COMPOSITE SHEET, PRODUCTION METHOD THEREOF AND ELECTRONIC APPARATUS USING THE SAME

• US 20160016378A1
• Filed: 06/22/2015
• Published: 01/21/2016
• Est. Priority Date: 07/18/2014
• Status: Active Grant

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: OIKAWA, KAZUMA, KOHMYOHJI, DAIDO, SAKATANI, SHIGEAKI, TOYOTA, KEI
• Granted Patent: US 9,937,683 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B29C 65/02 by heating, with or without pressure
• CPC Class Codes: B29C 66/7294 Non woven mats, e.g. felt
• CPC Class Codes: B29C 66/73113 Thermal conductivity
• CPC Class Codes: B29C 66/7444 Carbon
• CPC Class Codes: B29K 2707/04 Carbon
• CPC Class Codes: B29K 2713/00 Use of textile products or fabrics for preformed parts, e.g. for inserts B29K2105/06 takes precedence
• CPC Class Codes: B29K 2715/003 Cellular or porous
• CPC Class Codes: B29L 2031/3481 Housings or casings incorporating or embedding electric or electronic elements
• CPC Class Codes: B32B 17/06 comprising glass as the main or only constituent of a layer, next to another layer of a specific material
• CPC Class Codes: B32B 2250/02 2 layers
• CPC Class Codes: B32B 2250/03 3 layers
• CPC Class Codes: B32B 2266/0228 Aromatic vinyl resin, e.g. styrenic (co)polymers
• CPC Class Codes: B32B 2266/0278 Polyurethane
• CPC Class Codes: B32B 2266/0285 Condensation resins of aldehydes, e.g. with phenols, ureas, melamines
• CPC Class Codes: B32B 2266/04 Inorganic
• CPC Class Codes: B32B 2266/057 Silicon-containing material, e.g. glass
• CPC Class Codes: B32B 2266/06 Open cell foam
• CPC Class Codes: B32B 2266/102 Nanopores, i.e. with average diameter smaller than 0.1 µm
• CPC Class Codes: B32B 2266/126 Aerogel, i.e. a supercritically dried gel
• CPC Class Codes: B32B 2305/22 Fibres of short length
• CPC Class Codes: B32B 2307/302 : Conductive
• CPC Class Codes: B32B 2307/304 : Insulating
• CPC Class Codes: B32B 2307/706 : Anisotropic
• CPC Class Codes: B32B 2313/04 : Carbon
• CPC Class Codes: B32B 2457/00 : Electrical equipment
• CPC Class Codes: B32B 2457/04 : Insulators
• CPC Class Codes: B32B 37/06 : characterised by the heating method
• CPC Class Codes: B32B 37/182 : one or more of the layers being plastic
• CPC Class Codes: B32B 5/022 : Non-woven fabric
• CPC Class Codes: B32B 5/026 : Knitted fabric
• CPC Class Codes: B32B 5/18 : characterised by features of a layer of foamed material
• CPC Class Codes: B32B 5/26 : another layer next to it also being fibrous or filamentary relative arrangement of fibres or filaments of different layers B32B5/12
• CPC Class Codes: B32B 7/027 : Thermal properties
• CPC Class Codes: B32B 7/03 : with respect to the orientation of features direction of fibres or filaments B32B5/12
• CPC Class Codes: B32B 7/04 : Interconnection of layers
• CPC Class Codes: B32B 9/007 : comprising carbon, e.g. graphite, composite carbon
• CPC Class Codes: B32B 9/047 : made of fibres or filaments
• CPC Class Codes: G06F 1/1656 : Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: H01L 23/36 : Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/373 : Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A composite sheet includes a graphite layer, a heat insulation layer including a fiber and a heat insulation material and a fiber layer located between the graphite layer and the heat insulation layer, wherein the fiber layer comprises the fiber. An electronic apparatus includes an electronic component that involves heat generation, a housing and the composite sheet, wherein the composite sheet is placed between the electronic component and the housing.

Claims

1. A composite sheet, comprising:

a graphite layer;

a heat insulation layer including a fiber and a heat insulation material; and

a fiber layer located between the graphite layer and the heat insulation layer, wherein the fiber layer comprises the fiber.

2. The composite sheet according to claim 1, wherein the fiber layer includes melted fiber.

3. The composite sheet according to claim 1, wherein the fiber and the fiber layer are integrated.

4. The composite sheet according to claim 1, wherein a recessed portion filled with the fiber layer is provided on a surface of the graphite layer.

5. The composite sheet according to claim 1, wherein the fiber is a nonwoven fabric.

6. The composite sheet according to claim 1, wherein the fiber has a diameter of 0.1 to 30 μ

m and a bulk density of 0.5 g/m³ or less.

7. The composite sheet according to claim 1, wherein the heat insulation material comprises silica aerogel.

8. The composite sheet according to claim 1, wherein the graphite layer is obtained by heat-treating film.

9. The composite sheet according to claim 1, wherein the graphite layer has a thickness of 0.1 mm or less, a heat conductivity in a surface direction of 1,000 W/m·

K or more, and a heat conductivity in a thickness direction of 20 W/m·

K or less; and

the heat insulation layer has a thickness within a range of 0.05 mm to 1 mm, and a heat conductivity within a range of 0.01 to 0.1 W/m·

K.

10. The composite sheet according to claim 1, further comprising:

a second graphite layer that is located on a surface of the heat insulation layer, the surface being opposite to the surface on which the graphite layer is located; and

a second fiber layer located between the second graphite layer and the heat insulation layer, wherein the second fiber layer comprises the fiber.

11. The composite sheet according to claim 1, further comprising insulation films on both surfaces of the composite sheet.

12. A method of producing the composite sheet of claim 1, comprising:

overlapping the graphite layer and the heat insulation layer;

then heating a side of the graphite layer to melt the fiber in the heat insulation layer that is present in a boundary face between the graphite layer and the heat insulation layer; and

cooling the fiber to laminate the graphite layer and the heat insulation layer.

13. An electronic apparatus, comprising:

an electronic component that generates heat;

a housing; and

the composite sheet according to claim 1, wherein the composite sheet is placed between the electronic component and the housing.