of light emitting dice, each of the light emitting dice comprising a light emitting component, a first electrode, and a second electrode, wherein the first electrode and the second electrode are disposed on the same side of the light emitting component, and a gap is set between the first electrode and the second electrode;

a molding compound, encapsulating the light emitting dice and exposing a first surface of the first electrode and a second surface of the second electrode of each of the light emitting dice;

a substrate, wherein the molding compound is located between the substrate and the light emitting dice, and the substrate is a substrate plate; and

a patterned metal layer, disposed on the first surface of the first electrode and the second surface of the second electrode of each of the light emitting dice, wherein the light emitting dice are electrically connected to each other in a series connection, a parallel connection, or a series-parallel connection through the patterned metal layer; and

an external circuit, disposed under the light emitting unit, wherein the light emitting unit is electrically connected with the external circuit through the patterned metal layer.

8. The light emitting module as claimed in claim 7, wherein the external circuit comprises a lead frame, a circuit substrate, or a printed circuit board.

9. The light emitting module as claimed in claim 7, wherein the external circuit comprises a carrier board, a first external contact point, and a second external contact point, and the light emitting unit is electrically connected with the first external contact point and the second external contact point respectively through the patterned metal layer.

10. The light emitting module as claimed in claim 7, wherein the external circuit comprises a carrier board and a patterned circuit layer corresponding to the patterned metal layer and disposed on the carrier board, and the light emitting unit is electrically connected with the patterned circuit layer through the patterned metal layer.

11. The light emitting module as claimed in claim 10, wherein the patterned metal layer and the patterned circuit layer are disposed conformally and correspondingly.

12. The light emitting module as claimed in claim 10, further comprising:

a heat dissipating component, disposed between the light emitting unit and the external circuit.

14. The light emitting module as claimed in claim 7, wherein the substrate is a rigid substrate.