SENSOR DEVICE WITH A FLEXIBLE ELECTRICAL CONDUCTOR STRUCTURE

• US 20160014884A1
• Filed: 07/06/2015
• Published: 01/14/2016
• Est. Priority Date: 07/09/2014
• Status: Active Grant

• Current Assignee: SCHREINER GROUP GMBH & CO. KG
• Original Assignee: Carmen Diegel
• Inventors: Diegel, Carmen, Seidl, Peter, Gepp, Sebastian, Weik, Thomas
• Granted Patent: US 10,098,223 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/097 Inks comprising nanoparticles and specially adapted for being sintered at low temperature H05K1/095 takes precedence
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/048 using a lift-off resist pattern or a release layer pattern
• CPC Class Codes: H05K 3/12 using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
• CPC Class Codes: H05K 3/1216 by screen printing or stencil printing
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/4632 laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

A sensor device for integration in an electrical circuit, including a support layer (12′), which is formed with a release layer; at least one flexible insulating layer (14′, 32), which is made using a printing method; and at least one flexible electrical conductor structure (20′, 34), which is applied with a printing method onto the insulating layer (14). The insulating layer (14′, 32) and the conductor structure (20′, 34) form a flexible unit, which is removable without damage from the support layer (12′).

Claims

1. A sensor device for integration into an electrical circuit, comprising:

a support layer (12′

), which is formed with a release layer;

at least one flexible insulating layer (14, 14′

, 32) produced by a printing method; and

at least one flexible electrical conductor structure (10, 20′

, 34), which is applied with a printing method onto the insulating layer (14),

wherein the insulating layer (14, 14′

, 32) and the conductor structure (10, 20′

, 34) form a flexible unit, wherein said flexible unit is removable without damage from the support layer (12).

2. The sensor device according to claim 1, wherein the insulating layer (14, 14′

, 32) and/or the conductor structure (20, 20′

, 34) is made with a print screen method.

3. The sensor device according to claim 1, further comprising an adhesive layer (22) for attachment to a substrate.

4. The sensor device according to claim 3, wherein the substrate is provided with a covering (24).

5. The sensor device according to claim 1, wherein the insulating layer (14, 14′

, 32) is made from a lacquer.

6. The sensor device according to claim 5, wherein the lacquer is a modified lacquer.

7. The sensor device according to claim 1, wherein the insulating layer is formed at least in regions as multi-layered.

8. The sensor device according to claim 1, wherein the conductor structure (20, 20′

, 32) is formed from a conductive printing material, wherein said conductive printing material is selected from the group consisting of copper, silver, a carbon bond, a conductive polymer structure, graphene, and/or a conductive dye of nano-particles.

9. The sensor device according to claim 1, wherein the insulating layer (32) is arranged between two electrical conductor structures (20′

, 34).

10. The sensor device according to claim 9, wherein the insulating layers (32) arranged between the two conductor structures (20′

, 34) have at least one recess (36), wherein the two conductor structures (20′

, 34) are electrically connected to one another via said at least one recess (36), wherein the at least one recess (36) is filled by at least one conductor structure (34).

11. A sensor device for integration into an electrical circuit, comprising:

at least one flexible insulating layer (14), which is produced according to a printing method; and

at least one flexible electrical conductor structure (20), which is applied according to a printing method onto the insulating layer (14);

wherein the insulating layer (14) and the conductor structure (10, 20′

, 34) form a substrate-free and support-free flexible unit.

12. The sensor device according to claim 11, wherein the insulating layer (14, 14′

, 32) and/or the conductor structure (20, 20′

, 34) is made according to a print screen method.

13. The sensor device according to claim 11, further comprising an adhesive layer (22) for attachment to a substrate.

14. The sensor device according to claim 13, wherein the substrate is provided with a covering (24).

15. The sensor device according to claim 11, wherein the insulating layer (14, 14′

, 32) is made from a lacquer.

16. The sensor device according to claim 15, wherein the lacquer is a modified lacquer.

17. The sensor device according to claim 11, wherein the insulating layer is formed at least in regions as multi-layered.

18. The sensor device according to claim 11, wherein the conductor structure (20, 20′

, 32) is formed from a conductive printing material, wherein said conductive printing material is selected from the group consisting of copper, silver, a carbon bond, a conductive polymer structure, graphene, and/or a conductive dye of nano-particles.

19. The sensor device according to claim 11, wherein the insulating layer (32) is arranged between two electrical conductor structures (20′

, 34).

20. The sensor device according to claim 19, wherein the insulating layers (32) arranged between the two conductor structures (20′

, 34) have at least one recess (36), wherein the two conductor structures (20′

, 34) are electrically connected to one another via said at least one recess (36), wherein the at least one recess (36) is filled by at least one conductor structure (34).